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Renesas R1RP0416DGE-2PR#B1

Part No.:
R1RP0416DGE-2PR#B1
Manufacturer:
Renesas
Category:
Memory
Package:
44-BSOJ (0.400", 10.16mm Width)
Datasheet:
AetrixR1RP0416DGE-2PR#B1.pdf
Description:
IC SRAM 4MBIT PARALLEL 44SOJ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,189

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Product details

Overview

R1RP0416DGE-2PR#B1 from Renesas Electronics is a 4-Mbit high-speed CMOS static RAM organized as 256-kword × 16-bit, operating from a single 5.0V ±10% supply with 12ns max access time, TTL-compatible I/O, and center VCC/VSS pinout-designed for cache and buffer memory in high-performance computing and industrial control systems.

For engineers reviewing the R1RP0416DGE-2PR#B1 datasheet, R1RP0416DGE-2PR#B1 pinout, R1RP0416DGE-2PR#B1 application, or R1RP0416DGE-2PR#B1 equivalent, key selection criteria include 12ns read/write cycle timing, byte-selectable 16-bit I/O architecture, low-power standby modes (5mA CMOS), and SOJ-44 package compatibility with legacy memory bus designs.

Technical Context

This SRAM implements a fully static 6-transistor cell architecture with no clocks or refresh required. Its operation relies on asynchronous control via CS#, OE#, WE#, UB#, and LB# to enable independent upper/lower byte access and high-impedance tri-state outputs during deselect or disable states.

The device supports simultaneous address and control setup with zero address setup time (tAS = 0 ns) and zero write recovery time (tWR = 0 ns), enabling tight timing margins in burst-mode or pipeline memory interfaces. Data retention is guaranteed down to 2.0V VCC for L- and S-versions, though R1RP0416DGE-2PR#B1 is the Normal version with 40mA TTL standby current.

Key Specifications

Parameter Value and Actual Design Meaning
Memory size 4 Mbit (256 kwords × 16 bits) - provides wide-data-path buffering without external data-width expansion logic
Access time 12 ns (max) - defines minimum read cycle interval for synchronous bus interfacing at up to ~83 MHz effective rate
Supply voltage 5.0 V ±10% - compatible with legacy 5V TTL/CMOS system rails without level-shifting circuitry
Operating current 160 mA (max) - determines thermal design margin and power rail capacity for sustained random-access workloads
Standby current 40 mA (TTL mode, max) - sets baseline power draw during idle periods in non-low-power systems
I/O interface TTL-compatible inputs/outputs - ensures direct connection to 5V microcontrollers, FPGAs, and ASICs without interface buffers
Data retention voltage 2.0 V (min) - enables low-voltage hold mode during controlled power-down sequences

Pinout & Package

Packaged in 400-mil 44-pin plastic SOJ (Small Outline J-Lead) with center VCC/VSS pin arrangement for balanced power distribution and reduced noise coupling.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address input 18-bit address bus supporting full 256-kword decoding; no internal multiplexing required
I/O1–I/O16 Data input/output Bi-directional 16-bit data bus with true tri-state control per byte via UB#/LB#
CS# Chip select Active-low global enable; places device in standby when high, overriding all other controls
OE# Output enable Active-low read gate; controls output drivers independently of CS# for shared-bus contention management
WE# Write enable Active-low write strobe; latches data on I/O pins when CS# and LB#/UB# are also asserted
UB#, LB# Upper/lower byte select Independent 8-bit write masking; allows partial-word writes without read-modify-write cycles
VCC Power supply Center-located 5V supply pin; multiple VCC pins (per datasheet) reduce IR drop across package
VSS Ground Center-located ground pin; multiple VSS pins improve noise immunity and signal return path integrity
NC No connection Unbonded pin; must remain unconnected to avoid unintended parasitic coupling or mechanical stress

Key Features

Feature Design Value
Single 5V supply operation Eliminates need for dual-rail regulators or charge pumps in 5V system designs
Zero address setup/recovery times Enables direct connection to microprocessor buses with no wait-state insertion or glue logic
Byte-selectable write capability Reduces bus traffic and processor overhead by allowing 8-bit updates within 16-bit word space
Direct TTL compatibility Permits interoperability with legacy 5V logic families without level translators or pull-up resistors
Center VCC/VSS pinout Improves power delivery symmetry and reduces simultaneous switching noise in high-speed parallel interfaces

Applications

Cache Memory Buffer Memory

Use Scenario: High-speed instruction/data cache between CPU and main memory in industrial PLCs and test equipment.

IC Role / Device Role / Timing Role: Asynchronous static storage holding recently accessed instructions or operands, accessed on every CPU cycle with sub-12ns latency.

Use Value: Enables deterministic execution timing and eliminates cache-miss penalties typical of DRAM-based caches.

Use Scenario: Real-time data buffering in serial-to-parallel conversion for industrial fieldbus gateways (e.g., Modbus RTU to Ethernet).

IC Role / Device Role / Timing Role: Dual-port-like temporary storage staging incoming packet payloads before protocol processing or retransmission.

Use Value: Absorbs bursty traffic without flow-control signaling, maintaining line-rate throughput under variable host CPU load.

Video Frame Buffer Embedded Controller Memory

Use Scenario: Intermediate frame storage in digital signage controllers rendering 1080p graphics with double-buffering.

IC Role / Device Role / Timing Role: Dedicated 16-bit-wide memory bank providing pixel data to display controller during active scan lines.

Use Value: Supports seamless page-flipping and avoids tearing artifacts by decoupling rendering and display timing domains.

Use Scenario: Program/data memory extension for 16-bit microcontrollers in automotive body control modules.

IC Role / Device Role / Timing Role: Off-chip XDATA space expansion for firmware overlays and dynamic configuration tables.

Use Value: Increases available memory footprint without requiring MCU replacement or architectural redesign.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY62167EV30LL-45ZSXIT 3V core supply, 45ns access, 512k × 16-bit density, TSOP-II package Lower speed and different voltage domain; requires level-shifting for 5V bus integration Select only if migrating to 3.3V system architecture and accepting longer access latency
IS61LV25616AL-12MLI 3.3V supply, 12ns access, 256k × 16-bit, SOJ-44 package, 32mA CMOS standby Same density and speed grade but incompatible 3.3V I/O levels; not TTL-compatible Choose when upgrading to lower-power 3.3V design and adding translation logic is acceptable

Compared with CY62167EV30LL-45ZSXIT and IS61LV25616AL-12MLI, R1RP0416DGE-2PR#B1 uniquely delivers 5V TTL compatibility, 12ns timing, and SOJ-44 footprint in a single part-making it the only drop-in solution for legacy 5V memory bus upgrades without layout or voltage rail changes.

Availability

R1RP0416DGE-2PR#B1 is available at Aetrix Electronics and suitable for cache memory, buffer memory, video frame buffering, and embedded controller memory applications requiring stable component supply across industrial, test & measurement, and digital signage product lifecycles.

Supply support for R1RP0416DGE-2PR#B1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The R1RP0416D Series was designed specifically for high-speed, wide-bit-width parallel memory applications in 5V systems where deterministic latency and TTL interoperability are critical-targeting cache, buffer, and frame storage roles in real-time embedded platforms.

FAQ

What is the maximum operating temperature range for R1RP0416DGE-2PR#B1?

R1RP0416DGE-2PR#B1 is rated for operation from 0°C to +70°C ambient temperature, per its Recommended Operating Conditions. This commercial-grade temperature range aligns with standard industrial control and computing environments where airflow and board-level thermal management are present. The device's absolute maximum storage temperature extends to −55°C to +125°C, supporting reflow soldering and long-term shelf storage.

Does R1RP0416DGE-2PR#B1 support independent upper and lower byte writes?

Yes, R1RP0416DGE-2PR#B1 supports independent byte writes using UB# (upper byte, I/O9–I/O16) and LB# (lower byte, I/O1–I/O8). When only one byte select is asserted low with CS# and WE# active, only that 8-bit segment is written; the complementary byte remains unchanged. This eliminates read-modify-write overhead in partial-word update scenarios common in protocol stack and register-mapped peripheral buffering.

What is the pinout configuration of R1RP0416DGE-2PR#B1 and why does it matter?

R1RP0416DGE-2PR#B1 uses a center VCC/VSS pinout in its 44-pin SOJ package, with power and ground pins symmetrically placed near the middle of each long edge. This layout minimizes power delivery impedance and reduces simultaneous switching output (SSO) noise-critical for maintaining signal integrity on 16-bit parallel buses running at 12ns timing. It also ensures backward compatibility with existing SOJ-44 memory footprints designed for similar Renesas SRAMs.

Can R1RP0416DGE-2PR#B1 operate with a 3.3V supply?

No, R1RP0416DGE-2PR#B1 is specified exclusively for 5.0V ±10% operation (4.5V to 5.5V). Its internal circuitry, including the 6-transistor SRAM cell and input threshold levels (VIH ≥ 2.2V, VIL ≤ 0.8V), is optimized for 5V TTL logic families. Applying 3.3V will result in undefined behavior, failed reads/writes, and potential data corruption. For 3.3V systems, consider functionally similar but voltage-specified alternatives like IS61LV25616AL-12MLI.

What is the standby current specification for R1RP0416DGE-2PR#B1?

R1RP0416DGE-2PR#B1 specifies a maximum TTL standby current of 40mA when CS# is high and all other inputs are at valid VIH/VIL levels. This reflects its Normal version designation-distinct from the L-version (5mA max) and S-version (1.0mA max). The 40mA value represents worst-case leakage under full 5V bias and must be accounted for in total system standby power budgeting for always-on industrial controllers.

R1RP0416DGE-2PR#B1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-BSOJ (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-SOJ

R1RP0416DGE-2PR#B1 FAQ

1.How can I place an order for R1RP0416DGE-2PR#B1 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1RP0416DGE-2PR#B1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1RP0416DGE-2PR#B1 reliable?

The price and inventory of R1RP0416DGE-2PR#B1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1RP0416DGE-2PR#B1 is usually 5 days.

3.What payment methods are accepted for R1RP0416DGE-2PR#B1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1RP0416DGE-2PR#B1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1RP0416DGE-2PR#B1?

R1RP0416DGE-2PR#B1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1RP0416DGE-2PR#B1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1RP0416DGE-2PR#B1?

For technical support, including R1RP0416DGE-2PR#B1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1RP0416DGE-2PR#B1 requirements.

6.How does Aetrix verify that R1RP0416DGE-2PR#B1 is sourced from the original manufacturer or authorized distributors?

All R1RP0416DGE-2PR#B1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1RP0416DGE-2PR#B1 meets industry standards.

7.What is the process for return or replacement of R1RP0416DGE-2PR#B1?

All R1RP0416DGE-2PR#B1 units undergo pre-shipment inspection (PSI). If there is an issue with R1RP0416DGE-2PR#B1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1RP0416DGE-2PR#B1 part is unused and in its original packaging.

Return procedure for R1RP0416DGE-2PR#B1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R1RP0416DGE-2PR#B1 Tags

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