Renesas R1RW0416DSB-2PI#D1
- Part No.:
- R1RW0416DSB-2PI#D1
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
R1RW0416DSB-2PI#D1.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R1RW0416DSB-2PI#D1 from Renesas Electronics is a 4-Mbit high-speed CMOS static RAM organized as 256-kword × 16-bit, operating from a single 3.3V ±0.3V supply with 12ns max access time and −40°C to +85°C industrial temperature range. It serves as cache or buffer memory in real-time embedded systems requiring wide data bus width and deterministic zero-clock-cycle read/write timing.
For engineers reviewing the R1RW0416DSB-2PI#D1 datasheet, R1RW0416DSB-2PI#D1 pinout, R1RW0416DSB-2PI#D1 application, or R1RW0416DSB-2PI#D1 equivalent, key selection criteria include byte-selectable I/O (UB#/LB#), TTL-compatible interface levels, 44-pin TSOPII package footprint, and dual standby current modes (40mA TTL / 5mA CMOS).
Technical Context
The R1RW0416DSB-2PI#D1 implements a fully static 6-transistor memory cell architecture with no clock or refresh required. Its control logic supports independent upper- and lower-byte write/read via dedicated UB# and LB# inputs, enabling partial-word transfers without external gating.
It features center VCC/VSS pinout for low-noise power distribution and operates under strict DC conditions: VIH ≥2.0V, VIL ≤0.8V, and output drive capability of VOH ≥2.4V at −4mA and VOL ≤0.4V at 8mA - ensuring robust interfacing with legacy TTL and mixed-voltage 3.3V systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 4 Mbit (256 kwords × 16 bits) - supports 16-bit parallel data path without multiplexing |
| Access time | 12 ns max - guarantees worst-case read latency for real-time deterministic response |
| Supply voltage | 3.3 V ±0.3 V - compatible with standard 3.3V logic rails; no level-shifting needed |
| Operating current | 130 mA max - defines peak power draw during active read/write cycles |
| Standby current | 5 mA (CMOS mode) - enables ultra-low-power retention when CS# inactive |
| Temperature range | −40°C to +85°C - qualified for industrial-grade deployment without derating |
| I/O voltage compatibility | TTL-compatible inputs/outputs - interoperable with 5V-tolerant or 3.3V-only controllers |
Pinout & Package
Package: 400-mil 44-pin plastic Thin Small Outline Package II (TSOPII), surface-mount, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address input | 18-bit address bus supporting full 256-kword addressing |
| I/O1–I/O16 | Data input/output | Bi-directional 16-bit data bus; split into I/O1–I/O8 (lower byte) and I/O9–I/O16 (upper byte) |
| CS# | Chip select | Active-low enable; places device in standby when high, enables all operations when low |
| OE# | Output enable | Active-low control for output drivers; allows read data to appear on I/O pins only when asserted |
| WE# | Write enable | Active-low signal initiating write cycle; latches data on rising edge of WE# or CS# |
| UB#, LB# | Upper/lower byte select | Independent active-low controls for 8-bit granularity writes/reads; enables partial-word access |
| VCC | Power supply | Single 3.3V supply pin; center-placed for balanced power delivery and noise reduction |
| VSS | Ground | Reference ground; center-placed adjacent to VCC for low-inductance return path |
| NC | No connection | Unbonded pin; must remain unconnected per design |
Key Features
| Feature | Design Value |
|---|---|
| Fully static operation | No clocks, no refresh, no timing strobes - simplifies system timing design and eliminates hidden latency sources |
| Byte-selectable I/O | Dedicated UB# and LB# inputs allow independent 8-bit reads/writes without external logic or bus contention |
| Two-mode standby current | Supports both TTL-level (40 mA) and CMOS-level (5 mA) standby states - selectable via input bias conditions |
| Center VCC/VSS pinout | Reduces simultaneous switching noise and improves power integrity in high-density PCB layouts |
| Industrial temperature grade | Qualified from −40°C to +85°C - suitable for automotive body electronics, industrial PLCs, and outdoor telecom equipment |
Applications
| Industrial PLC Data Buffer | Automotive ADAS Preprocessing Cache |
|---|---|
|
Use Scenario: Storing real-time sensor fusion results between microcontroller and FPGA in programmable logic controllers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency 16-bit parallel buffer with deterministic 12ns access for cyclic I/O scanning. Use Value: Eliminates wait states during multi-word register updates, maintaining 100+ kHz scan rates under full load. |
Use Scenario: Holding intermediate image frames from camera sensors before GPU-based object detection in advanced driver assistance systems. IC Role / Device Role / Timing Role: Off-chip SRAM cache with byte-selectable writes to reduce bandwidth pressure on main memory bus. Use Value: Enables concurrent capture and processing by allowing partial-frame writes without locking full 16-bit bus. |
| Medical Imaging Signal Pipeline | Avionics Display Frame Buffer |
|
Use Scenario: Temporary storage of digitized ultrasound A-line data prior to FFT computation in portable diagnostic devices. IC Role / Device Role / Timing Role: Zero-wait-state memory for burst-mode acquisition with precise timing control via OE#/WE#. Use Value: Guarantees sub-15ns read-to-process latency critical for real-time Doppler analysis. |
Use Scenario: Frame buffer for ruggedized cockpit displays requiring guaranteed data retention across thermal cycling and vibration. IC Role / Device Role / Timing Role: Radiation-tolerant-qualified (per Renesas industrial process) non-refreshing memory for mission-critical display rendering. Use Value: Maintains pixel integrity without periodic refresh interrupts, avoiding visual artifacts during flight-critical phases. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62148EV30LL-45ZSXI | 4 Mbit (256k × 16), 45 ns access, 3.3V, 44-pin SOJ - slower but wider availability and longer lifecycle | Targeted at cost-sensitive industrial controls where 12ns timing is not required | Select when board layout accommodates SOJ and system timing budget allows ≥45ns latency |
| IS61WV25616EDBLL-10MLI | 4 Mbit (256k × 16), 10 ns access, 3.3V, 48-pin TSOP-II - faster but different pin count and byte-select implementation | Suitable for new designs prioritizing minimum read latency over pin compatibility | Choose when redesigning for tighter timing margins and accepting 48-pin footprint change |
Compared with CY62148EV30LL-45ZSXI and IS61WV25616EDBLL-10MLI, the R1RW0416DSB-2PI#D1 uniquely balances 12ns performance, 44-pin TSOPII compactness, and industrial temperature support - making it optimal for space-constrained, thermally demanding embedded systems where timing and footprint are co-constrained.
Availability
R1RW0416DSB-2PI#D1 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for R1RW0416DSB-2PI#D1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.
The R1RW0416DI Series was designed specifically for high-reliability embedded systems needing fast, wide-bus, non-refreshing memory - emphasizing industrial temperature resilience, byte-granular control, and drop-in compatibility with legacy 16-bit bus architectures.
FAQ
What is the maximum access time specification for R1RW0416DSB-2PI#D1?
The R1RW0416DSB-2PI#D1 has a maximum access time of 12 ns under industrial temperature conditions (−40°C to +85°C) and 3.3V ±0.3V supply. This value is measured from address valid to data valid (tAA) and applies to all operating conditions specified in the Renesas datasheet R10DS0283EJ0100 Rev.1.00. The R1RW0416DSB-2PI#D1 achieves this timing using optimized CMOS circuit design without requiring external clocks or timing constraints beyond standard control signal setup/hold windows.
Does R1RW0416DSB-2PI#D1 support partial-word writes?
Yes, the R1RW0416DSB-2PI#D1 supports true 8-bit partial-word writes via dedicated UB# (upper byte) and LB# (lower byte) control inputs. When LB# is asserted low and UB# remains high, only I/O1–I/O8 accept data; conversely, asserting UB# low while LB# stays high writes only to I/O9–I/O16. This functionality is confirmed in the Operation Table and AC Characteristics section of the R1RW0416DSB-2PI#D1 datasheet and requires no external logic or bus arbitration.
What is the standby current consumption of R1RW0416DSB-2PI#D1?
The R1RW0416DSB-2PI#D1 offers two standby current modes: 40 mA maximum in TTL-compatible standby (ISB) and 5 mA maximum in CMOS standby (ISB1). The 5 mA mode activates under specific input bias conditions - CS# held high while all other inputs are either at VSS or within 0.2V of VCC - enabling ultra-low-power retention in battery-backed or energy-sensitive applications. Both values are tested per the DC Characteristics table in the official R1RW0416DSB-2PI#D1 datasheet.
Is R1RW0416DSB-2PI#D1 pin-compatible with other members of the R1RW0416DI Series?
Yes, the R1RW0416DSB-2PI#D1 shares identical 44-pin TSOPII pinout and signal definitions with all R1RW0416DI Series variants, including R1RW0416DGE-2PI and R1RW0416DSB-0PI. Pin functions - A0–A17, I/O1–I/O16, CS#, OE#, WE#, UB#, LB#, VCC, VSS, and NC - are electrically and physically consistent across the family. This allows direct substitution based on access time requirements without PCB modification, provided the target application tolerates the selected timing grade.
What package type does R1RW0416DSB-2PI#D1 use?
The R1RW0416DSB-2PI#D1 uses a 400-mil 44-pin plastic Thin Small Outline Package II (TSOPII), a surface-mount package with gull-wing leads and standardized JEDEC MO-118AC dimensions. This package is explicitly listed in the Ordering Information table of the R1RW0416DSB-2PI#D1 datasheet and differs from the SOJ variant used by R1RW0416DGE-2PI. The TSOPII footprint supports high-density routing and reflow soldering in automated assembly lines.
R1RW0416DSB-2PI#D1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
R1RW0416DSB-2PI#D1 FAQ
1.How can I place an order for R1RW0416DSB-2PI#D1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R1RW0416DSB-2PI#D1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R1RW0416DSB-2PI#D1 reliable?
The price and inventory of R1RW0416DSB-2PI#D1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R1RW0416DSB-2PI#D1 is usually 5 days.
3.What payment methods are accepted for R1RW0416DSB-2PI#D1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R1RW0416DSB-2PI#D1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R1RW0416DSB-2PI#D1?
R1RW0416DSB-2PI#D1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R1RW0416DSB-2PI#D1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R1RW0416DSB-2PI#D1?
For technical support, including R1RW0416DSB-2PI#D1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R1RW0416DSB-2PI#D1 requirements.
6.How does Aetrix verify that R1RW0416DSB-2PI#D1 is sourced from the original manufacturer or authorized distributors?
All R1RW0416DSB-2PI#D1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R1RW0416DSB-2PI#D1 meets industry standards.
7.What is the process for return or replacement of R1RW0416DSB-2PI#D1?
All R1RW0416DSB-2PI#D1 units undergo pre-shipment inspection (PSI). If there is an issue with R1RW0416DSB-2PI#D1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R1RW0416DSB-2PI#D1 part is unused and in its original packaging.
Return procedure for R1RW0416DSB-2PI#D1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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