Renesas R5F104GJGNA#20

Overview

R5F104GJGNA#20 from Renesas is a 48-pin HWQFN-packaged 16-bit RL78/G14 microcontroller with 192 KB flash, 8 KB data flash, and 20 KB RAM, operating at 32 MHz (44 DMIPS), featuring ultra-low-power operation (66 μA/MHz active, 0.60 μA RTC+LVD mode), integrated 10-bit ADC (20 channels), UART/SPI/I²C interfaces, and real-time clock - deployed in industrial sensor nodes and battery-powered control modules.

For engineers reviewing the R5F104GJGNA#20 datasheet, R5F104GJGNA#20 pinout, R5F104GJGNA#20 application, or R5F104GJGNA#20 equivalent, this page delivers verified package mapping (HWQFN-48, 0.5 mm pitch), confirmed pin functions per Renesas R01DS0053EJ0370, exact memory configuration (192 KB code flash / 8 KB data flash / 20 KB RAM), and validated alternative options for industrial-grade embedded designs requiring extended temperature support (−40°C to +105°C).

Technical Context

The R5F104GJGNA#20 implements the RL78 CPU core with 3-stage pipeline CISC architecture, supporting instruction execution times from 0.03125 µs (32 MHz high-speed mode) to 30.5 µs (32.768 kHz ultra-low-speed mode), plus multiply/divide/accumulate instructions and 1 MB address space. It integrates a 12-bit interval timer, calendar-based RTC with alarm and correction, and watchdog timer powered by dedicated low-speed oscillator.

Peripheral subsystems include Data Transfer Controller (DTC) with chain transfer, Event Link Controller (ELC) linking up to 26 event sources to peripherals, and simplified SPI (CSI), UART/LIN, and I²C interfaces totaling 17 serial channels across configurable instances - all operating within 1.6–5.5 V supply range and −40°C to +105°C ambient temperature (G-grade).

Key Specifications

Pinout & Package

Package: HWQFN-48, 7 × 7 mm body, 0.5 mm pitch, exposed die pad (recommended connection to VSS).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F104GJGNA#20, R5F104GLGNA#20 offers scalable memory for evolving firmware, while R5F104GJGFB#30 provides identical electrical behavior in a different mechanical form factor - both retain full peripheral compatibility, G-grade qualification, and RL78/G14 instruction set alignment.

Availability

R5F104GJGNA#20 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, wireless sensor nodes, and PLC I/O modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F104GJGNA#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RL78/G14 product line delivers true low-power 16-bit MCUs optimized for cost-sensitive industrial and consumer applications demanding high integration, extended temperature operation, and robust firmware security features.

FAQ

What is the maximum operating frequency and corresponding DMIPS rating for the R5F104GJGNA#20?

The R5F104GJGNA#20 operates at up to 32 MHz with a measured performance of 44 DMIPS. This value is derived from the RL78 CPU core's 3-stage pipeline architecture and instruction mix benchmarking per Renesas documentation. The R5F104GJGNA#20 achieves this performance within its 1.6–5.5 V supply range and −40°C to +105°C operating envelope.

Does the R5F104GJGNA#20 support background data flash rewriting while executing code from main flash?

Yes, the R5F104GJGNA#20 supports background operation (BGO) for data flash. Instructions can be fetched and executed from code flash memory while simultaneously rewriting the 8 KB data flash area. This capability is confirmed in the R01DS0053EJ0370 datasheet and enables seamless firmware updates or parameter logging without halting application execution.

What package type and pin count does the R5F104GJGNA#20 use, and is the exposed die pad electrically connected?

The R5F104GJGNA#20 uses a 48-pin HWQFN package (7 × 7 mm, 0.5 mm pitch) with an exposed die pad. Per Renesas R01DS0053EJ0370 Section 1.3.6, the exposed pad is recommended to be connected to VSS for optimal thermal and electrical performance - it is not left floating and serves as a supplementary ground path.

Which analog peripherals are integrated into the R5F104GJGNA#20, and what are their key specifications?

The R5F104GJGNA#20 integrates a 10-bit A/D converter with up to 20 input channels, internal 1.45 V reference voltage, and temperature sensor. It also includes an 8-bit D/A converter (up to two channels, 0–VDD output range) and up to two comparators with selectable internal/external reference and window mode. All are fully operational across the −40°C to +105°C temperature range.

How does the Event Link Controller (ELC) enhance real-time performance in the R5F104GJGNA#20?

The ELC in the R5F104GJGNA#20 enables direct hardware-level linking of 19–26 event sources (e.g., timer overflow, ADC end-of-conversion) to peripheral functions (e.g., trigger ADC scan, start DMA transfer) without CPU involvement. This reduces interrupt latency, lowers CPU utilization, and improves deterministic timing - critical for motor control and sensor synchronization tasks in the R5F104GJGNA#20.