Renesas R1QEA7236ABB-20IB0
- Part No.:
- R1QEA7236ABB-20IB0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
R1QEA7236ABB-20IB0.pdf
- Description:
- STANDARD SRAM, 2MX36, 0.45NS
- Quantity:
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Inventory:341
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Product details
Overview
R1QEA7236ABB-20IB0 from Renesas Electronics is a 72-Mbit DDR II+ synchronous SRAM with 2,097,152-word × 36-bit organization, 2.5-cycle read latency, 500 MHz max clock frequency (2 ns cycle time), and HSTL I/O interface operating at 1.5 V VDDQ. It delivers pipelined double data rate operation in a 165-ball FBGA (13 × 15 × 1.4 mm) for high-bandwidth memory buffering in network packet processors.
For engineers reviewing the R1QEA7236ABB-20IB0 datasheet, R1QEA7236ABB-20IB0 pinout, R1QEA7236ABB-20IB0 application, or R1QEA7236ABB-20IB0 equivalent, this device requires attention to its DDR II+ burst timing, ODT-enabled termination control, QVLD-valid-data signaling, and industrial-temperature (−40°C to +85°C) operation under 1.8 V core supply.
Technical Context
This DDR II+ SRAM uses dual-edge clocking on K and /K for address/control latching and data capture, with no separate C/C̅ pins-unlike QDR II devices. Its DLL/PLL circuitry enables wide output data valid windows and supports future frequency scaling up to 500 MHz.
The device implements on-die termination (ODT) controlled by the ODT pin and ZQ calibration resistor, supporting Thevenin-equivalent termination ranges of 52–105 Ω (low range) or 105–150 Ω (high range). QVLD provides half-cycle-advanced valid-data indication edge-aligned with CQ and /CQ outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 72 Mbit (2,097,152 × 36) |
| Interface Type | DDR II+ synchronous interface with common I/O bus |
| Max Clock Frequency | 500 MHz - supports 2 ns cycle time for high-throughput buffering |
| Read Latency | 2.5 cycles - determines minimum delay between address load and first valid output |
| VDD / VDDQ | 1.8 V core / 1.4–1.5 V I/O - enables low-power, high-speed operation with HSTL compatibility |
| Burst Length | 2-word burst - minimizes transaction overhead for small-packet applications |
| Operating Temperature | −40°C to +85°C - qualified for industrial embedded systems |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, Pb-free, RoHS-compliant (BB suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Input clock pair | Registers all inputs and data on rising edges; defines timing reference for DDR operation |
| CQ, /CQ | Output echo clocks | Tightly matched to DQ outputs; used as data valid timing references in high-speed capture |
| QVLD | Output valid indicator | Asserts half-cycle before first read data and deasserts half-cycle before last - simplifies receiver synchronization |
| ODT | On-die termination control | Selects termination impedance range (low/high/floating); enables dynamic bus termination during reads |
| ZQ | Impedance calibration input | Connects to precision resistor to ground; sets DQ/CQ output impedance and ODT tracking |
| /LD, R-/W, /BW0–/BW3 | Synchronous control inputs | Define burst address load, read/write direction, and per-byte write enable for 36-bit data bus |
| SA0–SA10 | Synchronous address inputs | Latched on K rising edge; SA0/SA1 support random burst start address for ×36 configuration |
| DQ0–DQ35 | Bi-directional data I/O | 36-bit common bus; data registered on both K and /K rising edges for DDR transfer |
Key Features
| Feature | Design Value |
|---|---|
| DDR II+ architecture | Enables 2-word burst transfers at 500 MHz using single K//K clock pair - eliminates need for separate C/C̅ clocks |
| On-die termination (ODT) | Reduces signal reflections on high-speed buses; dynamically enabled during read cycles without external resistors |
| QVLD timing indicator | Provides deterministic, edge-aligned valid-data window - removes setup/hold uncertainty for FPGA/capture logic |
| Programmable output impedance | Calibrated via ZQ pin and external resistor; matches system trace impedance within ±15% tolerance |
| Industrial temperature grade | Guaranteed operation from −40°C to +85°C - suitable for telecom infrastructure and industrial controllers |
Applications
| Packet Buffering in Network Switch ASICs | High-Speed Data Acquisition Front-Ends |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switch fabric. IC Role / Device Role / Timing Role: Low-latency, burst-mode SRAM buffer interfacing directly to SerDes MAC logic with precise DDR timing alignment. Use Value: 2.5-cycle latency and QVLD-synchronized output reduce FIFO depth requirements and simplify timing closure in 10G+ designs. | Use Scenario: Capturing real-time sensor streams from ADCs sampling at ≥200 MSPS in test equipment. IC Role / Device Role / Timing Role: High-bandwidth, low-jitter memory buffer accepting DDR data bursts aligned to system clock domain. Use Value: 500 MHz clock support and HSTL I/O ensure clean signal integrity at >1 Gbps sustained throughput. |
| Baseband Processing in Wireless Base Stations | Real-Time Video Frame Buffering |
Use Scenario: Temporary storage of OFDM symbol data between FFT/IFFT stages in LTE/5G PHY layer processing. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as ping-pong buffer with deterministic 2-word access pattern. Use Value: On-die termination and programmable impedance eliminate board-level termination components and improve signal fidelity at 400+ MHz. | Use Scenario: Line-buffering uncompressed HD video frames (1080p60) in broadcast encoder pipelines. IC Role / Device Role / Timing Role: Dual-port-capable DDR II+ SRAM providing simultaneous read/write access via burst interleaving. Use Value: 72-Mbit density and 36-bit bus width deliver 2.88 Gbps effective bandwidth - sufficient for 4:2:2 YUV at 160 MHz pixel clock. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT 72T36115L10BQI | Same 72-Mbit ×36 DDR II+, but 10 ns min cycle time (100 MHz); no ODT; commercial temp only (0°C to 70°C) | Limited to lower-frequency control-plane buffers; lacks industrial temp and termination for high-speed links | Choose only if cost sensitivity outweighs speed, ODT, and temperature requirements |
| Cypress CY7C2663KV18-500BZXC | QDR II+ variant with separate I/O; 500 MHz, 2.5-cycle latency, but requires C/C̅ clocks and has different pinout | Requires additional clock routing and layout changes; not drop-in compatible due to C/C̅ and ODT absence | Select when QDR's higher bandwidth justifies redesign; avoid for DDR II+ footprint retention |
Compared with IDT 72T36115L10BQI and Cypress CY7C2663KV18-500BZXC, the R1QEA7236ABB-20IB0 uniquely combines 500 MHz DDR II+ operation, industrial temperature rating, integrated ODT, and QVLD timing aid - enabling robust, high-density buffering without external termination or complex clock management.
Availability
R1QEA7236ABB-20IB0 is available at Aetrix Electronics and suitable for network packet buffering, baseband processing, high-speed data acquisition, and real-time video frame storage requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for R1QEA7236ABB-20IB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The R1QEA72 series is part of Renesas' high-performance DDR II+ SRAM product line, designed specifically for low-latency, high-bandwidth buffering in networking, telecom, and test equipment where deterministic timing and signal integrity are critical.
FAQ
What is the maximum operating frequency and corresponding cycle time for R1QEA7236ABB-20IB0?
R1QEA7236ABB-20IB0 supports a maximum clock frequency of 500 MHz, corresponding to a minimum cycle time of 2.0 ns. This specification is validated under industrial temperature conditions (−40°C to +85°C) with VDD = 1.8 V and VDDQ = 1.5 V, and assumes proper DLL/PLL lock and stable K//K clock signals meeting jitter and duty cycle requirements per the datasheet.
Does R1QEA7236ABB-20IB0 support on-die termination (ODT), and how is it configured?
Yes, R1QEA7236ABB-20IB0 supports ODT via the dedicated ODT pin and ZQ calibration input. When ODT is enabled (ODT pin high), it selects a high-range Thevenin termination (105–150 Ω); when low, it selects low-range (52–105 Ω). The actual resistance tracks the ZQ-set value (RQ), and ODT is automatically activated during read operations on the common I/O bus - no software control required.
What is the function of the QVLD pin on R1QEA7236ABB-20IB0, and how does it aid system timing?
The QVLD pin on R1QEA7236ABB-20IB0 is a synchronous output that asserts half a clock cycle before the first valid read data appears on DQ and deasserts half a cycle before the last valid data. Edge-aligned with CQ and /CQ, QVLD provides unambiguous, jitter-immune indication of the data valid window - eliminating setup/hold margin uncertainty in FPGA or ASIC capture logic and reducing timing closure effort.
What package type and dimensions does R1QEA7236ABB-20IB0 use, and is it RoHS-compliant?
R1QEA7236ABB-20IB0 uses a 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 13 mm × 15 mm × 1.4 mm. The BB suffix confirms the 13×15 mm footprint and Pb-free construction. It meets RoHS Directive 2011/65/EU (6/6 compliance) and is marked with "PB-F" for Pb-free identification per Renesas marking conventions.
How does the burst length and latency of R1QEA7236ABB-20IB0 impact its use in real-time systems?
R1QEA7236ABB-20IB0 implements a fixed 2-word burst length with 2.5-cycle read latency, minimizing transaction overhead and guaranteeing predictable access timing. In real-time systems like packet switching or video buffering, this ensures deterministic worst-case latency for every read - critical for deadline-constrained scheduling and eliminating variable pipeline stalls caused by longer or configurable bursts.
R1QEA7236ABB-20IB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
R1QEA7236ABB-20IB0 FAQ
1.How can I place an order for R1QEA7236ABB-20IB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1QEA7236ABB-20IB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1QEA7236ABB-20IB0 reliable?
The price and inventory of R1QEA7236ABB-20IB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1QEA7236ABB-20IB0 is usually 5 days.
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Once your R1QEA7236ABB-20IB0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1QEA7236ABB-20IB0?
For technical support, including R1QEA7236ABB-20IB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1QEA7236ABB-20IB0 requirements.
6.How does Aetrix verify that R1QEA7236ABB-20IB0 is sourced from the original manufacturer or authorized distributors?
All R1QEA7236ABB-20IB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1QEA7236ABB-20IB0 meets industry standards.
7.What is the process for return or replacement of R1QEA7236ABB-20IB0?
All R1QEA7236ABB-20IB0 units undergo pre-shipment inspection (PSI). If there is an issue with R1QEA7236ABB-20IB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1QEA7236ABB-20IB0 part is unused and in its original packaging.
Return procedure for R1QEA7236ABB-20IB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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