Renesas R1QDA7236ABG-22IB0
- Part No.:
- R1QDA7236ABG-22IB0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
R1QDA7236ABG-22IB0.pdf
- Description:
- STANDARD SRAM, 2MX36, 0.45NS
- Quantity:
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Product details
Overview
R1QDA7236ABG-22IB0 from Renesas Electronics is a 72-Mbit (2,097,152 × 36-bit) QDR™ II+ synchronous SRAM with on-die termination (ODT), 2.5-cycle read latency, and 450 MHz maximum operating frequency. It uses dual 1.8 V core (VDD) and 1.4–1.5 V I/O (VDDQ) supplies, features HSTL I/O, DLL-based timing control, and supports concurrent read/write operations via separate data ports. It is deployed in high-bandwidth network packet buffers and switch fabric memory subsystems.
For engineers reviewing the R1QDA7236ABG-22IB0 datasheet, R1QDA7236ABG-22IB0 pinout, R1QDA7236ABG-22IB0 application, or R1QDA7236ABG-22IB0 equivalent, key selection criteria include burst-of-4 DDR timing, ODT impedance programmability via ZQ, QVLD-valid-data indication, 165-pin FBGA (15 × 17 mm) package compatibility, and industrial temperature support (−40°C to +85°C).
Technical Context
This device implements a true quad-data-rate architecture with independent read and write data paths, using K and /K as primary input clocks and CQ and /CQ as echo clocks for precise data capture. Its internal burst counter and synchronous peripheral logic enable full bus utilization without turnaround cycles.
The R1QDA7236ABG-22IB0 integrates on-die termination (ODT) controlled by the ODT pin and calibrated against an external ZQ resistor, supporting Thevenin-equivalent termination ranges of 52–105 Ω (low range) or 105–150 Ω (high range). It also includes JTAG 1149.1 test access and DLL disable (/DOFF) for low-frequency operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2,097,152 words × 36 bits) - enables high-throughput buffering in 36-bit-wide datapaths. |
| Max Frequency | 450 MHz - delivers 3.6 Gbps per data pin (7.2 GB/s aggregate for 36-bit bus). |
| Read Latency | 2.5 clock cycles - determines minimum time from address registration to first valid output data. |
| Supply Voltages | VDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.5 V - dual-rail design reduces I/O switching noise and improves signal integrity. |
| Burst Length | 4-word burst - reduces address bus toggling frequency by 75% versus single-word access. |
| Package | 165-pin FBGA (15 mm × 17 mm × 1.4 mm) - standard footprint for high-density PCB layouts with thermal pad grounding. |
| Operating Temp | −40°C to +85°C - qualified for industrial-grade networking and telecom infrastructure. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free tray packaging.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Primary input clock pair | Registers all address/control inputs on rising edge of K; registers write data on both rising edges of K and /K. |
| CQ, /CQ | Output echo clocks | Tightly matched to Q outputs; used for data capture synchronization in high-speed receivers. |
| /R, /W | Read and write strobes | Active-low synchronous commands; initiate burst-of-4 transactions on rising edge of K. |
| SA[0:19] | Synchronous address bus | 20-bit address input registered on K rising edge; internally expanded to 22 bits for 4-word burst addressing. |
| D0–D35 | Write data inputs | 36-bit parallel input bus; sampled on two consecutive K and /K rising edges during WRITE cycle. |
| Q0–Q35 | Read data outputs | 36-bit parallel output bus; driven synchronously to CQ and /CQ (or K and /K if C/C# tied high). |
| /BW0–/BW3 | Byte write enables | Four independent active-low controls for selective 9-bit byte writes within 36-bit word. |
| ODT | On-die termination control | Selects ODT impedance range (low/high) or disables termination; tracks ZQ resistor value. |
| ZQ | Impedance calibration reference | Connected to precision resistor to ground; sets output driver and ODT impedance to 0.2×RQ (output) or 0.3×/0.6×RQ (ODT). |
| QVLD | Valid data indicator | Asserted half-cycle before first read data and deasserted half-cycle after last read data; edge-aligned with CQ. |
| VDD, VDDQ, VSS, VREF | Power and reference rails | VDD = 1.8 V core supply; VDDQ = 1.4–1.5 V I/O supply; VREF = VDDQ/2 reference for HSTL inputs. |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Enables concurrent read and write operations without bus turnaround delay - critical for full-duplex packet buffering. |
| Programmable output impedance | Calibrated via external ZQ resistor (250 Ω typical); ensures precise 30–60 Ω driver matching to PCB trace impedance. |
| On-die termination (ODT) | Configurable 52–150 Ω Thevenin termination on input pins; eliminates external resistors and improves signal integrity at 450 MHz. |
| QVLD data validity signal | Provides deterministic timing window for latch capture - removes need for complex strobe deskew circuitry in FPGA interfaces. |
| JTAG 1149.1 test port | Supports boundary-scan testing and in-system debug without requiring additional test pads or probes. |
Applications
| Packet Buffer Memory | Switch Fabric Interface |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with line-rate forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer with simultaneous read/write capability for cut-through and store-and-forward architectures. Use Value: 450 MHz operation and 4-word burst deliver 3.6 Gbps per pin bandwidth, enabling 10 GbE+ throughput without bottlenecks. | Use Scenario: Interfacing between traffic manager ASICs and crossbar switch fabrics in modular routers. IC Role / Device Role / Timing Role: Synchronous dual-port SRAM acting as arbitration queue and context memory for cell/packet scheduling logic. Use Value: QVLD and CQ echo clocks simplify timing closure in 450 MHz FPGA-to-SRAM interfaces, reducing setup/hold margin requirements. |
| Network Processor Cache | Telecom Line Card Buffer |
Use Scenario: Offloading packet classification and deep packet inspection results from multi-core NPU clusters. IC Role / Device Role / Timing Role: Low-latency scratchpad memory with deterministic 2.5-cycle read latency for real-time flow state storage. Use Value: Industrial temperature rating (−40°C to +85°C) and ODT support ensure stable operation in fanless, thermally constrained line cards. | Use Scenario: Buffering TDM-over-packet (TDMoP) payloads in SONET/SDH add-drop multiplexers. IC Role / Device Role / Timing Role: Burst-oriented memory for time-slot interleave/deinterleave and jitter buffering in framer interfaces. Use Value: 4-word burst mode reduces address bus activity by 75%, lowering EMI and power consumption in dense telecom modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-450BZXC | Same 72-Mbit ×36 density, 450 MHz, 2.5-cycle latency, but no ODT; uses different pinout and lacks QVLD. | Requires external termination resistors and manual data-valid timing generation; less suitable for space-constrained designs. | Choose when legacy Cypress-compatible layout exists and ODT/QVLD are not required. |
| AS7C36S2048A-450BIN | Lower speed (333 MHz), no ODT or QVLD, asynchronous interface; 2048-word ×36 organization differs fundamentally. | Not a drop-in replacement; incompatible timing model and control protocol; limited to non-critical buffering. | Consider only for cost-sensitive, lower-bandwidth applications where QDR timing is unnecessary. |
Compared with CY7C2663KV18-450BZXC and AS7C36S2048A-450BIN, the R1QDA7236ABG-22IB0 provides integrated ODT and QVLD - eliminating external components and simplifying high-speed timing closure - while maintaining identical density, speed, and industrial temperature compliance.
Availability
R1QDA7236ABG-22IB0 is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom infrastructure, and industrial embedded systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for R1QDA7236ABG-22IB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The R1QDA72 series belongs to Renesas' QDR™ II+ SRAM product line, engineered specifically for ultra-high-bandwidth, low-latency buffering in network switching, routing, and packet processing systems.
FAQ
What is the maximum operating frequency and read latency of the R1QDA7236ABG-22IB0?
The R1QDA7236ABG-22IB0 operates at up to 450 MHz with a fixed 2.5-cycle read latency. This means valid output data appears 2.5 clock cycles after the read command is registered on the K clock edge. The part number suffix "-22" directly indicates the 450 MHz speed bin and 2.5-cycle latency per Renesas' ordering nomenclature.
Does the R1QDA7236ABG-22IB0 support on-die termination (ODT), and how is it configured?
Yes, the R1QDA7236ABG-22IB0 supports ODT via the ODT pin and ZQ calibration resistor. When ODT is enabled, its Thevenin-equivalent resistance is set to either 0.3×RQ (low range: 52–105 Ω) or 0.6×RQ (high range: 105–150 Ω), depending on the logic level applied to the ODT pin. The R1QDA7236ABG-22IB0 datasheet specifies exact RQ tolerance ranges for each mode.
What is the function of the QVLD pin on the R1QDA7236ABG-22IB0, and how does it improve system timing?
The QVLD pin on the R1QDA7236ABG-22IB0 asserts one-half clock cycle before the first valid read data and deasserts one-half cycle after the last, providing a precise, edge-aligned enable signal for data capture. This eliminates setup/hold uncertainty in FPGA or ASIC receivers, significantly easing timing closure at 450 MHz - a key advantage over SRAMs lacking QVLD.
What package type and dimensions does the R1QDA7236ABG-22IB0 use, and is it RoHS-compliant?
The R1QDA7236ABG-22IB0 uses a 165-ball FBGA package measuring 15 mm × 17 mm × 1.4 mm with 0.8 mm ball pitch. It is Pb-free and RoHS-compliant (level 6/6), marked with "PB-F" per Renesas' packaging standard. The "BG" in the part number explicitly denotes this BGA variant.
How does the R1QDA7236ABG-22IB0 handle power-up initialization and clock stability requirements?
The R1QDA7236ABG-22IB0 requires strict power sequencing: VSS → VDD → VDDQ/VREF → inputs. After power stabilization, it needs ≥20 μs of stable K and /K clocks (or ≥1024 cycles below 180 MHz) before issuing commands. The /DOFF pin allows DLL bypass for low-frequency operation, and the device enters high-Z state automatically during power-up.
R1QDA7236ABG-22IB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
R1QDA7236ABG-22IB0 FAQ
1.How can I place an order for R1QDA7236ABG-22IB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1QDA7236ABG-22IB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R1QDA7236ABG-22IB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1QDA7236ABG-22IB0 is usually 5 days.
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6.How does Aetrix verify that R1QDA7236ABG-22IB0 is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of R1QDA7236ABG-22IB0?
All R1QDA7236ABG-22IB0 units undergo pre-shipment inspection (PSI). If there is an issue with R1QDA7236ABG-22IB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1QDA7236ABG-22IB0 part is unused and in its original packaging.
Return procedure for R1QDA7236ABG-22IB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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