Renesas R5F11AGHDNB#20
- Part No.:
- R5F11AGHDNB#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-WFQFN Exposed Pad
- Datasheet:
-
R5F11AGHDNB#20.pdf
- Description:
- IC MCU 16BIT 192KB FLASH 48HWQFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,655
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Product details
Overview
R5F11AGHDNB#20 from Renesas Electronics is a Bluetooth Low Energy 4.2 single-mode microcontroller integrating the 16-bit RL78-S2 CPU core, on-chip 2.4 GHz RF transceiver, 256 KB flash memory, 20 KB RAM, and 8 KB data flash. It operates from 1.6 V to 3.6 V across –40°C to +85°C and targets ultra-low-power wearable sensors and BLE peripheral devices.
For engineers reviewing the R5F11AGHDNB#20 datasheet, R5F11AGHDNB#20 pinout, R5F11AGHDNB#20 application, or R5F11AGHDNB#20 equivalent, key selection considerations include its integrated RF transceiver with AES encryption, 0.3 μA RF sleep current, 48-pin HWQFN package, and support for Bluetooth v4.2 LE slave operation in industrial ambient conditions.
Technical Context
The R5F11AGHDNB#20 implements a Harvard-architecture RL78-S2 CPU with 3-stage pipeline, supporting instruction execution times from 0.03125 μs (32 MHz HS mode) to 30.5 μs (32.768 kHz subsystem clock). Its RF unit uses GFSK modulation in the 2.4 GHz ISM band with TDMA/TDD frequency hopping and built-in AES encryption circuitry.
It integrates dual power domains: MCU core (VDD/VSS) and RF analog section (VDD_RF/AVDD_RF/VSS_RF/AVSS_RF), with dedicated RF pins including ANT, XTAL1_RF/XTAL2_RF, GPIO0–GPIO3, RFCTLEN, and DCLOUT/DCLIN. The device supports adaptivity exclusively in slave-mode operation and features a single-ended RF interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RL78-S2 CISC Harvard CPU with 3-stage pipeline and multiply-accumulate capability |
| Flash / RAM / Data Flash | 256 KB main flash (1 KB blocks), 20 KB RAM, 8 KB background-operable data flash (1 million erase cycles) |
| RF Compliance | Bluetooth v4.2 Low Energy Single Mode only; 2.4 GHz ISM band, GFSK, TDMA/TDD, AES encryption included |
| Power Consumption | RF transmit: 4.3 mA (TYP); RF receive: 3.5 mA (TYP); RF POWER_DOWN: 0.3 μA (TYP) |
| Operating Range | 1.6 V to 3.6 V supply; –40°C to +85°C ambient; supports DC-DC converter (VDD ≥ 1.8 V required) |
| Clock Sources | High-speed on-chip oscillator (1–32 MHz), 32.768 kHz on-chip RF slow clock, external XT1/XT2, and RF crystal (XTAL1_RF/XTAL2_RF) |
| Analog Peripherals | 8-channel 8/10-bit ADC (1.6–3.6 V range), internal 1.45 V reference, and temperature sensor |
Pinout & Package
Package: 48-pin HWQFN (6 × 6 mm, 0.4 mm pitch), exposed die pad (GND1), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ANT | RF Antenna Interface | Single-ended RF output requiring matching network to 50 Ω antenna; no internal PA/LNA |
| XTAL1_RF / XTAL2_RF | RF Crystal Oscillator Inputs | Dedicated 32 MHz crystal connection for RF baseband timing; accuracy ±20 ppm |
| GPIO0 / GPIO1 / GPIO2 / GPIO3 | RF Subsystem General-Purpose I/O | Control signals for external PA/LNA (TXSELH_RF/TXSELL_RF), RF clock output (CLKOUT_RF), and slow clock input (EXSLK_RF) |
| RFCTLEN | RF Control Enable | Active-high signal enabling RF transceiver operation; must be asserted before RF use |
| VDD_RF / AVDD_RF / VSS_RF / AVSS_RF | RF Power and Ground Domains | Isolated analog/digital RF supply rails decoupled separately from MCU VDD/VSS to minimize noise coupling |
| DCLOUT / DCLIN | DC-DC Converter Interface | DCLOUT supplies regulated voltage to RF block; DCLIN connects external inductor/capacitor for boost conversion |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE 4.2 Transceiver | Eliminates need for external RF IC and discrete matching components; reduces BOM count and PCB area |
| Ultra-Low RF Sleep Current | 0.3 μA in POWER_DOWN mode enables multi-year battery life in coin-cell-powered BLE peripherals |
| Hardware AES Encryption | Dedicated on-die AES engine accelerates link-layer security without CPU overhead or software vulnerability exposure |
| RF-Optimized Power Domains | Separate VDD_RF/AVDD_RF and VSS_RF/AVSS_RF rails prevent digital switching noise from degrading RF sensitivity |
| Background Data Flash Operation | Enables firmware updates or parameter logging during active application execution without interrupting real-time tasks |
Applications
| Wireless Health Monitor | Smart Home Sensor Node |
|---|---|
Use Scenario: Compact wearable device measuring heart rate and motion, transmitting encrypted biometric data to smartphone via BLE. IC Role / Device Role / Timing Role: Primary system controller and BLE radio; RTC provides accurate timestamping for sensor logs. Use Value: Integrated RF + 256 KB flash enables local data buffering and secure transmission without external memory or transceiver, reducing size and power. | Use Scenario: Battery-powered door/window contact sensor reporting open/close events and ambient temperature to hub. IC Role / Device Role / Timing Role: Standalone sensor node with wake-on-interrupt, low-power BLE advertising, and 32.768 kHz RTC for periodic wake-up. Use Value: 0.3 μA RF sleep current extends CR2032 battery life beyond 5 years; GPIO0/GPIO1 control external LNA for improved range in wall-penetrating environments. |
| Industrial Asset Tracker | BLE Beacon Transmitter |
Use Scenario: Ruggedized GPS-less tracker logging location via BLE proximity to fixed gateways in warehouse or factory. IC Role / Device Role / Timing Role: Edge-processing node performing motion-triggered BLE broadcast and local event storage in data flash. Use Value: 8-channel ADC reads onboard accelerometer and temperature; 20 KB RAM buffers burst sensor data before BLE transmission. | Use Scenario: Small-form-factor iBeacon/Eddystone transmitter embedded in retail signage or equipment tags. IC Role / Device Role / Timing Role: Dedicated BLE advertising source with programmable TX power and interval; uses high-speed on-chip oscillator for precise timing. Use Value: No external crystal needed for basic beacon function (uses 32 MHz on-chip oscillator); 48-pin QFN allows compact 6×6 mm PCB footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52833 DK | ARM Cortex-M4F core, 512 KB flash, 128 KB RAM, supports BLE 5.1 and Thread/Zigbee; requires external crystal for full spec | Broad multi-protocol support vs. R5F11AGHDNB#20's BLE 4.2-only focus; higher memory and compute headroom | Select when future protocol expansion or complex edge processing is required; not drop-in compatible due to architecture and pinout differences |
| CC2642R1F | ARM Cortex-M4F, 352 KB flash, 80 KB RAM, BLE 5.0 + IEEE 802.15.4; integrated RF balun and DC-DC | Higher RF output power (+5 dBm), integrated RF front-end reduces external component count | Prefer for longer-range or regulatory-certified designs where RF performance margin is critical; different power domain structure and debug interface |
Compared with nRF52833 DK and CC2642R1F, the R5F11AGHDNB#20 offers lower system cost and simpler layout for BLE 4.2–only applications, with deterministic low-power behavior and industrial temperature rating out-of-box-no RF calibration or protocol stack porting required.
Availability
R5F11AGHDNB#20 is available at Aetrix Electronics and suitable for wireless health monitors, smart home sensor nodes, and industrial asset trackers requiring stable component supply, long-term industrial temperature support, and integrated BLE 4.2 compliance.
Supply support for R5F11AGHDNB#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.
The RL78/G1D product line was designed specifically for ultra-low-power Bluetooth Low Energy peripheral devices, combining an energy-efficient RL78 CPU with a certified BLE 4.2 RF transceiver in a single chip to reduce system complexity and certification effort.
FAQ
Does R5F11AGHDNB#20 support Bluetooth 5.x features such as increased data rate or extended range?
No. The R5F11AGHDNB#20 implements Bluetooth v4.2 Low Energy Single Mode only. It does not support Bluetooth 5.0 or later features including 2 Mbps PHY, coded PHY, or advertising extensions. Its RF transceiver is hardware- and firmware-locked to v4.2 LE specifications per the Renesas datasheet R01DS0258EJ0130.
What is the maximum allowed operating voltage for the RF section (VDD_RF) of R5F11AGHDNB#20?
The absolute maximum rating for VDD_RF is +4.0 V, as specified in Section 2.1 Absolute Maximum Ratings of the R5F11AGHDNB#20 datasheet. Operating above this voltage risks permanent damage. For reliable operation, VDD_RF must be maintained between 1.6 V and 3.6 V, matching the MCU VDD supply range.
Can R5F11AGHDNB#20 operate as a Bluetooth LE master device?
No. The R5F11AGHDNB#20 RF transceiver supports adaptivity exclusively in slave-mode operation, as explicitly stated in the datasheet Feature list and Block Diagram sections. It cannot initiate connections or act as a central/master device; it is designed solely for peripheral/slave roles in BLE networks.
Is an external crystal required for R5F11AGHDNB#20 RF operation?
Yes. The R5F11AGHDNB#20 requires a 32 MHz crystal connected to XTAL1_RF and XTAL2_RF pins for RF baseband timing. While the MCU can use its high-speed on-chip oscillator, the RF unit mandates this external crystal for Bluetooth v4.2 compliance and frequency accuracy (±20 ppm), as confirmed in Section 2.3.1 of the datasheet.
What debug interface does R5F11AGHDNB#20 provide, and is it production-safe?
The R5F11AGHDNB#20 provides a 1-wire on-chip debug function via the TOOL0 pin. However, Renesas explicitly cautions against using this debug feature in mass-produced products due to potential flash memory wear-out beyond guaranteed rewrite cycles. Production units should disable or omit debug access to ensure long-term reliability.
R5F11AGHDNB#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-WFQFN Exposed Pad
- Series:
- RL78/G1D
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RL78
- Core Size:
- 16-Bit
- Speed:
- 32MHz
- Connectivity:
- CSI, I2C, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 192KB (192K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F11AGHDNB#20 FAQ
1.How can I place an order for R5F11AGHDNB#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F11AGHDNB#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F11AGHDNB#20 reliable?
The price and inventory of R5F11AGHDNB#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F11AGHDNB#20 is usually 5 days.
3.What payment methods are accepted for R5F11AGHDNB#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F11AGHDNB#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F11AGHDNB#20?
R5F11AGHDNB#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F11AGHDNB#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F11AGHDNB#20?
For technical support, including R5F11AGHDNB#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F11AGHDNB#20 requirements.
6.How does Aetrix verify that R5F11AGHDNB#20 is sourced from the original manufacturer or authorized distributors?
All R5F11AGHDNB#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F11AGHDNB#20 meets industry standards.
7.What is the process for return or replacement of R5F11AGHDNB#20?
All R5F11AGHDNB#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F11AGHDNB#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F11AGHDNB#20 part is unused and in its original packaging.
Return procedure for R5F11AGHDNB#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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