Renesas R1RP0416DSB-2LR#S1
- Part No.:
- R1RP0416DSB-2LR#S1
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
R1RP0416DSB-2LR#S1.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R1RP0416DSB-2LR#S1 from Renesas Electronics is a 4-Mbit high-speed CMOS static RAM organized as 256-kword × 16-bit, operating from a single 5.0V ±10% supply with 12ns max access time, TTL-compatible I/O, and center VCC/VSS pinout-designed for cache and buffer memory in high-speed embedded systems.
For engineers reviewing the R1RP0416DSB-2LR#S1 datasheet, R1RP0416DSB-2LR#S1 pinout, R1RP0416DSB-2LR#S1 application, or R1RP0416DSB-2LR#S1 equivalent, key selection criteria include L-version low-power standby (1.0mA max), data retention at 2.0V min, byte-select capability (UB#/LB#), and 44-pin TSOPII package compatibility with space-constrained industrial controllers.
Technical Context
This SRAM implements a fully static 6-transistor cell architecture with no clock or timing strobe required, enabling deterministic read/write timing across all modes. Its dual-byte select (UB#/LB#) supports independent 8-bit accesses within the 16-bit bus, and chip-select–driven output enable (OE#) ensures precise control over bus contention during multi-device operation.
The L-version variant guarantees reduced standby current (1.0mA max at f = 0MHz) and data retention current (500µA max at VCC = 3V), while maintaining full 12ns cycle timing compliance under 0°C to +70°C ambient conditions and 5.0V ±10% supply regulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 4 Mbit (256 kword × 16-bit) - provides 512 kB of wide-data, low-latency storage for burst-mode buffering |
| Access time | 12 ns max - enables direct interface with 80 MHz system buses without wait states |
| Supply voltage | 5.0 V ±10% - compatible with legacy 5V TTL logic domains without level translation |
| Standby current (L-version) | 1.0 mA max - reduces power in idle states for battery-backed or energy-sensitive applications |
| Data retention voltage | 2.0 V min - maintains stored data during brown-out or controlled power-down sequences |
| Operating temperature | 0°C to +70°C - qualified for commercial and industrial-grade embedded control environments |
| I/O compatibility | TTL input/output levels - ensures seamless integration with 5V microcontrollers and FPGAs |
Pinout & Package
Package: 400-mil 44-pin plastic TSOPII (thin shrink small outline package, Type II), lead pitch 0.8 mm, body width 10.16 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address input | 18-bit address bus supporting full 256-kword decoding; no external address latching required |
| I/O1–I/O8 | Lower byte data I/O | Bi-directional 8-bit data path enabled only when LB# = low; high-Z when disabled |
| I/O9–I/O16 | Upper byte data I/O | Bi-directional 8-bit data path enabled only when UB# = low; high-Z when disabled |
| CS# | Chip select | Active-low global enable; places device in standby (high-Z I/O) when high |
| OE# | Output enable | Active-low read control; overrides WE# to force output state during read cycles |
| WE# | Write enable | Active-low write control; initiates write on falling edge synchronized with CS# and byte selects |
| UB#, LB# | Byte select | Independent active-low controls for upper/lower 8-bit lanes; support partial writes without masking logic |
| VCC, VSS | Power/ground | Center-placed dual VCC/VSS pins minimize IR drop and improve noise immunity in high-speed operation |
Key Features
| Feature | Design Value |
|---|---|
| Single 5V supply operation | Eliminates need for dual-rail regulators or charge pumps in legacy 5V system designs |
| Byte-select architecture (UB#/LB#) | Reduces external logic for 8-bit peripheral interfacing and enables efficient partial-word updates |
| L-version ultra-low standby current | 1.0 mA max at 0 MHz enables >10× lower power than standard version during sleep modes |
| 2.0 V data retention threshold | Allows safe power-gating down to 2.0 V while preserving memory contents for fast wake-up recovery |
| Center VCC/VSS pinout | Improves power delivery symmetry and reduces simultaneous switching noise in high-frequency access |
Applications
| Industrial PLC Data Buffering | Legacy Microcontroller Cache |
|---|---|
Use Scenario: Real-time I/O scan buffers in programmable logic controllers require deterministic 12ns read/write latency and tolerance to voltage sags during field power fluctuations. IC Role / Device Role / Timing Role: High-speed SRAM serving as dual-port-accessible scratchpad memory for cyclic process data exchange between CPU and I/O modules. Use Value: L-version 1.0 mA standby current extends backup battery life; 2.0 V retention ensures data integrity during brown-out events without external supervision. | Use Scenario: 8/16-bit microcontrollers with external memory buses (e.g., 8080/68000-style) require wide 16-bit parallel SRAM for instruction caching and stack expansion. IC Role / Device Role / Timing Role: Pin-compatible 16-bit SRAM providing zero-wait-state execution for firmware overlays and real-time interrupt stacks. Use Value: TTL-compatible I/O and 5V supply eliminate level shifters; 44-pin TSOPII footprint fits legacy PCB layouts with minimal redesign. |
| Medical Imaging Frame Buffer | Test Equipment Pattern Memory |
Use Scenario: Ultrasound or endoscope processors capture high-frame-rate image data into local frame buffers before compression or transmission. IC Role / Device Role / Timing Role: Burst-capable 16-bit SRAM acting as line/frame buffer between ADC interface and DSP subsystem. Use Value: 12ns access time supports pixel rates up to 83 MSPS; byte-select enables efficient YUV component separation without full-word transfers. | Use Scenario: Automated test equipment stores stimulus/response patterns for digital IC validation, requiring fast random-access reads/writes and long-term data retention during power cycling. IC Role / Device Role / Timing Role: Nonvolatile-retentive SRAM used as pattern memory with controlled low-VCC hold mode between test sequences. Use Value: 2.0 V data retention allows safe power reduction between tests; 500 µA max retention current minimizes standby power in rack-mounted systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-12TQLI | 3.3V supply only; 12ns access; 44-pin TSOP-II; 1.5 mA standby (typ) | Requires level-shifting or 3.3V system redesign; lacks 2.0V data retention guarantee | Select when migrating to 3.3V platforms and lower active power is prioritized over brown-out resilience |
| AS6C4008-12ZIN | 5V supply; 12ns access; 44-pin SOJ (not TSOPII); 2 mA standby (max) | SOJ package incompatible with TSOPII land pattern; no L-version low-power standby spec | Choose only if board layout permits SOJ socket replacement and L-version power savings are not required |
Compared with IS61LV25616AL-12TQLI and AS6C4008-12ZIN, the R1RP0416DSB-2LR#S1 uniquely delivers 5V compatibility, L-version 1.0 mA standby, and guaranteed 2.0 V data retention-making it optimal for industrial systems needing robustness across voltage transients without architecture change.
Availability
R1RP0416DSB-2LR#S1 is available at Aetrix Electronics and suitable for industrial PLC data buffering, legacy microcontroller cache expansion, and medical imaging frame buffering requiring stable component supply and long-term lifecycle assurance.
Supply support for R1RP0416DSB-2LR#S1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The R1RP0416D Series was developed to deliver high-density, low-latency parallel SRAM for cost-sensitive industrial and embedded systems where 5V compatibility, byte-select flexibility, and power-aware retention are critical design requirements.
FAQ
What is the maximum access time specification for R1RP0416DSB-2LR#S1?
The R1RP0416DSB-2LR#S1 has a maximum access time of 12 ns, measured as address access time (tAA) and chip select access time (tACS) under standard operating conditions (0°C to +70°C, VCC = 5.0 V ±10%). This value is guaranteed for the L-version and applies to both read and write cycles, enabling direct connection to 80 MHz system clocks without wait-state insertion.
Does R1RP0416DSB-2LR#S1 support independent 8-bit data access?
Yes, the R1RP0416DSB-2LR#S1 supports independent 8-bit access via dedicated UB# (upper byte) and LB# (lower byte) control inputs. When LB# is asserted low, I/O1–I/O8 become active; when UB# is low, I/O9–I/O16 are enabled. Both can be asserted simultaneously for full 16-bit operation, and either can be held high to place its respective byte lane in high-impedance state-eliminating need for external byte masking logic.
What is the standby current for R1RP0416DSB-2LR#S1 in L-version configuration?
The R1RP0416DSB-2LR#S1 L-version guarantees a maximum standby current of 1.0 mA under zero-frequency conditions (f = 0 MHz), with VCC ≥ CS# ≥ VCC − 0.2 V and input voltages clamped to 0 V or VCC − 0.2 V. This is significantly lower than the 40 mA max for standard versions and enables extended battery-backed operation in low-duty-cycle systems.
Can R1RP0416DSB-2LR#S1 retain data at reduced supply voltage?
Yes, the R1RP0416DSB-2LR#S1 L-version guarantees data retention down to 2.0 V minimum VCC, with a maximum retention current of 500 µA at VCC = 3 V. Retention mode requires CS# held high or within VCC − 0.2 V, and all inputs biased to valid logic levels-enabling safe power-down sequencing and brown-out recovery without data loss.
What package type is used for R1RP0416DSB-2LR#S1?
The R1RP0416DSB-2LR#S1 uses a 400-mil 44-pin plastic TSOPII (Thin Shrink Small Outline Package, Type II) with 0.8 mm lead pitch and 10.16 mm body width. This surface-mount package features center-placed VCC and VSS pins for improved power integrity and is compatible with standard reflow soldering profiles for industrial PCB assembly.
R1RP0416DSB-2LR#S1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
R1RP0416DSB-2LR#S1 FAQ
1.How can I place an order for R1RP0416DSB-2LR#S1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1RP0416DSB-2LR#S1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1RP0416DSB-2LR#S1 reliable?
The price and inventory of R1RP0416DSB-2LR#S1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1RP0416DSB-2LR#S1 is usually 5 days.
3.What payment methods are accepted for R1RP0416DSB-2LR#S1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1RP0416DSB-2LR#S1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1RP0416DSB-2LR#S1?
R1RP0416DSB-2LR#S1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1RP0416DSB-2LR#S1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1RP0416DSB-2LR#S1?
For technical support, including R1RP0416DSB-2LR#S1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1RP0416DSB-2LR#S1 requirements.
6.How does Aetrix verify that R1RP0416DSB-2LR#S1 is sourced from the original manufacturer or authorized distributors?
All R1RP0416DSB-2LR#S1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1RP0416DSB-2LR#S1 meets industry standards.
7.What is the process for return or replacement of R1RP0416DSB-2LR#S1?
All R1RP0416DSB-2LR#S1 units undergo pre-shipment inspection (PSI). If there is an issue with R1RP0416DSB-2LR#S1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1RP0416DSB-2LR#S1 part is unused and in its original packaging.
Return procedure for R1RP0416DSB-2LR#S1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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