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Renesas R5F11AGGDNB#20

Part No.:
R5F11AGGDNB#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-WFQFN Exposed Pad
Datasheet:
AetrixR5F11AGGDNB#20.pdf
Description:
IC MCU 16BIT 128KB FLASH 48HWQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,203

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Product details

Overview

R5F11AGGDNB#20 from Renesas Electronics is a Bluetooth Low Energy 4.2 single-mode SoC MCU integrating the 16-bit RL78-S2 CPU core, on-chip 2.4 GHz RF transceiver, 192 KB flash, 16 KB RAM, and 8 KB data flash. It operates from 1.6 V to 3.6 V across –40°C to +85°C and targets battery-powered BLE peripherals such as wireless sensors and wearable health monitors.

For engineers reviewing the R5F11AGGDNB#20 datasheet, R5F11AGGDNB#20 pinout, R5F11AGGDNB#20 application, or R5F11AGGDNB#20 equivalent, key selection criteria include its integrated RF transceiver with AES encryption, ultra-low-power STOP mode (0.3 μA RF sleep), 48-pin HWQFN package, and support for Bluetooth SIG qualification-ready firmware stacks.

Technical Context

The R5F11AGGDNB#20 implements a dual-domain architecture: an RL78-S2 CPU subsystem with Harvard CISC pipeline and configurable clocking (32 MHz max), and a dedicated RF unit with GFSK modulation, frequency hopping, and hardware AES-128. The RF block uses separate analog/digital power domains (VDD_RF/AVDD_RF/VSS_RF/AVSS_RF) and requires external matching network connection via ANT pin.

Its timing architecture includes three independent clock sources: high-speed on-chip oscillator (1–32 MHz), crystal-based main system clock (1–20 MHz), and 32.768 kHz subsystem/RF slow clock - enabling precise RTC operation and low-jitter BLE advertising intervals while maintaining sub-μA standby current in POWER_DOWN mode.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RL78-S2 CISC with 3-stage pipeline and 1-cycle 16×16 multiply-accumulate
Flash / RAM / Data Flash192 KB code flash, 16 KB RAM, 8 KB background-operable data flash (1M erase cycles)
Bluetooth ComplianceBluetooth v4.2 Low Energy Single Mode certified RF transceiver (2.4 GHz ISM, GFSK, TDMA/TDD)
Power ConsumptionRF transmit: 4.3 mA (TYP.), RF receive: 3.5 mA (TYP.), RF POWER_DOWN: 0.3 μA (TYP.)
Operating Range1.6 V to 3.6 V supply; –40°C to +85°C ambient; 48-pin HWQFN (6 × 6 mm, 0.4 mm pitch)
Analog Peripherals8-channel 8/10-bit ADC (1.6–3.6 V range), internal 1.45 V reference, and temperature sensor
Communication Interfaces2× UART, 2× CSI, 2× simplified I²C, 1× full I²C, 4-channel DMA, and on-chip debug (1-wire)

Pinout & Package

Package: 48-pin HWQFN (6 × 6 mm, 0.4 mm pitch), exposed die pad (GND1) requiring solder connection to PCB ground plane per datasheet layout guidance.

Pin/TerminalCircuit RoleDesign Meaning
ANTRF antenna interfaceSingle-ended 50 Ω RF output requiring external matching network and balun for antenna coupling
XTAL1_RF / XTAL2_RFRF crystal oscillator inputsDedicated 32 MHz crystal connection for RF baseband timing; must be isolated from main system clock domain
VDD_RF / AVDD_RF / VSS_RF / AVSS_RFRF power and ground railsSeparate analog/digital supply and ground pins for RF section to minimize noise coupling into sensitive receiver path
GPIO0–GPIO3RF control signalsConfigurable outputs for external PA/LNA enable (TXSELH_RF/TXSELL_RF), RF clock output (CLKOUT_RF), and slow clock input (EXSLK_RF)
RFCTLENRF control enableActive-high signal to power up/down RF transceiver block independently of MCU core state
DCLIN / DCLOUTDC-DC converter interfaceSupports external buck converter integration to improve efficiency during RF transmit bursts

Key Features

FeatureDesign Value
Integrated BLE 4.2 RF TransceiverEliminates need for external RF IC and discrete matching components, reducing BOM count and PCB area by >30% in compact BLE nodes
Hardware AES-128 EncryptionOffloads cryptographic processing from CPU, enabling secure pairing and encrypted attribute exchange without software latency or memory overhead
Ultra-Low-Power RF Sleep Mode0.3 μA POWER_DOWN current enables multi-year battery life in periodic-sensing applications like environmental monitors
Dual Power Domain IsolationIndependent VDD_RF/AVDD_RF and VDD/VSS supplies prevent RF switching noise from corrupting ADC measurements or digital logic states
Background Data Flash OperationEnables firmware updates over BLE without halting real-time sensor acquisition or RF advertising tasks

Applications

Wireless Health MonitorSmart Home Sensor Node

Use Scenario: Continuous ECG/temperature monitoring in portable wrist-worn devices with BLE transmission to smartphone.

IC Role / Device Role / Timing Role: Primary SoC managing analog front-end sampling, BLE advertising/connection, and secure data packetization.

Use Value: Integrated 8-channel ADC and hardware AES allow simultaneous biometric acquisition and encrypted BLE transmission at <4.3 mA peak current.

Use Scenario: Battery-powered door/window contact sensor reporting open/close events via BLE to hub every 5 minutes.

IC Role / Device Role / Timing Role: Ultra-low-power system controller handling wake-on-interrupt, RTC-triggered BLE broadcast, and deep-sleep management.

Use Value: 0.3 μA RF POWER_DOWN mode extends CR2032 battery life beyond 5 years while maintaining sub-second connection latency.

Industrial Asset TrackerBLE Beacon Transmitter

Use Scenario: GPS-denied indoor location tracking using RSSI-based proximity detection with motion-triggered BLE broadcasts.

IC Role / Device Role / Timing Role: Motion-aware BLE broadcaster with accelerometer interface and adaptive advertising interval control.

Use Value: On-chip 16-bit timer array and GPIO interrupt capability enable precise motion-detection windowing without external logic.

Use Scenario: Fixed-location iBeacon/Eddystone transmitter broadcasting UUID/major/minor identifiers at configurable intervals.

IC Role / Device Role / Timing Role: Standalone BLE advertising engine with programmable beacon payload and duty-cycled RF operation.

Use Value: Hardware-controlled RFCTLEN and POWER_DOWN mode allow deterministic 100 ms–10 s advertising intervals with no CPU intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE SoC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F11AGHDNB#20256 KB flash, 20 KB RAM, same RF and peripheral setSupports larger BLE stack + custom application firmware with OTA update buffer spaceSelect when firmware size exceeds 192 KB or advanced security features require additional RAM for crypto context storage
nRF52833-QDAAARM Cortex-M4F core, 512 KB flash, 128 KB RAM, Bluetooth 5.1, integrated DC-DCHigher throughput, longer range, mesh support, but higher active current (5.3 mA RX)Choose for complex BLE mesh nodes or applications requiring floating-point math acceleration and future-proof protocol extensions

Compared with R5F11AGGDNB#20, R5F11AGHDNB#20 offers headroom for feature-rich firmware growth without changing PCB layout, while nRF52833-QDAA delivers superior compute performance and protocol flexibility at the cost of higher power and design complexity.

Availability

R5F11AGGDNB#20 is available at Aetrix Electronics and suitable for wireless health monitors, smart home sensors, industrial asset trackers, and BLE beacon transmitters requiring stable component supply and long-term industrial temperature support.

Supply support for R5F11AGGDNB#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and connectivity solutions for automotive, industrial, and IoT markets.

The RL78/G1D product line was designed specifically for ultra-low-power Bluetooth Low Energy endpoints, integrating RF, security, and mixed-signal peripherals into a single chip to accelerate development of certified BLE products.

FAQ

What Bluetooth specification does the R5F11AGGDNB#20 support?

The R5F11AGGDNB#20 supports Bluetooth v4.2 Low Energy Single Mode, including GFSK modulation, TDMA/TDD frequency hopping, and mandatory AES-128 encryption circuitry. It is not compatible with Bluetooth Classic, BR/EDR, or Bluetooth 5.x features such as LE Long Range or LE Advertising Extensions. Full SIG qualification requires Renesas-provided BLE stack and test firmware.

Does the R5F11AGGDNB#20 require external crystals?

Yes - the R5F11AGGDNB#20 requires two external crystals: a 32.768 kHz crystal on XT1/XT2 for subsystem timing and RTC, and a 32 MHz crystal on XTAL1_RF/XTAL2_RF dedicated to the RF transceiver. The high-speed on-chip oscillator can serve as main system clock, but RF operation mandates the external 32 MHz crystal.

What is the maximum allowed supply voltage for the RF section of the R5F11AGGDNB#20?

The absolute maximum rating for VDD_RF and AVDD_RF pins of the R5F11AGGDNB#20 is +4.0 V. Operating above this voltage risks permanent damage to the RF transceiver block. Recommended operating range is 1.6 V to 3.6 V, matching the MCU's VDD range, with strict decoupling (0.1 µF + 1 µF) required per Renesas layout guidelines.

How many general-purpose I/O pins does the R5F11AGGDNB#20 provide?

The R5F11AGGDNB#20 provides 32 total I/O pins, including 20 CMOS I/O, 5 CMOS inputs, 1 CMOS output, 2 N-ch open-drain I/O (6 V tolerant), and 4 dedicated RF GPIOs (GPIO0–GPIO3). Pin functions are configurable via Peripheral I/O Redirection Register (PIOR), allowing multiplexing of serial interfaces, timers, and analog inputs across shared pins.

Can the R5F11AGGDNB#20 operate in standalone mode without external memory?

Yes - the R5F11AGGDNB#20 contains 192 KB on-chip flash, 16 KB RAM, and 8 KB data flash, eliminating the need for external memory in most BLE peripheral applications. Its self-programming capability supports secure boot swap and flash shield window protection, enabling field firmware updates without external programming hardware.

R5F11AGGDNB#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-WFQFN Exposed Pad
Series:
RL78/G1D
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RL78
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
12K x 8
Voltage - Supply (Vcc/Vdd):
1.6V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F11AGGDNB#20 FAQ

1.How can I place an order for R5F11AGGDNB#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F11AGGDNB#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F11AGGDNB#20 reliable?

The price and inventory of R5F11AGGDNB#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F11AGGDNB#20 is usually 5 days.

3.What payment methods are accepted for R5F11AGGDNB#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F11AGGDNB#20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F11AGGDNB#20?

R5F11AGGDNB#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F11AGGDNB#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F11AGGDNB#20?

For technical support, including R5F11AGGDNB#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F11AGGDNB#20 requirements.

6.How does Aetrix verify that R5F11AGGDNB#20 is sourced from the original manufacturer or authorized distributors?

All R5F11AGGDNB#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F11AGGDNB#20 meets industry standards.

7.What is the process for return or replacement of R5F11AGGDNB#20?

All R5F11AGGDNB#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F11AGGDNB#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F11AGGDNB#20 part is unused and in its original packaging.

Return procedure for R5F11AGGDNB#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F11AGGDNB#20 Tags

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