Renesas R1QEA7218ABG-19IB0
- Part No.:
- R1QEA7218ABG-19IB0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
R1QEA7218ABG-19IB0.pdf
- Description:
- STANDARD SRAM, 4MX18, 0.45NS
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Inventory:618
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Product details
Overview
R1QEA7218ABG-19IB0 from Renesas Electronics is a 72-Mbit DDR II+ synchronous SRAM with 4,194,304-word × 18-bit organization, 2-word burst, 533 MHz max clock frequency, 2.5-cycle read latency, and on-die termination (ODT). It operates at 1.8 V core (VDD) and 1.4–1.5 V I/O (VDDQ), using HSTL I/O and DLL/PLL timing circuitry for high-speed data capture in network packet buffers.
For engineers reviewing the R1QEA7218ABG-19IB0 datasheet, R1QEA7218ABG-19IB0 pinout, R1QEA7218ABG-19IB0 application, or R1QEA7218ABG-19IB0 equivalent, this device supports precise DDR timing via K//K clocks, provides echo clocks (CQ//CQ) and QVLD for data-valid indication, and requires ZQ calibration for output impedance matching in high-speed memory subsystems.
Technical Context
This DDR II+ SRAM uses double-data-rate pipelined operation synchronized to rising edges of complementary K and /K clocks only-no C//C pins are present per R1QE series specification. Its internal burst counter and address registry support linear 2-word bursts with SA0/SA1 enabling random start addresses.
The device integrates on-die termination controlled by ODT pin and ZQ reference resistor, with ODT automatically enabled during input cycles and disabled during output cycles. DLL/PLL circuitry ensures wide data valid window and supports frequency scaling up to 533 MHz, while /DOFF allows DLL/PLL bypass for low-frequency operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit (4,194,304 × 18) |
| Max Clock Frequency | 533 MHz - defines maximum sustained throughput of 1.92 GB/s (2×18-bit × 533 MHz) |
| Read Latency | 2.5 cycles - determines minimum time from address load to first valid output data edge |
| Burst Length | 2 words - enables minimal transaction size for low-latency packet header access |
| Supply Voltages | VDD = 1.7–1.9 V (core); VDDQ = 1.4–1.5 V (I/O) - mandates separate power domains and sequencing |
| I/O Standard | HSTL Class I - requires VREF ≈ VDDQ/2 and matched trace impedance for signal integrity |
| ODT Support | Enabled - provides programmable Thevenin termination (52–150 Ω range) tracking ZQ resistor value |
Pinout & Package
Package: 165-ball FBGA (15 mm × 17 mm × 1.4 mm, ball pitch 0.8 mm), Pb-free, industrial temperature grade (−40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Input clock pair | Registers all control and data on rising edges; no C//C pins - K//K serve as both input and output timing reference |
| CQ, /CQ | Output echo clocks | Edge-aligned with DQ outputs; used for source-synchronous data capture without external delay lines |
| QVLD | Output valid indicator | Asserted half-cycle before first read data and deasserted half-cycle before last - enables precise latch window control |
| ODT | On-die termination control | High = high-range mode (105–150 Ω); low = low-range mode (52–105 Ω); floating = high-range mode |
| ZQ | Impedance calibration input | Connected to precision resistor to ground (RQ); sets DQ/CQ output impedance to 0.2×RQ and ODT to 0.3× or 0.6×RQ |
| /LD, R-/W, /BW0, /BW1 | Synchronous command inputs | Sampled on K rising edge; define burst address load, read/write direction, and byte-write enable per 9-bit nibble |
| SA0–SA16 | Synchronous address inputs | Registered on K rising edge; SA0/SA1 support random 2-word burst start within 18-bit data width |
| DQ0–DQ17 | Bi-directional data bus | Shared I/O for read/write; tri-stated when deselected or during write-to-read turnaround |
Key Features
| Feature | Design Value |
|---|---|
| DDR II+ Architecture | Eliminates need for external echo clock generation - K//K clocks drive both input registration and output timing |
| Programmable Output Impedance | ZQ-calibrated DQ/CQ drivers reduce signal reflections and improve eye margin on >500 MHz buses |
| Integrated ODT | Automatically enables termination during write cycles and disables during read cycles - eliminates external resistors and saves PCB area |
| QVLD Timing Signal | Provides deterministic, cycle-accurate data-valid window - simplifies FPGA/ASIC capture logic design |
| JTAG 1149.1 Test Access | Enables boundary-scan testing and debug without requiring additional test pads or probes |
Applications
| Network Packet Buffer | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory accessed by multiple ASICs via DDR II+ interface. Use Value: 2-word burst and 533 MHz clock enable sub-10 ns access to critical packet fields, reducing queuing delay. | Use Scenario: Buffering real-time voice and control data in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic read/write timing for TDM and packetized traffic. Use Value: QVLD and echo clocks eliminate setup/hold uncertainty, ensuring bit-error-free operation at OC-192 line rates. |
| Baseband Processor Cache | Industrial Real-Time Controller |
Use Scenario: L2 cache for LTE/5G baseband processors handling channel estimation and FFT buffers. IC Role / Device Role / Timing Role: Low-latency, burst-capable memory interfaced directly to DSP cores with DDR timing constraints. Use Value: On-die termination and DLL/PLL maintain signal integrity across wide temperature range (−40°C to +85°C) without layout tuning. | Use Scenario: Deterministic data logging and motion control buffering in CNC machines and PLCs. IC Role / Device Role / Timing Role: Industrial-grade SRAM delivering guaranteed timing margins under EMI-heavy factory environments. Use Value: HSTL I/O and VREF-referenced inputs reject common-mode noise, sustaining 533 MHz operation despite 60 Hz harmonics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT 72T36115L10BQI | 36-bit × 2M organization; 10 ns access time; no ODT; LVDS I/O; 3.3 V supply | Higher density but incompatible voltage/I/O standard; suited for legacy telecom backplanes | Select only if system uses 3.3 V LVDS and requires 36-bit width - not drop-in compatible |
| Cypress CY7C2665KV18 | 72-Mbit DDR II+ SRAM; same 18-bit × 4M organization; 533 MHz; ODT; but commercial temp (0°C to 70°C) | Lacks industrial temperature rating; identical pinout and AC timing - differs only in qualification and marking | Use where ambient temperature stays below 70°C and RoHS-6 compliance is sufficient |
Compared with IDT 72T36115L10BQI and Cypress CY7C2665KV18, R1QEA7218ABG-19IB0 uniquely combines industrial temperature operation, HSTL I/O, and ZQ-calibrated ODT in a 165-ball FBGA - enabling robust, high-density memory subsystems without external termination or level-shifting components.
Availability
R1QEA7218ABG-19IB0 is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, and industrial real-time controllers requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.
Supply support for R1QEA7218ABG-19IB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The R1QEA72 series targets high-speed networking and communications equipment, delivering DDR II+ SRAMs optimized for deterministic latency, signal integrity at >500 MHz, and industrial reliability without external timing components.
FAQ
What is the maximum operating frequency of the R1QEA7218ABG-19IB0?
The R1QEA7218ABG-19IB0 supports a maximum clock frequency of 533 MHz, corresponding to a minimum cycle time of 1.875 ns. This rating is validated under industrial temperature conditions (−40°C to +85°C) and requires strict adherence to VDD/VDDQ supply sequencing and HSTL signal integrity guidelines. The device achieves this speed using integrated DLL/PLL circuitry and echo clocks (CQ//CQ) for source-synchronous data capture.
Does the R1QEA7218ABG-19IB0 support on-die termination (ODT)?
Yes, the R1QEA7218ABG-19IB0 includes on-die termination (ODT) controlled by the ODT pin and calibrated via the ZQ pin. When enabled, ODT provides programmable Thevenin termination (52–150 Ω) that tracks the external ZQ resistor value. For R1QEA7218ABG-19IB0, ODT is automatically activated during write cycles and deactivated during read cycles - eliminating the need for external termination resistors on the data bus.
What is the function of the QVLD pin on the R1QEA7218ABG-19IB0?
The QVLD (Q Valid) pin on the R1QEA7218ABG-19IB0 is an output signal that indicates when read data on DQ0–DQ17 is valid. It asserts half a clock cycle before the first data word and deasserts half a cycle before the last, aligning precisely with CQ//CQ edges. This enables FPGA or ASIC receivers to open and close their capture windows deterministically - a key feature for reliable high-speed data acquisition without complex deskew logic.
What package type and dimensions does the R1QEA7218ABG-19IB0 use?
The R1QEA7218ABG-19IB0 uses a 165-ball fine-pitch ball grid array (FBGA) package measuring 15 mm × 17 mm × 1.4 mm with 0.8 mm ball pitch. It is Pb-free and qualified for industrial temperature operation (−40°C to +85°C). The package marking includes "R1QEA7218ABG-19IB0 PB-F" to indicate RoHS-6 compliance and industrial grade, and it requires reflow soldering per J-STD-020 moisture sensitivity level 3.
How does the R1QEA7218ABG-19IB0 handle clock initialization and DLL/PLL locking?
The R1QEA7218ABG-19IB0 requires a 20 µs clock stabilization period after VDDQ and VREF reach regulation, during which K and /K must run continuously. Unlike earlier QDR-II devices, it does not require C//C clocks - K//K serve as both input and output timing references. If /DOFF is held high, the internal DLL/PLL locks automatically; if /DOFF is low, DLL/PLL is bypassed for stable low-frequency operation (<120 MHz), but full-speed performance requires /DOFF high and valid ZQ calibration.
R1QEA7218ABG-19IB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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- Supplier Device Package:
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R1QEA7218ABG-19IB0 FAQ
1.How can I place an order for R1QEA7218ABG-19IB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1QEA7218ABG-19IB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1QEA7218ABG-19IB0 reliable?
The price and inventory of R1QEA7218ABG-19IB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1QEA7218ABG-19IB0 is usually 5 days.
3.What payment methods are accepted for R1QEA7218ABG-19IB0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1QEA7218ABG-19IB0 transactions.
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R1QEA7218ABG-19IB0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1QEA7218ABG-19IB0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1QEA7218ABG-19IB0?
For technical support, including R1QEA7218ABG-19IB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1QEA7218ABG-19IB0 requirements.
6.How does Aetrix verify that R1QEA7218ABG-19IB0 is sourced from the original manufacturer or authorized distributors?
All R1QEA7218ABG-19IB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1QEA7218ABG-19IB0 meets industry standards.
7.What is the process for return or replacement of R1QEA7218ABG-19IB0?
All R1QEA7218ABG-19IB0 units undergo pre-shipment inspection (PSI). If there is an issue with R1QEA7218ABG-19IB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1QEA7218ABG-19IB0 part is unused and in its original packaging.
Return procedure for R1QEA7218ABG-19IB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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