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Renesas R1QGA3636CBG-25IB0
- Part No.:
- R1QGA3636CBG-25IB0
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
R1QGA3636CBG-25IB0.pdf
- Description:
- STANDARD SRAM, 1MX36, 0.55NS
- Quantity:
- Payment:
- Shipping:
Inventory:1,098
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Product details
Overview
R1QGA3636CBG-25IB0 from Renesas Electronics is a 36-Mbit QDR™ II+ SRAM with 1,048,576-word × 36-bit organization, synchronous quad data rate operation, 4-word burst, read latency of 2.0 cycles, and HSTL I/O interface. It operates at up to 400 MHz (2.5 ns cycle time), supports separate read/write data ports, and is used in high-bandwidth networking packet buffers and FPGA co-processor memory subsystems.
For engineers reviewing the R1QGA3636CBG-25IB0 datasheet, R1QGA3636CBG-25IB0 pinout, R1QGA3636CBG-25IB0 application, or R1QGA3636CBG-25IB0 equivalent, key selection criteria include burst timing alignment with K/K̅ clocks, QVLD-synchronized data capture, programmable output impedance via ZQ, ODT support for signal integrity, and industrial temperature range (−40°C to +85°C) compliance.
Technical Context
This device implements a true dual-port synchronous architecture with independent read and write data paths, using K and K̅ as input clocks for address/control/data registration on rising edges. It integrates a burst counter and DLL circuitry to maintain wide output data valid windows across frequency scaling.
The R1QGA3636CBG-25IB0 uses HSTL Class I inputs and outputs, features JTAG 1149.1 test access, and supports clock-stop mode with microsecond restart. Its ODT capability is enabled via the ODT pin and tracks ZQ resistor value, offering Thevenin-equivalent termination between 52 Ω and 150 Ω depending on ODT control state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1,048,576 × 36-bit), enabling compact high-throughput buffer designs without depth expansion. |
| Max Clock Frequency | 400 MHz - delivers 3.2 GB/s peak bandwidth (36-bit × 400 MHz × 2 transitions/cycle). |
| Read Latency | 2.0 clock cycles - enables deterministic timing for pipeline-aligned read responses in switch fabric controllers. |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V - compatible with 1.5 V HSTL systems and supports low-power operation. |
| Burst Length | 4-word burst - reduces address bus frequency by 75% versus single-word access, easing routing and timing closure. |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade embedded networking and telecom infrastructure. |
| Package | 165-pin FBGA (15 mm × 17 mm × 1.4 mm) - standard footprint for high-density PCB layouts with thermal pad grounding. |
Pinout & Package
Package: 165-ball plastic FBGA (15 × 17 mm, 1.4 mm height), RoHS-compliant, Pb-free tray packaging. Ball pitch: 0.8 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, /K | Input clock pair | Registers all address, control, and write data on rising edges; defines synchronous timing boundary for all operations. |
| /R, /W | Read/Write command inputs | Active-low synchronous commands sampled on K rising edge; /R initiates burst read, /W initiates burst write. |
| SA[19:0] | Synchronous address inputs | 20-bit address bus registered on K rising edge; internal logic expands to 22 bits for 4-word burst addressing. |
| D[35:0] | Write data inputs | 36-bit parallel data path; each byte controlled by dedicated /BWx for selective write masking during burst. |
| Q[35:0] | Read data outputs | 36-bit parallel output synchronized to CQ/CQ̅ or K/K̅; QVLD indicates valid window aligned to echo clocks. |
| QVLD | Valid data indicator | Output pulse active half-cycle before first read data and deasserted half-cycle before last - enables precise latch timing in receivers. |
| ZQ | Impedance calibration reference | Connects to precision resistor (RQ) to set output driver and ODT impedance; RQ = 5 × target Z₀ (±15% tolerance). |
| ODT | On-die termination control | Configures ODT range: low (52–105 Ω) or high (105–150 Ω) Thevenin termination, tracking ZQ value. |
| VDD, VDDQ, VSS, VREF | Power and reference supplies | VDD = 1.7–1.9 V core supply; VDDQ = 1.4–1.8 V I/O supply; VREF = VDDQ/2 ±100 mV for HSTL input threshold setting. |
| TCK, TMS, TDI, TDO | JTAG 1149.1 interface | Supports boundary scan testing and debug; TCK must be tied to VSS if unused. |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Enables concurrent read and write transactions without bus arbitration, critical for full-duplex packet buffering in switches. |
| QVLD timing indicator | Provides deterministic, clock-aligned strobe for capturing 4-word bursts - eliminates setup/hold uncertainty in high-speed receivers. |
| Programmable output impedance | ZQ-based calibration ensures matched drive strength to PCB trace impedance (e.g., 50 Ω differential), reducing reflections and jitter. |
| On-die termination (ODT) | Dynamic termination on D[35:0] inputs eliminates external resistors and improves signal integrity at 400 MHz DDR rates. |
| Industrial temperature range | Guaranteed operation from −40°C to +85°C ambient - validated for base station RF modules and carrier-grade routers. |
| 4-word burst architecture | Reduces address transition rate by 75%, lowering EMI and simplifying timing closure on dense backplane interfaces. |
Applications
| Networking Packet Buffer | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Line-rate buffering of 10 GbE/40 GbE packet flows in network processors and traffic managers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory for ingress/egress queues with simultaneous read/write access. Use Value: 3.2 GB/s sustained bandwidth and 2.0-cycle read latency enable zero-drop forwarding at wire speed. |
Use Scenario: Off-chip memory extension for Xilinx UltraScale+ or Intel Stratix 10 FPGAs performing real-time signal processing. IC Role / Device Role / Timing Role: Synchronous burst-access memory mapped to AXI4-Stream or Avalon-MM interfaces via hard IP controller. Use Value: Separate I/O ports and QVLD simplify timing closure in FPGA-to-SRAM handshaking, reducing design iteration cycles. |
| Telecom Baseband Processing | High-Performance Test Equipment |
Use Scenario: Real-time channel estimation and precoding buffer in 5G massive MIMO baseband units. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory for FFT/IFFT result staging and coefficient lookup tables. Use Value: DLL-synchronized CQ/CQ̅ outputs and clock-stop capability support precise phase-aligned sampling in multi-channel ADC/DAC systems. |
Use Scenario: Pattern memory in high-speed digital pattern generators and BERT instruments operating above 3 Gbps. IC Role / Device Role / Timing Role: Programmable stimulus/response storage with sub-nanosecond timing repeatability across 36-bit parallel vectors. Use Value: HSTL I/O, ODT, and ZQ calibration ensure clean signal edges and minimal inter-symbol interference at 400 MHz DDR rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C2663KV18-400BZXC | Same 36-Mbit density, 400 MHz, 2.0-cycle latency, but uses 165-ball FBGA with different pinout (non-pin-compatible); no ODT support. | Lacks on-die termination - requires external series termination and careful layout for signal integrity at 400 MHz. | Select when legacy Cypress ecosystem compatibility is required and board-level termination is acceptable. |
| AS7C362000B-200BIN | Lower speed (200 MHz), asynchronous interface, no burst or QVLD; 36-bit × 1M organization, SOJ package. | Not suitable for high-speed synchronous systems - lacks clocking architecture, DLL, and burst control logic. | Consider only for cost-sensitive, non-real-time applications where bandwidth < 1.6 GB/s is sufficient. |
Compared with CY7C2663KV18-400BZXC and AS7C362000B-200BIN, the R1QGA3636CBG-25IB0 uniquely combines 400 MHz QDR II+ performance with integrated ODT, QVLD timing aid, and industrial temperature rating - delivering superior signal integrity and design margin in demanding telecom and test equipment applications.
Availability
R1QGA3636CBG-25IB0 is available at Aetrix Electronics and suitable for networking packet buffers, FPGA co-processor memory, and telecom baseband processing requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.
Supply support for R1QGA3636CBG-25IB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The R1QGA3636CBG-25IB0 belongs to Renesas' QDR™ II+ SRAM product line, engineered specifically for high-bandwidth, low-latency memory interfacing in networking, telecom, and high-performance computing systems.
FAQ
What is the maximum operating frequency and corresponding cycle time for R1QGA3636CBG-25IB0?
The R1QGA3636CBG-25IB0 is rated for a maximum operating frequency of 400 MHz, corresponding to a minimum cycle time of 2.5 ns. This specification is guaranteed under industrial temperature conditions (−40°C to +85°C) and with VDD = 1.7–1.9 V and VDDQ = 1.4–1.8 V. The device achieves this performance using its dual-edge clocking architecture and integrated DLL.
Does R1QGA3636CBG-25IB0 support on-die termination (ODT), and how is it configured?
Yes, R1QGA3636CBG-25IB0 supports ODT via the dedicated ODT pin and ZQ calibration resistor. When ODT is enabled, termination values track the ZQ resistor (RQ), providing Thevenin-equivalent resistance ranges of 52–105 Ω (low range) or 105–150 Ω (high range). Configuration is controlled by the logic level on the ODT pin per the datasheet's ODT range table.
What is the function of the QVLD pin on R1QGA3636CBG-25IB0, and how is it timed?
The QVLD pin on R1QGA3636CBG-25IB0 is a valid data indicator that signals when read output data (Q[35:0]) is stable and ready for capture. It is edge-aligned with CQ and CQ̅, asserted half a cycle before the first data word and deasserted half a cycle before the last - providing precise timing margins for high-speed receivers without requiring additional strobes.
What package type and dimensions does R1QGA3636CBG-25IB0 use?
R1QGA3636CBG-25IB0 uses a 165-ball plastic FBGA package measuring 15 mm × 17 mm × 1.4 mm with 0.8 mm ball pitch. The package marking "BG" confirms this variant, and it is Pb-free and supplied in tray format per the ordering code suffix "B".
How does the burst length and read latency of R1QGA3636CBG-25IB0 affect system timing design?
R1QGA3636CBG-25IB0 uses a fixed 4-word burst length and 2.0-cycle read latency. This means a read command issued on clock edge N produces valid data starting at edge N+2, with four consecutive words delivered over two clock cycles. System timing must allocate setup/hold margins around K/K̅ edges and align receiver sampling to QVLD/CQ edges to capture all four words reliably.
R1QGA3636CBG-25IB0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
R1QGA3636CBG-25IB0 FAQ
1.How can I place an order for R1QGA3636CBG-25IB0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1QGA3636CBG-25IB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1QGA3636CBG-25IB0 reliable?
The price and inventory of R1QGA3636CBG-25IB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1QGA3636CBG-25IB0 is usually 5 days.
3.What payment methods are accepted for R1QGA3636CBG-25IB0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1QGA3636CBG-25IB0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1QGA3636CBG-25IB0?
R1QGA3636CBG-25IB0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1QGA3636CBG-25IB0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1QGA3636CBG-25IB0?
For technical support, including R1QGA3636CBG-25IB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1QGA3636CBG-25IB0 requirements.
6.How does Aetrix verify that R1QGA3636CBG-25IB0 is sourced from the original manufacturer or authorized distributors?
All R1QGA3636CBG-25IB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1QGA3636CBG-25IB0 meets industry standards.
7.What is the process for return or replacement of R1QGA3636CBG-25IB0?
All R1QGA3636CBG-25IB0 units undergo pre-shipment inspection (PSI). If there is an issue with R1QGA3636CBG-25IB0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1QGA3636CBG-25IB0 part is unused and in its original packaging.
Return procedure for R1QGA3636CBG-25IB0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R1QGA3636CBG-25IB0 Tags
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