Renesas R5F11BBCGFP#30
- Part No.:
- R5F11BBCGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
R5F11BBCGFP#30.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,250
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Product details
Overview
R5F11BBCGFP#30 from Renesas Electronics is a 32-pin, 32 KB Flash, 4 KB Data Flash, 5.5 KB RAM RL78/G1F 16-bit microcontroller operating at up to 32 MHz with true low-power operation (66 μA/MHz active, 0.57 μA RTC+LVD), 8/10-bit ADC (13 channels), dual 8-bit DAC outputs, and integrated PGA, comparators, and LIN-capable UART - deployed in industrial sensor nodes and battery-powered control modules.
For engineers reviewing the R5F11BBCGFP#30 datasheet, R5F11BBCGFP#30 pinout, R5F11BBCGFP#30 application, or R5F11BBCGFP#30 equivalent, key selection criteria include its −40°C to +105°C industrial temperature grade, LFQFP-32 (7×7 mm, 0.8 mm pitch) package, 1.6–5.5 V single-supply operation, and support for SNOOZE mode background data flash rewriting with BGO.
Technical Context
The R5F11BBCGFP#30 implements the RL78 CPU core with CISC architecture, 3-stage pipeline, and selectable instruction timing (0.03125 μs @ 32 MHz to 30.5 μs @ 32.768 kHz). It integrates a high-accuracy ±1.0% on-chip oscillator (1–32 MHz), low-speed 15 kHz internal RC oscillator, and dedicated subsystem clock domain for RTC and LVD.
Its peripheral set includes Timer Array Unit (TAU) with 4 channels, Timer RD (2-channel PWMOPA), Timer RG, Timer RX, and Event Link Controller (ELC) supporting 22 event sources linked to peripherals - enabling deterministic, low-CPU-overhead signal processing for real-time industrial I/O control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RL78 16-bit CISC with 3-stage pipeline, 1 MB address space, 32 general-purpose registers |
| Flash Memory | 32 KB code flash (1 KB block size), supports self-programming with boot swap and flash shield window |
| Data Flash | 4 KB background operation (BGO) capable; 1,000,000 write cycles; operates at VDD = 1.8–5.5 V |
| ADC | 8/10-bit resolution, 13 analog inputs, internal 1.45 V reference and temperature sensor |
| DAC | Two 8-bit outputs (ANO0, ANO1), 0 V to VDD range, real-time output capability |
| Operating Temp | −40°C to +105°C (industrial grade G suffix), VDD = 1.6–5.5 V (−40°C to +85°C), 2.4–5.5 V (+105°C) |
| Low-Power Modes | HALT (0.57 μA), STOP (0.23 μA), SNOOZE (retains RAM, clocks select peripherals during flash rewrite) |
Pinout & Package
Package: 32-pin LFQFP (7 × 7 mm, 0.8 mm pitch), lead-free, RoHS-compliant. Pin 1 marked by index notch; REGC requires 0.47–1 μF capacitor to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Main digital supply (1.6–5.5 V); powers CPU, RAM, and most peripherals |
| VSS | Ground | Digital ground reference; must be connected to system GND plane |
| RESET | Reset input | Active-low asynchronous reset; internal POR/LVD also triggers reset |
| P00/P01 | Analog I/O | ANI17/TI00 and ANI16/TO00 - dual-function pins supporting timer capture and 10-bit ADC input |
| P10–P17 | Port 1 I/O | 8-bit bidirectional port with N-ch open-drain option, pull-up resistors, and key interrupt support |
| P50/P51 | UART0 interface | RxD0/TxD0 with LIN-bus support; enables automotive-grade serial diagnostics and control |
| REGC | Regulator capacitor | Connects to VSS via 0.47–1 μF ceramic capacitor to stabilize internal voltage regulator |
Key Features
| Feature | Design Value |
|---|---|
| True Low-Power Platform | 66 μA/MHz active current and 0.57 μA RTC+LVD retention enables multi-year battery life in remote sensors |
| Background Data Flash Rewrite | BGO allows full CPU execution from code flash while updating 4 KB data flash - no firmware interruption required |
| Integrated Analog Subsystem | 13-channel ADC, dual 8-bit DAC, 2-channel comparator, and 1-channel PGA eliminate external signal-conditioning ICs |
| LIN-Bus UART | Hardware LIN protocol support on UART0 enables direct connection to automotive body electronics networks |
| Event Link Controller (ELC) | 22 configurable event sources trigger peripheral actions without CPU intervention - reduces latency and ISR overhead |
Applications
| Industrial Sensor Node | Smart Thermostat Control |
|---|---|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data over RS-485 or sub-GHz RF every 10 seconds. IC Role / Device Role / Timing Role: Main controller managing ADC sampling, RTC-triggered wake-up, low-power sleep sequencing, and UART/SCI communication. Use Value: SNOOZE mode enables ADC conversion and data flash logging during deep sleep; 0.57 μA RTC+LVD extends 2xAA battery life beyond 5 years. | Use Scenario: Residential HVAC controller with local display, push-button UI, and wireless connectivity. IC Role / Device Role / Timing Role: System-on-chip handling touch-key scanning, thermistor-based temperature acquisition, DAC-driven analog output to HVAC actuators, and IrDA remote interface. Use Value: Integrated PGA amplifies weak thermistor signals; dual DACs drive 0–10 V HVAC control lines directly; key interrupt + ELC reduce polling overhead by 70%. |
| Programmable Logic Controller (PLC) I/O Module | Industrial Motor Monitor |
Use Scenario: DIN-rail mounted digital I/O expansion module interfacing with 24 V DC field devices. IC Role / Device Role / Timing Role: Real-time I/O manager with isolated input debouncing, LED status control, and Modbus RTU over UART1. Use Value: 13-channel ADC monitors supply rail health and internal temps; 16-bit timers generate precise PWM for status LEDs; ELC synchronizes input capture with output update. | Use Scenario: Compact enclosure monitoring motor current, vibration (via piezo sensor), and winding temperature. IC Role / Device Role / Timing Role: Signal acquisition hub performing simultaneous ADC sampling, comparator-based overcurrent detection, and RTC-stamped fault logging. Use Value: Dual comparators detect fast overcurrent events (<1 μs response); internal temperature sensor validates thermal shutdown thresholds; data flash stores 10,000+ timestamped fault records. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F11BBEGFP#30 | 64 KB code flash (vs. 32 KB), same package, peripherals, and temp grade | Suitable where firmware complexity exceeds 32 KB or future OTA updates require headroom | Select when >32 KB application code or secure bootloader space is required; otherwise R5F11BBCGFP#30 offers optimal cost/performance balance. |
| RL78/G13 R5F10DLGFP#30 | Same RL78 core, 64 KB flash, but lacks PGA, only 1 DAC channel, and no LIN UART | Applicable in simpler control tasks without analog signal conditioning or automotive comms | Choose only if PGA/DAC count and LIN are unnecessary; R5F11BBCGFP#30 provides superior analog integration and automotive readiness. |
Compared with R5F11BBEGFP#30, the R5F11BBCGFP#30 trades 32 KB of flash capacity for lower unit cost and smaller memory footprint - ideal for fixed-function industrial controllers. Against RL78/G13 R5F10DLGFP#30, it delivers higher analog integration and LIN compliance at identical package and pinout, reducing BOM count and design risk.
Availability
R5F11BBCGFP#30 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostat control, and PLC I/O modules requiring stable component supply across extended product lifecycles.
Supply support for R5F11BBCGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with over 40 years of MCU innovation.
The RL78/G1F product line targets cost-sensitive, ultra-low-power industrial and consumer applications demanding robust analog integration, functional safety readiness, and long-term supply stability - optimized for sensor fusion, motor control, and human-machine interface systems.
FAQ
What is the maximum operating frequency and corresponding power consumption of the R5F11BBCGFP#30?
The R5F11BBCGFP#30 operates at up to 32 MHz using the high-speed on-chip oscillator. At this frequency and VDD = 3.3 V, typical active current is 66 μA/MHz - resulting in ~2.1 mA total. In STOP mode, it draws just 0.23 μA, and in HALT mode with RTC + LVD enabled, consumption drops to 0.57 μA. These values are measured per Renesas R01DS0246EJ0130 Rev.1.30 specifications.
Does the R5F11BBCGFP#30 support LIN bus communication, and which peripheral handles it?
Yes, the R5F11BBCGFP#30 supports LIN bus communication via its UART0 peripheral, which includes hardware LIN protocol features such as automatic sync-break detection, checksum calculation, and identifier filtering. This capability is confirmed in Section 1.1 Features and Table 1-1 of the R01DS0246EJ0130 datasheet, and applies specifically to the R5F11BBCGFP#30 variant.
How many analog-to-digital converter (ADC) channels does the R5F11BBCGFP#30 provide, and what resolutions are supported?
The R5F11BBCGFP#30 integrates an 8/10-bit successive-approximation ADC with 13 analog input channels (ANI0–ANI7, ANI16–ANI20). Resolution is software-selectable per conversion, and the module supports internal 1.45 V reference and temperature sensor input. This configuration is specified for 32-pin RL78/G1F devices in Section 1.6 Outline of Functions, Page 14 of R01DS0246EJ0130.
What packaging and pin pitch does the R5F11BBCGFP#30 use, and is it RoHS-compliant?
The R5F11BBCGFP#30 uses a 32-pin LFQFP package measuring 7 × 7 mm with 0.8 mm pin pitch, as defined in Figure 1-1 and Table 1-1 of R01DS0246EJ0130. It is lead-free and RoHS-compliant, with ordering code suffix "FP" denoting LFQFP and "#30" indicating tray packaging. The exposed die pad is not present in this variant - unlike HWQFN packages - and no thermal pad grounding is required.
Can the R5F11BBCGFP#30 perform background data flash rewriting while executing code from main flash memory?
Yes, the R5F11BBCGFP#30 supports Background Operation (BGO) for data flash rewriting. While code executes from main flash, the data flash (4 KB) can be rewritten - including erase and program operations - without halting CPU execution. This feature is documented in Section 1.1 Features and confirmed for all RL78/G1F variants, including R5F11BBCGFP#30, with 1,000,000 write cycles rated at VDD = 1.8–5.5 V.
R5F11BBCGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 32-LQFP
- Series:
- RL78/G1F
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- RL78
- Core Size:
- 16-Bit
- Speed:
- 32MHz
- Connectivity:
- CSI, I2C, IrDA, LINbus, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 5.5K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 13x8/10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F11BBCGFP#30 FAQ
1.How can I place an order for R5F11BBCGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F11BBCGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F11BBCGFP#30 reliable?
The price and inventory of R5F11BBCGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F11BBCGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F11BBCGFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F11BBCGFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F11BBCGFP#30?
R5F11BBCGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F11BBCGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F11BBCGFP#30?
For technical support, including R5F11BBCGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F11BBCGFP#30 requirements.
6.How does Aetrix verify that R5F11BBCGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F11BBCGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F11BBCGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F11BBCGFP#30?
All R5F11BBCGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F11BBCGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F11BBCGFP#30 part is unused and in its original packaging.
Return procedure for R5F11BBCGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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