Renesas R1QDA3618CBG-19IB0
- Part No.:
- R1QDA3618CBG-19IB0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
R1QDA3618CBG-19IB0.pdf
- Description:
- STANDARD SRAM, 2MX18, 0.45NS
- Quantity:
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Inventory:955
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Product details
Overview
R1QDA3618CBG-19IB0 from Renesas Electronics is a 36-Mbit QDR™ II+ SRAM with 2,097,152-word × 18-bit organization, 4-word burst, read latency of 2.5 cycles, and on-die termination (ODT). It operates at up to 533 MHz (1.875 ns cycle time), uses 1.8 V core and 1.4–1.5 V I/O supplies, and targets high-bandwidth packet buffering in network switches and routers.
For engineers reviewing the R1QDA3618CBG-19IB0 datasheet, R1QDA3618CBG-19IB0 pinout, R1QDA3618CBG-19IB0 application, or R1QDA3618CBG-19IB0 equivalent, key selection criteria include confirmed ODT support, HSTL I/O compatibility, 165-pin FBGA (15 × 17 mm) package mapping, burst timing alignment with K/K̄ clocks, and QVLD-synchronized data capture for DDR-style interfaces.
Technical Context
This device implements synchronous quad data rate architecture with separate read/write data ports, dual-clock edge registration (K and K̄ rising edges for write data, CQ/CQ̄ for read data output timing), and integrated DLL for wide data valid window. It supports concurrent read/write transactions and uses burst-of-four addressing with internal address incrementing.
The R1QDA3618CBG-19IB0 features JTAG 1149.1 test access, programmable output impedance via ZQ calibration resistor, and ODT control with selectable Thevenin-equivalent termination (52–150 Ω). Its /DOFF pin enables DLL bypass for stable low-frequency operation, and QVLD provides half-cycle-advanced valid-data indication aligned to CQ/CQ̄ edges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2,097,152 × 18-bit organization) |
| Max Clock Frequency | 533 MHz - enables 1.066 GT/s effective data rate per data pin |
| Read Latency | 2.5 clock cycles - determines minimum delay between /R assertion and first valid Q output |
| Burst Length | 4 words - reduces address bus frequency by factor of 4 vs. single-word access |
| Supply Voltages | VDD = 1.7–1.9 V (core); VDDQ = 1.4–1.5 V (I/O) - mandates separate power domains |
| Package | 165-pin FBGA, 15 × 17 × 1.4 mm - requires precise PCB layout for signal integrity and thermal management |
| ODT Support | Yes, with selectable low/high range (52–105 Ω or 105–150 Ω Thevenin) - eliminates external termination resistors on data/address buses |
| QVLD Output | Edge-aligned with CQ/CQ̄, active half-cycle before first read data - simplifies high-speed receiver sampling logic |
Pinout & Package
Package: 165-ball plastic FBGA (15 mm × 17 mm, 1.4 mm height), RoHS-compliant, industrial temperature grade (−40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Input clock pair | Registers all address/control inputs on K rising edge; registers write data on both K and /K rising edges |
| /R, /W | Synchronous read/write strobes | Initiate burst read/write on K rising edge; /R takes precedence over /W when asserted simultaneously |
| /BW0, /BW1 | Byte write enable | Selects 9-bit byte lanes for 18-bit write - /BW0 controls D0–D8, /BW1 controls D9–D17 |
| Q0–Q17 | Synchronous data outputs | Deliver 18-bit read data aligned to CQ/CQ̄ rising edges; unused pins (Q18–Q35) are NC |
| D0–D17 | Synchronous data inputs | Accept 18-bit write data registered on K and /K rising edges; unused pins (D18–D35) are NC |
| ODT | On-die termination control | Configures termination resistance range (low/high) based on ZQ resistor value and logic level |
| ZQ | Output impedance calibration input | Connects to precision resistor (RQ) to set output driver and ODT impedance (RQ ≈ 5 × target Z₀) |
| QVLD | Valid data indicator output | Asserts one-half cycle before first Q word and deasserts one-half cycle before last Q word - enables precise latch timing |
| CQ, /CQ | Output echo clocks | Phase-matched to Q outputs; used as timing reference for external receivers instead of K/K̄ |
| VDD, VDDQ, VSS, VREF | Power and reference supplies | VDD (1.8 V core), VDDQ (1.4–1.5 V I/O), VSS (ground), VREF (VDDQ/2 reference for HSTL inputs) |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Enables true concurrent read and write operations without bus contention or arbitration overhead |
| HSTL-compatible I/O | Meets JEDEC HSTL Class I specifications for 1.5 V signaling - ensures interoperability with FPGA and ASIC memory controllers |
| Programmable output impedance | Calibrated via external ZQ resistor (250 Ω typical) - matches system trace impedance within ±15% tolerance |
| JTAG 1149.1 test access port | Supports boundary scan testing and in-system debugging without requiring additional test pads or probes |
| Four-tick burst addressing | Reduces external address bus frequency by 4× - lowers routing complexity and EMI in high-density PCB layouts |
| Clock-stop with μs restart | Enters low-power standby while preserving internal state; resumes full operation within microseconds upon clock restart |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Line-rate buffering of 10 GbE/40 GbE packet flows in Layer 2/3 switches and routers. IC Role / Device Role / Timing Role: Primary burst-access SRAM providing deterministic 533 MHz read/write throughput with zero wait states. Use Value: 2.5-cycle read latency and QVLD timing enable precise capture of back-to-back packets without FIFO overrun. |
Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE) with >1 GSPS sampling. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory buffer interfacing directly to FPGA-based signal processing pipelines. Use Value: Separate I/O ports and concurrent transaction capability eliminate read/write arbitration delays during mixed-mode test sequences. |
| Telecom Baseband Processing | Avionics Data Concentrators |
|
Use Scenario: Intermediate storage for LTE/5G baseband channel estimation and precoding matrices in remote radio units. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as coefficient cache for DSP accelerators with strict timing closure requirements. Use Value: On-die termination (ODT) and HSTL I/O ensure signal integrity across long traces in dense RF module PCBs. |
Use Scenario: ARINC 664 (AFDX) end-system data concentrator aggregating sensor streams in flight control computers. IC Role / Device Role / Timing Role: Deterministic latency memory supporting time-triggered communication protocols with guaranteed worst-case response. Use Value: Industrial temperature rating (−40°C to +85°C) and clock-stop capability meet DO-254 airborne hardware reliability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-533BZXC | Same 36-Mbit × 18-bit density, 533 MHz, 2.5-cycle latency, but no ODT; uses different pinout and lacks QVLD | Requires external termination resistors and external data-valid logic; less suitable for space-constrained ATE designs | Choose when legacy Cypress ecosystem compatibility is required and board-level termination is acceptable |
| AS7C33618B-533BIN | 533 MHz, 2.5-cycle latency, but only supports 1.5 V VDDQ (not 1.4 V); no JTAG or ZQ calibration | Limited voltage margin for low-noise I/O domains; no factory-calibrated output impedance tuning | Choose for cost-sensitive telecom line cards where VDDQ stability is tightly controlled and calibration is not needed |
Compared with CY7C2663KV18-533BZXC and AS7C33618B-533BIN, the R1QDA3618CBG-19IB0 uniquely integrates ODT, QVLD, and ZQ calibration-reducing BOM count, improving signal integrity margin, and simplifying timing closure in high-speed systems without sacrificing bandwidth or latency.
Availability
R1QDA3618CBG-19IB0 is available at Aetrix Electronics and suitable for network infrastructure, high-speed test instrumentation, telecom baseband processing, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for R1QDA3618CBG-19IB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power management, and high-performance memory solutions for industrial, automotive, and communications markets.
The R1QDA3618CBG-19IB0 belongs to Renesas' QDR™ II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput buffering in packet-switched networks and real-time signal processing systems.
FAQ
What is the maximum operating frequency and corresponding cycle time for R1QDA3618CBG-19IB0?
The R1QDA3618CBG-19IB0 supports a maximum clock frequency of 533 MHz, corresponding to a minimum cycle time of 1.875 ns. This specification is validated under industrial temperature conditions (−40°C to +85°C) and with proper power supply decoupling and signal integrity layout per Renesas' design guidelines. The R1QDA3618CBG-19IB0 achieves this performance using advanced CMOS process technology and integrated DLL circuitry.
Does R1QDA3618CBG-19IB0 support on-die termination (ODT), and how is it configured?
Yes, the R1QDA3618CBG-19IB0 includes on-die termination (ODT) with selectable low-range (52–105 Ω) or high-range (105–150 Ω) Thevenin-equivalent impedance. Configuration is controlled by the ODT pin level and the external ZQ resistor value (RQ). When ODT is enabled, its impedance tracks RQ per Renesas' published formulas - ensuring consistent termination without external components. This capability is confirmed in the device's ODT pin table and AC characteristics section.
What is the function of the QVLD pin on R1QDA3618CBG-19IB0, and how does it align with data output timing?
The QVLD (Q Valid) pin on R1QDA3618CBG-19IB0 indicates when output data on Q0–Q17 is valid. It asserts one-half clock cycle before the first read data word and deasserts one-half cycle before the last word in the 4-word burst. QVLD is edge-aligned with CQ and /CQ outputs - providing a precise, jitter-immune timing reference for external latches or FPGA capture logic. This feature is explicitly documented in the R1QDA3618CBG-19IB0's pin descriptions and timing diagrams.
What package type and dimensions does R1QDA3618CBG-19IB0 use, and what is its temperature grade?
The R1QDA3618CBG-19IB0 uses a 165-ball plastic FBGA package measuring 15 mm × 17 mm × 1.4 mm. It is rated for industrial temperature operation (−40°C to +85°C), as indicated by the "I" suffix in the part number's suffix "-19IB0". The "B0" denotes Pb-free compliance and tray packaging. This package is verified in Renesas' official ordering information and mechanical drawings.
How does the burst addressing scheme work in R1QDA3618CBG-19IB0, and what is its impact on system design?
The R1QDA3618CBG-19IB0 implements fixed four-word burst addressing: asserting /R or /W loads the SA address and automatically increments for subsequent words (A, A+1, A+2, A+3). This reduces external address bus toggling by 75%, lowering EMI and routing congestion. The burst order is fixed and non-interleaved - critical for deterministic latency in packet buffering applications. This behavior is defined in the device's bus cycle state diagram and truth tables.
R1QDA3618CBG-19IB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
R1QDA3618CBG-19IB0 FAQ
1.How can I place an order for R1QDA3618CBG-19IB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1QDA3618CBG-19IB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1QDA3618CBG-19IB0 reliable?
The price and inventory of R1QDA3618CBG-19IB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1QDA3618CBG-19IB0 is usually 5 days.
3.What payment methods are accepted for R1QDA3618CBG-19IB0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1QDA3618CBG-19IB0 transactions.
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Once your R1QDA3618CBG-19IB0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1QDA3618CBG-19IB0?
For technical support, including R1QDA3618CBG-19IB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1QDA3618CBG-19IB0 requirements.
6.How does Aetrix verify that R1QDA3618CBG-19IB0 is sourced from the original manufacturer or authorized distributors?
All R1QDA3618CBG-19IB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1QDA3618CBG-19IB0 meets industry standards.
7.What is the process for return or replacement of R1QDA3618CBG-19IB0?
All R1QDA3618CBG-19IB0 units undergo pre-shipment inspection (PSI). If there is an issue with R1QDA3618CBG-19IB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1QDA3618CBG-19IB0 part is unused and in its original packaging.
Return procedure for R1QDA3618CBG-19IB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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