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Renesas R5F11BBCGFP#30

Part No.:
R5F11BBCGFP#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixR5F11BBCGFP#30.pdf
Description:
IC MCU 16BIT 32KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,250

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Product details

Overview

R5F11BBCGFP#30 from Renesas Electronics is a 32-pin, 32 KB Flash, 4 KB Data Flash, 5.5 KB RAM RL78/G1F 16-bit microcontroller operating at up to 32 MHz with true low-power operation (66 μA/MHz active, 0.57 μA RTC+LVD), 8/10-bit ADC (13 channels), dual 8-bit DAC outputs, and integrated PGA, comparators, and LIN-capable UART - deployed in industrial sensor nodes and battery-powered control modules.

For engineers reviewing the R5F11BBCGFP#30 datasheet, R5F11BBCGFP#30 pinout, R5F11BBCGFP#30 application, or R5F11BBCGFP#30 equivalent, key selection criteria include its −40°C to +105°C industrial temperature grade, LFQFP-32 (7×7 mm, 0.8 mm pitch) package, 1.6–5.5 V single-supply operation, and support for SNOOZE mode background data flash rewriting with BGO.

Technical Context

The R5F11BBCGFP#30 implements the RL78 CPU core with CISC architecture, 3-stage pipeline, and selectable instruction timing (0.03125 μs @ 32 MHz to 30.5 μs @ 32.768 kHz). It integrates a high-accuracy ±1.0% on-chip oscillator (1–32 MHz), low-speed 15 kHz internal RC oscillator, and dedicated subsystem clock domain for RTC and LVD.

Its peripheral set includes Timer Array Unit (TAU) with 4 channels, Timer RD (2-channel PWMOPA), Timer RG, Timer RX, and Event Link Controller (ELC) supporting 22 event sources linked to peripherals - enabling deterministic, low-CPU-overhead signal processing for real-time industrial I/O control.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRL78 16-bit CISC with 3-stage pipeline, 1 MB address space, 32 general-purpose registers
Flash Memory32 KB code flash (1 KB block size), supports self-programming with boot swap and flash shield window
Data Flash4 KB background operation (BGO) capable; 1,000,000 write cycles; operates at VDD = 1.8–5.5 V
ADC8/10-bit resolution, 13 analog inputs, internal 1.45 V reference and temperature sensor
DACTwo 8-bit outputs (ANO0, ANO1), 0 V to VDD range, real-time output capability
Operating Temp−40°C to +105°C (industrial grade G suffix), VDD = 1.6–5.5 V (−40°C to +85°C), 2.4–5.5 V (+105°C)
Low-Power ModesHALT (0.57 μA), STOP (0.23 μA), SNOOZE (retains RAM, clocks select peripherals during flash rewrite)

Pinout & Package

Package: 32-pin LFQFP (7 × 7 mm, 0.8 mm pitch), lead-free, RoHS-compliant. Pin 1 marked by index notch; REGC requires 0.47–1 μF capacitor to VSS.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower supplyMain digital supply (1.6–5.5 V); powers CPU, RAM, and most peripherals
VSSGroundDigital ground reference; must be connected to system GND plane
RESETReset inputActive-low asynchronous reset; internal POR/LVD also triggers reset
P00/P01Analog I/OANI17/TI00 and ANI16/TO00 - dual-function pins supporting timer capture and 10-bit ADC input
P10–P17Port 1 I/O8-bit bidirectional port with N-ch open-drain option, pull-up resistors, and key interrupt support
P50/P51UART0 interfaceRxD0/TxD0 with LIN-bus support; enables automotive-grade serial diagnostics and control
REGCRegulator capacitorConnects to VSS via 0.47–1 μF ceramic capacitor to stabilize internal voltage regulator

Key Features

FeatureDesign Value
True Low-Power Platform66 μA/MHz active current and 0.57 μA RTC+LVD retention enables multi-year battery life in remote sensors
Background Data Flash RewriteBGO allows full CPU execution from code flash while updating 4 KB data flash - no firmware interruption required
Integrated Analog Subsystem13-channel ADC, dual 8-bit DAC, 2-channel comparator, and 1-channel PGA eliminate external signal-conditioning ICs
LIN-Bus UARTHardware LIN protocol support on UART0 enables direct connection to automotive body electronics networks
Event Link Controller (ELC)22 configurable event sources trigger peripheral actions without CPU intervention - reduces latency and ISR overhead

Applications

Industrial Sensor NodeSmart Thermostat Control

Use Scenario: Battery-powered temperature/humidity sensor transmitting data over RS-485 or sub-GHz RF every 10 seconds.

IC Role / Device Role / Timing Role: Main controller managing ADC sampling, RTC-triggered wake-up, low-power sleep sequencing, and UART/SCI communication.

Use Value: SNOOZE mode enables ADC conversion and data flash logging during deep sleep; 0.57 μA RTC+LVD extends 2xAA battery life beyond 5 years.

Use Scenario: Residential HVAC controller with local display, push-button UI, and wireless connectivity.

IC Role / Device Role / Timing Role: System-on-chip handling touch-key scanning, thermistor-based temperature acquisition, DAC-driven analog output to HVAC actuators, and IrDA remote interface.

Use Value: Integrated PGA amplifies weak thermistor signals; dual DACs drive 0–10 V HVAC control lines directly; key interrupt + ELC reduce polling overhead by 70%.

Programmable Logic Controller (PLC) I/O ModuleIndustrial Motor Monitor

Use Scenario: DIN-rail mounted digital I/O expansion module interfacing with 24 V DC field devices.

IC Role / Device Role / Timing Role: Real-time I/O manager with isolated input debouncing, LED status control, and Modbus RTU over UART1.

Use Value: 13-channel ADC monitors supply rail health and internal temps; 16-bit timers generate precise PWM for status LEDs; ELC synchronizes input capture with output update.

Use Scenario: Compact enclosure monitoring motor current, vibration (via piezo sensor), and winding temperature.

IC Role / Device Role / Timing Role: Signal acquisition hub performing simultaneous ADC sampling, comparator-based overcurrent detection, and RTC-stamped fault logging.

Use Value: Dual comparators detect fast overcurrent events (<1 μs response); internal temperature sensor validates thermal shutdown thresholds; data flash stores 10,000+ timestamped fault records.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F11BBEGFP#3064 KB code flash (vs. 32 KB), same package, peripherals, and temp gradeSuitable where firmware complexity exceeds 32 KB or future OTA updates require headroomSelect when >32 KB application code or secure bootloader space is required; otherwise R5F11BBCGFP#30 offers optimal cost/performance balance.
RL78/G13 R5F10DLGFP#30Same RL78 core, 64 KB flash, but lacks PGA, only 1 DAC channel, and no LIN UARTApplicable in simpler control tasks without analog signal conditioning or automotive commsChoose only if PGA/DAC count and LIN are unnecessary; R5F11BBCGFP#30 provides superior analog integration and automotive readiness.

Compared with R5F11BBEGFP#30, the R5F11BBCGFP#30 trades 32 KB of flash capacity for lower unit cost and smaller memory footprint - ideal for fixed-function industrial controllers. Against RL78/G13 R5F10DLGFP#30, it delivers higher analog integration and LIN compliance at identical package and pinout, reducing BOM count and design risk.

Availability

R5F11BBCGFP#30 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostat control, and PLC I/O modules requiring stable component supply across extended product lifecycles.

Supply support for R5F11BBCGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with over 40 years of MCU innovation.

The RL78/G1F product line targets cost-sensitive, ultra-low-power industrial and consumer applications demanding robust analog integration, functional safety readiness, and long-term supply stability - optimized for sensor fusion, motor control, and human-machine interface systems.

FAQ

What is the maximum operating frequency and corresponding power consumption of the R5F11BBCGFP#30?

The R5F11BBCGFP#30 operates at up to 32 MHz using the high-speed on-chip oscillator. At this frequency and VDD = 3.3 V, typical active current is 66 μA/MHz - resulting in ~2.1 mA total. In STOP mode, it draws just 0.23 μA, and in HALT mode with RTC + LVD enabled, consumption drops to 0.57 μA. These values are measured per Renesas R01DS0246EJ0130 Rev.1.30 specifications.

Does the R5F11BBCGFP#30 support LIN bus communication, and which peripheral handles it?

Yes, the R5F11BBCGFP#30 supports LIN bus communication via its UART0 peripheral, which includes hardware LIN protocol features such as automatic sync-break detection, checksum calculation, and identifier filtering. This capability is confirmed in Section 1.1 Features and Table 1-1 of the R01DS0246EJ0130 datasheet, and applies specifically to the R5F11BBCGFP#30 variant.

How many analog-to-digital converter (ADC) channels does the R5F11BBCGFP#30 provide, and what resolutions are supported?

The R5F11BBCGFP#30 integrates an 8/10-bit successive-approximation ADC with 13 analog input channels (ANI0–ANI7, ANI16–ANI20). Resolution is software-selectable per conversion, and the module supports internal 1.45 V reference and temperature sensor input. This configuration is specified for 32-pin RL78/G1F devices in Section 1.6 Outline of Functions, Page 14 of R01DS0246EJ0130.

What packaging and pin pitch does the R5F11BBCGFP#30 use, and is it RoHS-compliant?

The R5F11BBCGFP#30 uses a 32-pin LFQFP package measuring 7 × 7 mm with 0.8 mm pin pitch, as defined in Figure 1-1 and Table 1-1 of R01DS0246EJ0130. It is lead-free and RoHS-compliant, with ordering code suffix "FP" denoting LFQFP and "#30" indicating tray packaging. The exposed die pad is not present in this variant - unlike HWQFN packages - and no thermal pad grounding is required.

Can the R5F11BBCGFP#30 perform background data flash rewriting while executing code from main flash memory?

Yes, the R5F11BBCGFP#30 supports Background Operation (BGO) for data flash rewriting. While code executes from main flash, the data flash (4 KB) can be rewritten - including erase and program operations - without halting CPU execution. This feature is documented in Section 1.1 Features and confirmed for all RL78/G1F variants, including R5F11BBCGFP#30, with 1,000,000 write cycles rated at VDD = 1.8–5.5 V.

R5F11BBCGFP#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
32-LQFP
Series:
RL78/G1F
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
RL78
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CSI, I2C, IrDA, LINbus, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
5.5K x 8
Voltage - Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x8/10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F11BBCGFP#30 FAQ

1.How can I place an order for R5F11BBCGFP#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F11BBCGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F11BBCGFP#30 reliable?

The price and inventory of R5F11BBCGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F11BBCGFP#30 is usually 5 days.

3.What payment methods are accepted for R5F11BBCGFP#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F11BBCGFP#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F11BBCGFP#30?

R5F11BBCGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F11BBCGFP#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F11BBCGFP#30?

For technical support, including R5F11BBCGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F11BBCGFP#30 requirements.

6.How does Aetrix verify that R5F11BBCGFP#30 is sourced from the original manufacturer or authorized distributors?

All R5F11BBCGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F11BBCGFP#30 meets industry standards.

7.What is the process for return or replacement of R5F11BBCGFP#30?

All R5F11BBCGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F11BBCGFP#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F11BBCGFP#30 part is unused and in its original packaging.

Return procedure for R5F11BBCGFP#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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