Renesas R5F100LDGFB#30

Overview

R5F100LDGFB#30 from Renesas is a 64-pin LFQFP-packaged RL78/G13 16-bit microcontroller with 512 KB flash, 8 KB data flash, and 32 KB RAM, operating at up to 32 MHz (41 DMIPS), featuring ultra-low-power operation (66 μA/MHz active, 0.57 μA RTC+LVD mode), 10-bit ADC (26 channels), real-time clock, and multiple serial interfaces (UART, I²C, CSI) for industrial control and sensor node applications.

For engineers reviewing the R5F100LDGFB#30 datasheet, R5F100LDGFB#30 pinout, R5F100LDGFB#30 application, or R5F100LDGFB#30 equivalent, key selection criteria include its industrial-grade temperature range (−40°C to +105°C), integrated data flash with 1M rewrite cycles, hardware multiplier/divider, DMA controller (4 channels), and support for SNOOZE mode for low-latency wake-up in battery-powered systems.

Technical Context

The R5F100LDGFB#30 implements the RL78 CPU core with a 3-stage pipeline CISC architecture, supporting instruction execution times from 0.03125 μs (32 MHz high-speed mode) to 30.5 μs (32.768 kHz subsystem clock). It integrates on-chip power management including HALT, STOP, and SNOOZE modes, plus a voltage detector with 14 selectable LVD levels and POR circuitry.

Its peripheral set includes eight 16-bit timers, one 12-bit interval timer, one calendar-capable real-time clock with alarm and correction, a watchdog timer with dedicated low-speed oscillator, and three to ten I²C/Simplified I²C channels - all configurable via register-based control without external components.

Key Specifications

Pinout & Package

64-pin LFQFP package (10 × 10 mm, 0.5-mm pitch), RoHS-compliant, moisture sensitivity level (MSL) 3 per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F100LDGFB#30, the #50 variant offers identical functionality with tape-and-reel packaging for production efficiency, while R5F101LDGFB#30 removes data flash to lower unit cost - making it viable only when external nonvolatile storage or infrequent updates eliminate the need for on-chip data retention.

Availability

R5F100LDGFB#30 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, and building automation panels requiring stable component supply, long-term lifecycle support, and guaranteed G-grade temperature compliance.

Supply support for R5F100LDGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RL78/G13 family delivers ultra-low-power 16-bit MCUs optimized for cost-sensitive industrial and consumer applications requiring extended battery life, robust peripheral integration, and seamless toolchain support with e² studio and CS+.

FAQ

What is the maximum operating frequency and performance of the R5F100LDGFB#30?

The R5F100LDGFB#30 operates at up to 32 MHz using its high-speed on-chip oscillator, delivering 41 DMIPS of processing performance. Its RL78 CPU core features a 3-stage pipeline and supports variable instruction timing - from 0.03125 μs at full speed to 30.5 μs in ultra-low-power subsystem clock mode - enabling precise trade-offs between throughput and energy consumption in the R5F100LDGFB#30 design.

Does the R5F100LDGFB#30 include integrated data flash memory, and what are its endurance specifications?

Yes, the R5F100LDGFB#30 integrates 8 KB of on-chip data flash memory with background operation (BGO) support, allowing program execution during rewrites. It guarantees 1,000,000 write/erase cycles (typical) across the full VDD range of 1.8 V to 5.5 V. The flash library reserves RAM starting at address F7F00H for safe self-programming operations in the R5F100LDGFB#30.

What package type and pin count does the R5F100LDGFB#30 use, and is it RoHS compliant?

The R5F100LDGFB#30 uses a 64-pin LFQFP package (10 × 10 mm, 0.5-mm pitch) with exposed pad for thermal dissipation. It is RoHS-compliant and rated MSL-3 per JEDEC J-STD-020. The "FB" suffix explicitly denotes the LFQFP body, and the "#30" indicates tray packaging - confirming mechanical and assembly compatibility for standard SMT processes in the R5F100LDGFB#30 implementation.

What industrial temperature range is supported by the R5F100LDGFB#30, and how is it indicated in the part number?

The R5F100LDGFB#30 is qualified for −40°C to +105°C operation, denoted by the "G" in its part number (R5F100LDGFB#30), where "G" specifies industrial-grade ambient temperature. This distinguishes it from "A" (−40°C to +85°C, consumer) and "D" (−40°C to +85°C, industrial) variants, ensuring reliable operation in demanding environments such as factory floors or outdoor utility installations for the R5F100LDGFB#30.

Which low-power modes are available on the R5F100LDGFB#30, and what is the lowest achievable current draw?

The R5F100LDGFB#30 supports HALT, STOP, and SNOOZE low-power modes. In STOP mode with only RTC and LVD active, it achieves 0.57 μA typical current draw - the lowest operational state retaining timekeeping and voltage monitoring. SNOOZE mode enables selective peripheral wake-up (e.g., UART, I²C) with sub-microsecond latency while maintaining RAM retention, making it ideal for responsive battery-powered designs using the R5F100LDGFB#30.