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Renesas R1QDA3618CBG-20IB0

Part No.:
R1QDA3618CBG-20IB0
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixR1QDA3618CBG-20IB0.pdf
Description:
STANDARD SRAM, 2MX18, 0.45NS
Quantity:
Payment:
Payment
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Inventory:618

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Product details

Overview

R1QDA3618CBG-20IB0 from Renesas Electronics is a 36-Mbit QDR™ II+ SRAM with 2,097,152-word × 18-bit organization, 4-word burst, read latency of 2.0 cycles, on-die termination (ODT), and HSTL I/O interface. It operates at up to 500 MHz (2.0 ns cycle time) with 1.8 V core and 1.4–1.5 V I/O supplies, targeting high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the R1QDA3618CBG-20IB0 datasheet, R1QDA3618CBG-20IB0 pinout, R1QDA3618CBG-20IB0 application, or R1QDA3618CBG-20IB0 equivalent, key selection considerations include its 165-pin FBGA (15 × 17 mm) package, synchronous dual-port architecture with independent read/write data paths, ODT support for signal integrity at 500 MHz, and industrial temperature range (−40°C to +85°C).

Technical Context

This device implements a true synchronous quad data rate interface using K and /K input clocks for address/control/data registration, and delivers output data aligned to CQ and /CQ echo clocks. Its internal burst counter and full CMOS six-transistor memory cell enable concurrent read and write transactions without bus turnaround delay.

The R1QDA3618CBG-20IB0 integrates programmable output impedance via ZQ calibration, DLL-based timing control for wide data valid windows, and JTAG 1149.1 test access. ODT is enabled and configurable (low/high range) via the ODT pin, tracking external resistor RQ to provide Thevenin-equivalent termination of 52–150 Ω on input signals.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2,097,152 × 18)
Max Clock Frequency 500 MHz - enables 2 Gbps per data pin (DDR operation)
Read Latency 2.0 clock cycles - reduces pipeline delay for real-time packet forwarding
Supply Voltages VDD = 1.7–1.9 V (core); VDDQ = 1.4–1.5 V (I/O) - supports low-power, high-speed signaling
Burst Length 4-word burst - halves effective address bus frequency vs. single-word access
Package 165-pin FBGA (15 mm × 17 mm × 1.4 mm) - standard footprint for high-pin-count memory
Operating Temperature −40°C to +85°C (industrial grade) - qualified for telecom infrastructure environments
On-Die Termination Enabled (ODT) - eliminates external termination resistors, improves signal integrity at 500 MHz

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm, 1.4 mm height, Pb-free, RoHS-compliant (marking: R1QDA3618CBG-20IB0).

Pin/Terminal Circuit Role Design Meaning
K, /K Input clock pair Registers all address, control, and write data on rising edges; defines synchronous timing boundary
CQ, /CQ Output echo clock pair Edge-aligned with read data outputs; used by controller for precise data capture at 500 MHz
/R, /W Synchronous read/write strobes Initiate burst read or write on rising edge of K; mutually exclusive per cycle
SA[0:18] Synchronous address inputs 19-bit address bus latched on K rising edge; supports 2M-word addressing with internal burst increment
D[0:17] Write data inputs 18-bit parallel input path; registered on both K and /K rising edges during write burst
Q[0:17] Read data outputs 18-bit parallel output path; driven on CQ and /CQ edges; high-Z when not selected
/BW0, /BW1 Byte write enables Enable/disable writing to lower/upper 9-bit byte during 18-bit write; supports partial writes
ODT On-die termination control Selects ODT impedance range (52–105 Ω or 105–150 Ω) based on external RQ resistor
ZQ Impedance calibration reference Connect to ground via precision resistor (RQ ≈ 250 Ω) to calibrate output and ODT impedance
QVLD Data validity indicator Asserts half-cycle before first read data and deasserts half-cycle after last - simplifies receiver timing
VDD, VDDQ, VSS, VREF Power and reference supplies VDD (1.8 V core), VDDQ (1.4–1.5 V I/O), VSS (ground), VREF (VDDQ/2 reference for HSTL inputs)

Key Features

Feature Design Value
Quad Data Rate (QDR) II+ interface Enables 100% bus utilization with separate read/write ports - eliminates bus contention in full-duplex traffic buffers
Programmable ODT with ZQ calibration Eliminates external termination components and layout sensitivity; supports dynamic impedance matching across voltage/temperature
4-word burst with internal address counter Reduces address bus toggling by 75% vs. discrete addressing - lowers EMI and controller overhead
QVLD timing indicator Provides explicit, edge-aligned data validity window - removes need for complex receiver DLL tuning in FPGA-based systems
JTAG 1149.1 test access port Enables boundary-scan testing and in-system debug without additional test fixtures or probe points
Industrial temperature range (−40°C to +85°C) Qualified for deployment in uncontrolled environments such as outdoor base stations and carrier-grade switches

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-speed dual-port SRAM acting as shared buffer between ingress parser and egress scheduler, synchronized to line-rate clocks.

Use Value: 500 MHz operation and 4-word burst deliver 18 Gbps sustained bandwidth - meets 10GbE/40GbE line-rate buffering requirements.

Use Scenario: Frame buffering in SONET/SDH add-drop multiplexers and OTN transport equipment.

IC Role / Device Role / Timing Role: Synchronous memory supporting deterministic read-after-write latency for TDM cross-connect logic.

Use Value: 2.0-cycle read latency and ODT ensure jitter-free data capture at OC-192/STM-64 rates (9.953 Gbps).

Baseband Processing Buffer High-Frequency Trading Engine

Use Scenario: Temporary storage of IQ samples between digital downconverters and FFT engines in LTE/5G radio units.

IC Role / Device Role / Timing Role: Low-latency memory interfacing directly with FPGA fabric for real-time signal processing pipelines.

Use Value: Independent read/write ports allow simultaneous sample ingestion and FFT result retrieval - eliminates pipeline stalls.

Use Scenario: Ultra-low-latency order book updates and market data caching in co-located trading servers.

IC Role / Device Role / Timing Role: Deterministic-access SRAM serving as primary cache for FPGA-accelerated matching engines.

Use Value: Sub-2-ns cycle time and QVLD signal enable <10 ns total read latency - critical for sub-microsecond decision loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2663KV18-500BZXC Same density, 500 MHz, no ODT; uses CQ/CQ# only (no K/K# echo); 165-BGA but different pinout Lacks ODT and ZQ calibration - requires external termination and careful layout for >400 MHz operation Choose if legacy Cypress design reuse is required and board-level termination is acceptable
AS7C33618A-500BIN 500 MHz, 36-Mbit ×18, no ODT, no QVLD, supports only 2.5-cycle latency (not 2.0) No QVLD or ODT; higher read latency increases pipeline depth in real-time systems Choose for cost-sensitive applications where 2.0-cycle latency and signal integrity features are non-critical

Compared with CY7C2663KV18-500BZXC and AS7C33618A-500BIN, the R1QDA3618CBG-20IB0 uniquely delivers 2.0-cycle latency, integrated ODT, and QVLD - reducing PCB complexity and enabling tighter timing closure in 500 MHz FPGA interfaces.

Availability

R1QDA3618CBG-20IB0 is available at Aetrix Electronics and suitable for network switching, telecom infrastructure, FPGA-based signal processing, and ultra-low-latency financial computing requiring stable component supply across extended production lifecycles.

Supply support for R1QDA3618CBG-20IB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The R1QDA3618CBG-20IB0 belongs to Renesas' QDR™ II+ SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched networks and real-time signal processing systems.

FAQ

What is the maximum operating frequency of the R1QDA3618CBG-20IB0?

The R1QDA3618CBG-20IB0 is rated for a maximum clock frequency of 500 MHz, corresponding to a 2.0 ns minimum cycle time. This is validated under industrial temperature conditions (−40°C to +85°C) and specified with 1.8 V VDD and 1.4–1.5 V VDDQ. Operation at this speed requires proper PCB layout, controlled impedance routing, and adherence to setup/hold timing margins relative to K and /K clocks.

Does the R1QDA3618CBG-20IB0 support on-die termination (ODT)?

Yes, the R1QDA3618CBG-20IB0 includes on-die termination (ODT) on its address, control, and data input pins. ODT impedance is selectable between low-range (52–105 Ω) and high-range (105–150 Ω) via the ODT pin, and tracks the value of the external ZQ resistor. This eliminates the need for external termination resistors and improves signal integrity at 500 MHz.

What is the purpose of the QVLD pin on the R1QDA3618CBG-20IB0?

The QVLD (Q Valid) pin on the R1QDA3618CBG-20IB0 provides an edge-aligned indicator of valid read data output timing. It asserts half a clock cycle before the first data word and deasserts half a cycle after the last, synchronously with CQ and /CQ. This allows receiving logic (e.g., FPGA) to precisely gate data capture without relying solely on clock-to-data skew margins.

How is burst addressing handled in the R1QDA3618CBG-20IB0?

The R1QDA3618CBG-20IB0 implements fixed 4-word burst addressing internally. When /R or /W is asserted, the 19-bit SA[0:18] bus latches the base address; the internal counter then automatically increments for the next three words (A, A+1, A+2, A+3). No external address sequencing is required, reducing controller complexity and bus bandwidth usage by 75% compared to discrete addressing.

What package type and dimensions does the R1QDA3618CBG-20IB0 use?

The R1QDA3618CBG-20IB0 uses a 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 15 mm × 17 mm × 1.4 mm. It is Pb-free and RoHS-compliant, with marking "R1QDA3618CBG-20IB0" on the top surface. The ball pitch is 0.8 mm, and the package supports standard reflow soldering profiles for lead-free assembly.

R1QDA3618CBG-20IB0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

R1QDA3618CBG-20IB0 FAQ

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Please submit a Request for Quotation (RFQ) for R1QDA3618CBG-20IB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R1QDA3618CBG-20IB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1QDA3618CBG-20IB0 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1QDA3618CBG-20IB0 transactions.

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R1QDA3618CBG-20IB0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1QDA3618CBG-20IB0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1QDA3618CBG-20IB0?

For technical support, including R1QDA3618CBG-20IB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1QDA3618CBG-20IB0 requirements.

6.How does Aetrix verify that R1QDA3618CBG-20IB0 is sourced from the original manufacturer or authorized distributors?

All R1QDA3618CBG-20IB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1QDA3618CBG-20IB0 meets industry standards.

7.What is the process for return or replacement of R1QDA3618CBG-20IB0?

All R1QDA3618CBG-20IB0 units undergo pre-shipment inspection (PSI). If there is an issue with R1QDA3618CBG-20IB0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1QDA3618CBG-20IB0 part is unused and in its original packaging.

Return procedure for R1QDA3618CBG-20IB0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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