Renesas R5F11AGJDNB#20
- Part No.:
- R5F11AGJDNB#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-WFQFN Exposed Pad
- Datasheet:
-
R5F11AGJDNB#20.pdf
- Description:
- IC MCU 16BIT 256KB FLASH 48HWQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R5F11AGJDNB#20 from Renesas Electronics is a Bluetooth Low Energy 4.2 single-mode system-on-chip MCU integrating a 16-bit RL78-S2 CPU core, on-chip 2.4 GHz RF transceiver, 256 KB flash, 20 KB RAM, and 8 KB data flash. It operates from 1.6 V to 3.6 V across –40°C to +85°C and targets ultra-low-power wearable sensors and BLE peripheral nodes.
For engineers reviewing the R5F11AGJDNB#20 datasheet, R5F11AGJDNB#20 pinout, R5F11AGJDNB#20 application, or R5F11AGJDNB#20 equivalent, key selection criteria include its integrated BLE RF transceiver with AES encryption, 0.3 μA RF sleep current, 48-pin HWQFN package, and support for self-programming with secure boot swap.
Technical Context
The R5F11AGJDNB#20 implements a Harvard-architecture RL78-S2 CPU with 3-stage pipeline, supporting instruction execution times from 0.03125 μs (32 MHz HS mode) to 30.5 μs (32.768 kHz subsystem clock). Its RF unit operates in the 2.4 GHz ISM band using GFSK modulation and TDMA/TDD frequency hopping, with dedicated GPIO pins (GPIO0–GPIO3) for external PA/LNA control and antenna interface via ANT pin.
Power management includes multiple low-power modes: STOP (MCU), SNOOZE, and six-level RF power-saving modes down to 0.1 μA. The device integrates a 32.768 kHz on-chip oscillator for RF slow clock, separate AVDD_RF/VSS_RF analog supply domains, and DC-DC converter support with DCLIN/DCLOUT pins - all validated for IEC60730 and IEC61508 functional safety compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RL78-S2 CISC with 3-stage pipeline and Harvard memory architecture |
| Flash / RAM / Data Flash | 256 KB main flash (1 KB blocks), 20 KB RAM, 8 KB background-operable data flash (1 million erase cycles) |
| RF Compliance | Bluetooth v4.2 Low Energy Single Mode, 2.4 GHz ISM band, GFSK, TDMA/TDD frequency hopping, integrated AES encryption |
| Supply & Temp Range | 1.6 V to 3.6 V operation; –40°C to +85°C ambient temperature (industrial grade) |
| Low-Power Performance | RF transmitter active: 4.3 mA (TYP.), RF receiver active: 3.5 mA (TYP.), RF POWER_DOWN: 0.3 μA (TYP.) |
| Package | 48-pin HWQFN (6 × 6 mm, 0.4 mm pitch), exposed die pad (GND1) required for thermal and RF grounding |
| Clock Sources | High-speed on-chip oscillator (1–32 MHz), 32.768 kHz RF slow clock oscillator, XT1/XT2 crystal inputs, EXCLK/EXCLKS external clocks |
Pinout & Package
48-pin HWQFN (6 × 6 mm, 0.4 mm pitch) with exposed thermal pad (GND1) on underside. Requires 0.47–1 µF capacitor between REGC and VSS. RF analog domain uses separate AVDD_RF/AVSS_RF supplies; digital VDD/VSS must be decoupled independently.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ANT | RF Antenna Interface | Single-ended 50 Ω RF output requiring matching network before antenna connection |
| GPIO0/TXSELH_RF GPIO1/TXSELL_RF | RF Transmitter Control | High/low-side enable outputs for external PA/LNA; logic levels referenced to VDD_RF |
| XTAL1_RF / XTAL2_RF | RF Crystal Oscillator | 32 MHz crystal connections for RF base clock; accuracy ±20 ppm required |
| DCLOUT / DCLIN | DC-DC Converter Interface | DCLOUT supplies regulated voltage to RF block; DCLIN connects external inductor |
| REGC | Internal Regulator Capacitor | Must connect 0.47–1 µF capacitor to VSS to stabilize internal LDO for RF section |
| GND1 | Exposed Die Pad | Thermal and RF ground plane connection; must be soldered to PCB ground layer |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE RF Transceiver | Eliminates need for external RF IC and discrete matching components; reduces BOM count and layout complexity for BLE peripherals |
| Secure Boot Swap & Flash Shield | Enables field firmware updates with rollback protection and prevents unauthorized read-out of flash contents during programming |
| Dedicated RF Power Domains | Separate AVDD_RF/VSS_RF and digital VDD/VSS allow independent noise filtering and isolation critical for RF sensitivity and EMI performance |
| Hardware AES Encryption Engine | Offloads BLE link-layer encryption from CPU, reducing latency and power consumption during encrypted packet transmission/reception |
| Real-Time Clock with Calendar | Provides accurate timekeeping (full calendar + alarm + watch correction) without external RTC IC, enabling low-power wake-up scheduling |
Applications
| Wireless Health Monitor | Smart Home Sensor Node |
|---|---|
Use Scenario: Compact wearable device measuring heart rate and SpO₂, transmitting data to smartphone via BLE. IC Role / Device Role / Timing Role: Primary SoC handling sensor acquisition, signal processing, BLE protocol stack, and ultra-low-power sleep/wake timing. Use Value: Integrated RF eliminates external transceiver; 0.3 μA POWER_DOWN mode extends battery life to >1 year on coin cell. |
Use Scenario: Battery-powered door/window contact sensor reporting status to hub via BLE mesh or direct connection. IC Role / Device Role / Timing Role: System controller managing magnetic reed switch input, RTC-based periodic wake-up, and BLE advertising packets. Use Value: 256 KB flash stores full BLE stack + application logic; 8 KB data flash retains event logs across power cycles. |
| Industrial Asset Tracker | BLE Beacon Transmitter |
Use Scenario: GPS-denied indoor asset tag logging location via RSSI triangulation and transmitting telemetry over BLE. IC Role / Device Role / Timing Role: Dual-role MCU: processes accelerometer data for motion detection and manages BLE connectionless broadcast (advertising) state. Use Value: On-chip 8-channel 10-bit ADC interfaces directly to analog sensors; RF adaptivity ensures robust operation in noisy factory environments. |
Use Scenario: Fixed-location beacon broadcasting UUID, major/minor values, and calibrated TX power for proximity detection. IC Role / Device Role / Timing Role: Dedicated BLE advertiser with precise TX power control and stable 32 MHz RF clock derived from XTAL1_RF/XTAL2_RF. Use Value: Hardware AES enables encrypted beacon payloads; 4.3 mA TX current at 0 dBm meets regulatory EIRP limits while minimizing power draw. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52833 DK | ARM Cortex-M4F core, 512 KB flash, 128 KB RAM, supports Bluetooth 5.1 and Thread/Zigbee | Higher compute throughput and multi-protocol flexibility; lacks integrated high-accuracy RTC calendar and hardware AES acceleration for BLE link layer | Preferred when dual-mode wireless (BLE + Zigbee) or floating-point math is required; requires external crystal and more complex power sequencing |
| CC2642R1F | ARM Cortex-M4F, 352 KB flash, 80 KB RAM, Bluetooth 5.0, integrated DC-DC, QFN-48 package | Superior RF sensitivity (–103 dBm), higher TX power (+5 dBm), but larger footprint and no on-chip data flash for wear-leveling | Best for long-range BLE links or battery-constrained apps needing >10-year lifetime; lacks Renesas' IEC61508 certification out-of-box |
Compared with nRF52833 DK and CC2642R1F, the R5F11AGJDNB#20 delivers tighter integration of safety-certified MCU + BLE RF + data flash in a compact QFN, optimized for cost-sensitive, certified industrial BLE peripherals where deterministic low-power operation and secure firmware updates are prioritized over multi-protocol agility.
Availability
R5F11AGJDNB#20 is available at Aetrix Electronics and suitable for industrial asset tracking, wireless health monitors, smart home sensor nodes, and BLE beacon transmitters requiring stable component supply and long-term lifecycle support.
Supply support for R5F11AGJDNB#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and connectivity solutions for automotive, industrial, and IoT markets.
The RL78/G1D product line was designed specifically for ultra-low-power Bluetooth Low Energy applications, integrating RF transceiver, security engines, and robust analog peripherals into a single chip to simplify certified wireless design.
FAQ
What is the maximum operating frequency of the R5F11AGJDNB#20 CPU core?
The R5F11AGJDNB#20 features a 16-bit RL78-S2 CPU core with minimum instruction execution time of 0.03125 μs at 32 MHz (high-speed on-chip oscillator mode). It supports configurable clock sources including external crystals up to 20 MHz and internal oscillators from 15 kHz to 32 MHz, with voltage-dependent frequency limits per operating mode (HS/LS/LV).
Does the R5F11AGJDNB#20 support over-the-air (OTA) firmware updates?
Yes, the R5F11AGJDNB#20 supports secure OTA updates via its self-programming capability and flash shield window function. The secure boot swap mechanism allows dual-bank firmware storage, enabling verified rollback and atomic update switching without interrupting BLE operation or compromising flash integrity.
How is the RF section powered and isolated on the R5F11AGJDNB#20?
The R5F11AGJDNB#20 uses dedicated power domains: AVDD_RF and VDD_RF supply the RF analog and digital sections, while AVSS_RF and VSS_RF serve as their respective grounds. These must be decoupled separately from the main VDD/VSS rails. The REGC pin requires a 0.47–1 µF capacitor to VSS to stabilize the internal RF regulator.
What BLE protocol features are hardware-accelerated in the R5F11AGJDNB#20?
The R5F11AGJDNB#20 includes a hardware AES encryption engine dedicated to BLE link-layer security, accelerating pairing, encryption, and decryption operations. It also implements Bluetooth v4.2 Low Energy Single Mode with adaptive frequency hopping and GFSK modulation entirely in hardware, offloading these tasks from the CPU.
Can the R5F11AGJDNB#20 operate without an external crystal?
Yes - the R5F11AGJDNB#20 can operate using its high-speed on-chip oscillator (1–32 MHz) for the main system clock and its 32.768 kHz on-chip oscillator for the RF slow clock. However, for Bluetooth specification compliance (±20 ppm accuracy), an external 32 MHz crystal (XTAL1_RF/XTAL2_RF) is required for the RF base clock; the on-chip RF oscillator is not specified for BLE use.
R5F11AGJDNB#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-WFQFN Exposed Pad
- Series:
- RL78/G1D
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RL78
- Core Size:
- 16-Bit
- Speed:
- 32MHz
- Connectivity:
- CSI, I2C, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 20K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F11AGJDNB#20 FAQ
1.How can I place an order for R5F11AGJDNB#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F11AGJDNB#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F11AGJDNB#20 reliable?
The price and inventory of R5F11AGJDNB#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F11AGJDNB#20 is usually 5 days.
3.What payment methods are accepted for R5F11AGJDNB#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F11AGJDNB#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F11AGJDNB#20?
R5F11AGJDNB#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F11AGJDNB#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F11AGJDNB#20?
For technical support, including R5F11AGJDNB#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F11AGJDNB#20 requirements.
6.How does Aetrix verify that R5F11AGJDNB#20 is sourced from the original manufacturer or authorized distributors?
All R5F11AGJDNB#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F11AGJDNB#20 meets industry standards.
7.What is the process for return or replacement of R5F11AGJDNB#20?
All R5F11AGJDNB#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F11AGJDNB#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F11AGJDNB#20 part is unused and in its original packaging.
Return procedure for R5F11AGJDNB#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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