Renesas R1QEA7236ABG-20IB0

Overview

R1QEA7236ABG-20IB0 from Renesas Electronics is a 72-Mbit DDR II+ synchronous SRAM with 2,097,152-word × 36-bit organization, 2.5-cycle read latency, 500 MHz max clock frequency, HSTL I/O interface, and on-die termination (ODT). It operates at 1.8 V core (VDD) and 1.4–1.5 V I/O (VDDQ), and is used in high-bandwidth packet buffering and network switch data path memory subsystems.

For engineers reviewing the R1QEA7236ABG-20IB0 datasheet, R1QEA7236ABG-20IB0 pinout, R1QEA7236ABG-20IB0 application, or R1QEA7236ABG-20IB0 equivalent, key selection criteria include burst length = 2, ODT support with programmable impedance, QVLD timing indicator, 165-pin FBGA (15 × 17 mm), and industrial temperature range (−40°C to +85°C).

Technical Context

This device implements a synchronous double-data-rate architecture using K and /K input clocks for all register latching-address, control, and data-with no C/C̅ pins (DDR II+ variant). Its DLL/PLL circuitry enables wide output data valid window and supports future frequency scaling up to 500 MHz.

The R1QEA7236ABG-20IB0 uses common I/O bus architecture with byte-write capability via /BW0–/BW3, JTAG 1149.1 test access, and QVLD output aligned with CQ/C̅Q to indicate valid read data timing. ODT activation is automatic during write cycles and disabled during reads.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, Pb-free, industrial-grade marking (suffix "I" denotes −40°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II+ SRAM applications.

Compared with IDT 72T3652L15PF and Cypress CY7C2665KV18-500BZI, the R1QEA7236ABG-20IB0 uniquely combines QVLD timing indication, industrial-temperature ODT support, and strict DDR II+ common-I/O compliance in a single package-enabling simpler, more robust high-speed data capture in networking and telecom designs.

Availability

R1QEA7236ABG-20IB0 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial real-time control applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant industrial-temperature operation.

Supply support for R1QEA7236ABG-20IB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The R1QEA72 series targets high-performance memory subsystems in networking and communications equipment, designed specifically for DDR II+ synchronous operation with ODT, QVLD, and industrial reliability.

FAQ

What is the maximum operating frequency of the R1QEA7236ABG-20IB0?

The R1QEA7236ABG-20IB0 is rated for a maximum clock frequency of 500 MHz, corresponding to a 2.0 ns cycle time. This specification is guaranteed over the full industrial temperature range (−40°C to +85°C) and under specified VDD (1.7–1.9 V) and VDDQ (1.4–1.5 V) conditions. Operation above this frequency is not supported and may result in timing violations or data corruption.

Does the R1QEA7236ABG-20IB0 support on-die termination (ODT)?

Yes, the R1QEA7236ABG-20IB0 includes on-die termination (ODT) controlled by the ODT pin. It supports two impedance ranges: low (52–105 Ω) when ODT is low, and high (105–150 Ω) when ODT is high. In common-I/O DDR II+ mode, ODT is automatically enabled during write cycles and disabled during read cycles-no external control logic is required for basic operation.

What is the function of the QVLD pin on the R1QEA7236ABG-20IB0?

The QVLD (Q Valid) pin on the R1QEA7236ABG-20IB0 is an output that indicates when read data on DQ[0:35] is valid. It asserts half a clock cycle before the first data word and deasserts half a cycle after the last, aligning precisely with CQ and /CQ edges. This eliminates timing uncertainty in FPGA or ASIC capture logic and reduces required setup/hold margins in high-speed designs.

What package type and dimensions does the R1QEA7236ABG-20IB0 use?

The R1QEA7236ABG-20IB0 uses a 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 15 mm × 17 mm × 1.4 mm. The "BG" suffix confirms this package; "I" denotes industrial temperature grade (−40°C to +85°C); and "B0" indicates Pb-free, tape-and-reel packaging. Pin pitch is 0.8 mm, and ball composition is lead-free solder (RoHS 6/6 compliant).

How does the R1QEA7236ABG-20IB0 handle power-up initialization?

The R1QEA7236ABG-20IB0 requires a defined power-up sequence: VSS → VDD → VDDQ & VREF → VIN. After VDDQ and VREF stabilize, at least 20 µs of stable K and /K clocks must be applied (with /DOFF high) before normal operation. During this period, all outputs remain in high-Z. This ensures DLL/PLL lock and internal state machine readiness before accepting commands.