Renesas R5F213G1CDSP#W4

Overview

R5F213G1CDSP#W4 from Renesas Electronics is a 16-bit R8C CPU core microcontroller with 4 KB program flash, 512-byte RAM, and 1 KB × 4 data flash supporting background operation (BGO). It operates at up to 20 MHz (VCC = 2.7–5.5 V), features 10-bit ADC (8 channels), dual 8-bit DACs, LIN hardware module, and real-time clock (Timer RE) - deployed in consumer audio equipment and office automation control systems.

For engineers reviewing the R5F213G1CDSP#W4 datasheet, R5F213G1CDSP#W4 pinout, R5F213G1CDSP#W4 application, or R5F213G1CDSP#W4 equivalent, key selection criteria include its -40°C to +85°C industrial temperature grade, LSSOP-24 package with 19 CMOS I/O ports, integrated voltage detection circuitry, and hardware LIN support for automotive body electronics interfaces.

Technical Context

The R5F213G1CDSP#W4 implements the R8C CPU core with 89 fundamental instructions, 16×16→32-bit multiplier, and multiply-accumulate capability. Its memory map spans 1 Mbyte address space, with fixed interrupt vector table at 0FFDCh–0FFFFh and data flash blocks at 03000h–03FFFh.

It integrates four independent clock sources: XIN/XOUT (up to 20 MHz), XCIN/XCOUT (32 kHz), high-speed on-chip oscillator (adjustable), and low-speed on-chip oscillator - enabling flexible power mode management including wait mode (3.5 µA @ 3.0 V, 32 kHz) and stop mode (2.0 µA).

Key Specifications

Pinout & Package

Package: 24-pin LSSOP (PLSP0024JB-A), 0.65 mm pitch, surface-mount, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F213G1CNSP, the R5F213G1CDSP#W4 provides guaranteed operation down to -40°C - essential for outdoor or uncontrolled-environment deployments; versus R5F213G2CDSP, it trades flash/RAM capacity for lower cost and smaller memory footprint in resource-constrained designs.

Availability

R5F213G1CDSP#W4 is available at Aetrix Electronics and suitable for audio equipment control, office automation devices, consumer appliance UI, and industrial sensor interface applications requiring stable component supply across extended temperature ranges.

Supply support for R5F213G1CDSP#W4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The R8C/3GC Group, including R5F213G1CDSP#W4, was designed for cost-sensitive, low-power embedded control in consumer electronics - emphasizing integration of analog peripherals, LIN connectivity, and robust flash programming capabilities.

FAQ

What is the maximum operating frequency of the R5F213G1CDSP#W4 and under what conditions?

The R5F213G1CDSP#W4 achieves a maximum operating frequency of 20 MHz when powered at VCC = 2.7–5.5 V using the XIN clock source. At reduced supply voltages (1.8–5.5 V), the maximum frequency drops to 5 MHz. The high-speed on-chip oscillator supports adjustable frequencies but does not exceed the 20 MHz external clock limit. All timing specifications in the R5F213G1CDSP#W4 datasheet assume these voltage-frequency correlations.

Does the R5F213G1CDSP#W4 support in-circuit debugging and flash reprogramming?

Yes, the R5F213G1CDSP#W4 includes on-chip debug capability and supports on-board flash rewrite via dedicated debug interface pins. It enables full breakpoint, step-through, and memory inspection during development. The data flash supports background operation (BGO), allowing R5F213G1CDSP#W4 firmware updates while application code continues executing - critical for field-deployed devices requiring zero-downtime maintenance.

What peripheral modules are shared on I/O pins of the R5F213G1CDSP#W4?

The R5F213G1CDSP#W4 uses function multiplexing extensively: P0_7 serves as both AN0 (ADC input) and DA1 (DAC output); P3_7 supports SDA (I²C data), SSO (SSU output), and TRAO (Timer RA output); P3_5 combines SCL (I²C clock), SSCK (SSU clock), and CLK2 (serial interface clock). Pin function selection is controlled by SFR settings - users must configure peripheral enable bits before assigning shared pins to avoid conflicts in the R5F213G1CDSP#W4 design.

How does the hardware LIN module in the R5F213G1CDSP#W4 operate?

The R5F213G1CDSP#W4 implements LIN 2.0/2.1 protocol in hardware using Timer RA for baud rate generation and UART0 for data framing - eliminating CPU overhead for bit-level timing and checksum calculation. The LINCR and LINST registers manage node addressing, sleep/wake detection, and error status. This dedicated logic ensures deterministic latency and frees the R8C CPU core for application tasks, making R5F213G1CDSP#W4 ideal for automotive body electronics slave nodes.

What are the power consumption characteristics of the R5F213G1CDSP#W4 in low-power modes?

In wait mode with 32 kHz XCIN active, the R5F213G1CDSP#W4 draws 3.5 µA at VCC = 3.0 V; in stop mode, consumption drops to 2.0 µA. These values exclude external circuit loading. The voltage detection circuit remains active in both modes, enabling wake-up on supply threshold violation. For battery-powered R5F213G1CDSP#W4 applications, combining stop mode with periodic RTC-triggered wake-ups achieves optimal energy efficiency per sensing cycle.