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Renesas R1RP0416DSB-2LR#S1

Part No.:
R1RP0416DSB-2LR#S1
Manufacturer:
Renesas
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixR1RP0416DSB-2LR#S1.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,157

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Product details

Overview

R1RP0416DSB-2LR#S1 from Renesas Electronics is a 4-Mbit high-speed CMOS static RAM organized as 256-kword × 16-bit, operating from a single 5.0V ±10% supply with 12ns max access time, TTL-compatible I/O, and center VCC/VSS pinout-designed for cache and buffer memory in high-speed embedded systems.

For engineers reviewing the R1RP0416DSB-2LR#S1 datasheet, R1RP0416DSB-2LR#S1 pinout, R1RP0416DSB-2LR#S1 application, or R1RP0416DSB-2LR#S1 equivalent, key selection criteria include L-version low-power standby (1.0mA max), data retention at 2.0V min, byte-select capability (UB#/LB#), and 44-pin TSOPII package compatibility with space-constrained industrial controllers.

Technical Context

This SRAM implements a fully static 6-transistor cell architecture with no clock or timing strobe required, enabling deterministic read/write timing across all modes. Its dual-byte select (UB#/LB#) supports independent 8-bit accesses within the 16-bit bus, and chip-select–driven output enable (OE#) ensures precise control over bus contention during multi-device operation.

The L-version variant guarantees reduced standby current (1.0mA max at f = 0MHz) and data retention current (500µA max at VCC = 3V), while maintaining full 12ns cycle timing compliance under 0°C to +70°C ambient conditions and 5.0V ±10% supply regulation.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size4 Mbit (256 kword × 16-bit) - provides 512 kB of wide-data, low-latency storage for burst-mode buffering
Access time12 ns max - enables direct interface with 80 MHz system buses without wait states
Supply voltage5.0 V ±10% - compatible with legacy 5V TTL logic domains without level translation
Standby current (L-version)1.0 mA max - reduces power in idle states for battery-backed or energy-sensitive applications
Data retention voltage2.0 V min - maintains stored data during brown-out or controlled power-down sequences
Operating temperature0°C to +70°C - qualified for commercial and industrial-grade embedded control environments
I/O compatibilityTTL input/output levels - ensures seamless integration with 5V microcontrollers and FPGAs

Pinout & Package

Package: 400-mil 44-pin plastic TSOPII (thin shrink small outline package, Type II), lead pitch 0.8 mm, body width 10.16 mm.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address input18-bit address bus supporting full 256-kword decoding; no external address latching required
I/O1–I/O8Lower byte data I/OBi-directional 8-bit data path enabled only when LB# = low; high-Z when disabled
I/O9–I/O16Upper byte data I/OBi-directional 8-bit data path enabled only when UB# = low; high-Z when disabled
CS#Chip selectActive-low global enable; places device in standby (high-Z I/O) when high
OE#Output enableActive-low read control; overrides WE# to force output state during read cycles
WE#Write enableActive-low write control; initiates write on falling edge synchronized with CS# and byte selects
UB#, LB#Byte selectIndependent active-low controls for upper/lower 8-bit lanes; support partial writes without masking logic
VCC, VSSPower/groundCenter-placed dual VCC/VSS pins minimize IR drop and improve noise immunity in high-speed operation

Key Features

FeatureDesign Value
Single 5V supply operationEliminates need for dual-rail regulators or charge pumps in legacy 5V system designs
Byte-select architecture (UB#/LB#)Reduces external logic for 8-bit peripheral interfacing and enables efficient partial-word updates
L-version ultra-low standby current1.0 mA max at 0 MHz enables >10× lower power than standard version during sleep modes
2.0 V data retention thresholdAllows safe power-gating down to 2.0 V while preserving memory contents for fast wake-up recovery
Center VCC/VSS pinoutImproves power delivery symmetry and reduces simultaneous switching noise in high-frequency access

Applications

Industrial PLC Data BufferingLegacy Microcontroller Cache

Use Scenario: Real-time I/O scan buffers in programmable logic controllers require deterministic 12ns read/write latency and tolerance to voltage sags during field power fluctuations.

IC Role / Device Role / Timing Role: High-speed SRAM serving as dual-port-accessible scratchpad memory for cyclic process data exchange between CPU and I/O modules.

Use Value: L-version 1.0 mA standby current extends backup battery life; 2.0 V retention ensures data integrity during brown-out events without external supervision.

Use Scenario: 8/16-bit microcontrollers with external memory buses (e.g., 8080/68000-style) require wide 16-bit parallel SRAM for instruction caching and stack expansion.

IC Role / Device Role / Timing Role: Pin-compatible 16-bit SRAM providing zero-wait-state execution for firmware overlays and real-time interrupt stacks.

Use Value: TTL-compatible I/O and 5V supply eliminate level shifters; 44-pin TSOPII footprint fits legacy PCB layouts with minimal redesign.

Medical Imaging Frame BufferTest Equipment Pattern Memory

Use Scenario: Ultrasound or endoscope processors capture high-frame-rate image data into local frame buffers before compression or transmission.

IC Role / Device Role / Timing Role: Burst-capable 16-bit SRAM acting as line/frame buffer between ADC interface and DSP subsystem.

Use Value: 12ns access time supports pixel rates up to 83 MSPS; byte-select enables efficient YUV component separation without full-word transfers.

Use Scenario: Automated test equipment stores stimulus/response patterns for digital IC validation, requiring fast random-access reads/writes and long-term data retention during power cycling.

IC Role / Device Role / Timing Role: Nonvolatile-retentive SRAM used as pattern memory with controlled low-VCC hold mode between test sequences.

Use Value: 2.0 V data retention allows safe power reduction between tests; 500 µA max retention current minimizes standby power in rack-mounted systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV25616AL-12TQLI3.3V supply only; 12ns access; 44-pin TSOP-II; 1.5 mA standby (typ)Requires level-shifting or 3.3V system redesign; lacks 2.0V data retention guaranteeSelect when migrating to 3.3V platforms and lower active power is prioritized over brown-out resilience
AS6C4008-12ZIN5V supply; 12ns access; 44-pin SOJ (not TSOPII); 2 mA standby (max)SOJ package incompatible with TSOPII land pattern; no L-version low-power standby specChoose only if board layout permits SOJ socket replacement and L-version power savings are not required

Compared with IS61LV25616AL-12TQLI and AS6C4008-12ZIN, the R1RP0416DSB-2LR#S1 uniquely delivers 5V compatibility, L-version 1.0 mA standby, and guaranteed 2.0 V data retention-making it optimal for industrial systems needing robustness across voltage transients without architecture change.

Availability

R1RP0416DSB-2LR#S1 is available at Aetrix Electronics and suitable for industrial PLC data buffering, legacy microcontroller cache expansion, and medical imaging frame buffering requiring stable component supply and long-term lifecycle assurance.

Supply support for R1RP0416DSB-2LR#S1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The R1RP0416D Series was developed to deliver high-density, low-latency parallel SRAM for cost-sensitive industrial and embedded systems where 5V compatibility, byte-select flexibility, and power-aware retention are critical design requirements.

FAQ

What is the maximum access time specification for R1RP0416DSB-2LR#S1?

The R1RP0416DSB-2LR#S1 has a maximum access time of 12 ns, measured as address access time (tAA) and chip select access time (tACS) under standard operating conditions (0°C to +70°C, VCC = 5.0 V ±10%). This value is guaranteed for the L-version and applies to both read and write cycles, enabling direct connection to 80 MHz system clocks without wait-state insertion.

Does R1RP0416DSB-2LR#S1 support independent 8-bit data access?

Yes, the R1RP0416DSB-2LR#S1 supports independent 8-bit access via dedicated UB# (upper byte) and LB# (lower byte) control inputs. When LB# is asserted low, I/O1–I/O8 become active; when UB# is low, I/O9–I/O16 are enabled. Both can be asserted simultaneously for full 16-bit operation, and either can be held high to place its respective byte lane in high-impedance state-eliminating need for external byte masking logic.

What is the standby current for R1RP0416DSB-2LR#S1 in L-version configuration?

The R1RP0416DSB-2LR#S1 L-version guarantees a maximum standby current of 1.0 mA under zero-frequency conditions (f = 0 MHz), with VCC ≥ CS# ≥ VCC − 0.2 V and input voltages clamped to 0 V or VCC − 0.2 V. This is significantly lower than the 40 mA max for standard versions and enables extended battery-backed operation in low-duty-cycle systems.

Can R1RP0416DSB-2LR#S1 retain data at reduced supply voltage?

Yes, the R1RP0416DSB-2LR#S1 L-version guarantees data retention down to 2.0 V minimum VCC, with a maximum retention current of 500 µA at VCC = 3 V. Retention mode requires CS# held high or within VCC − 0.2 V, and all inputs biased to valid logic levels-enabling safe power-down sequencing and brown-out recovery without data loss.

What package type is used for R1RP0416DSB-2LR#S1?

The R1RP0416DSB-2LR#S1 uses a 400-mil 44-pin plastic TSOPII (Thin Shrink Small Outline Package, Type II) with 0.8 mm lead pitch and 10.16 mm body width. This surface-mount package features center-placed VCC and VSS pins for improved power integrity and is compatible with standard reflow soldering profiles for industrial PCB assembly.

R1RP0416DSB-2LR#S1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

R1RP0416DSB-2LR#S1 FAQ

1.How can I place an order for R1RP0416DSB-2LR#S1 through Aetrix?

Please submit a Request for Quotation (RFQ) for R1RP0416DSB-2LR#S1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R1RP0416DSB-2LR#S1 reliable?

The price and inventory of R1RP0416DSB-2LR#S1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1RP0416DSB-2LR#S1 is usually 5 days.

3.What payment methods are accepted for R1RP0416DSB-2LR#S1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1RP0416DSB-2LR#S1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R1RP0416DSB-2LR#S1?

R1RP0416DSB-2LR#S1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R1RP0416DSB-2LR#S1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R1RP0416DSB-2LR#S1?

For technical support, including R1RP0416DSB-2LR#S1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1RP0416DSB-2LR#S1 requirements.

6.How does Aetrix verify that R1RP0416DSB-2LR#S1 is sourced from the original manufacturer or authorized distributors?

All R1RP0416DSB-2LR#S1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1RP0416DSB-2LR#S1 meets industry standards.

7.What is the process for return or replacement of R1RP0416DSB-2LR#S1?

All R1RP0416DSB-2LR#S1 units undergo pre-shipment inspection (PSI). If there is an issue with R1RP0416DSB-2LR#S1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R1RP0416DSB-2LR#S1 part is unused and in its original packaging.

Return procedure for R1RP0416DSB-2LR#S1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R1RP0416DSB-2LR#S1 Tags

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