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Renesas R5F213G6MNNP#W4

Part No.:
R5F213G6MNNP#W4
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
24-WFQFN Exposed Pad
Datasheet:
AetrixR5F213G6MNNP#W4.pdf
Description:
16BIT MCU R8C/3GM ROM32K/RAM2.5K
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,999

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Product details

Overview

R5F213G6MNNP from Renesas Electronics is a 16-bit R8C CPU core microcontroller in a 24-pin HWQFN package, featuring 32 KB flash ROM, 2.5 KB RAM, and 4 KB data flash with background operation (BGO). It delivers 50 ns minimum instruction execution at 20 MHz (VCC = 2.7–5.5 V), integrates dual 8-bit timers (RA/RB), one 16-bit timer (RC), real-time clock (RE), 10-bit × 8-channel ADC, dual 8-bit DACs, LIN hardware module, and I²C/UART/SSU serial interfaces. It targets embedded control in consumer audio and office equipment.

For engineers reviewing the R5F213G6MNNP datasheet, R5F213G6MNNP pinout, R5F213G6MNNP application, or R5F213G6MNNP equivalent, key selection considerations include its 24-pin PWQN0024KC-A package, -20°C to +85°C operating range, integrated LIN transceiver support via Timer RA and UART0, BGO-enabled data flash for firmware updates during runtime, and low-power stop mode consuming only 2.0 µA at 3.0 V.

Technical Context

The R5F213G6MNNP implements the R8C CPU core with 89 fundamental instructions and a dedicated 16×16→32-bit multiplier supporting multiply-accumulate operations. Its memory map spans 1 Mbyte (00000h–FFFFFh), with program ROM at 08000h–0FFFFh, data flash at 03000h–03FFFh, and RAM at 00400h–00DFFh.

Peripheral integration includes a hardware LIN module using Timer RA and UART0, dual comparators (A/B), voltage detection circuitry with selectable thresholds, and four independent clock sources: XIN/XCIN oscillators, high-speed on-chip oscillator (adjustable), and low-speed on-chip oscillator - enabling flexible power-mode management across standard, wait, and stop modes.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreR8C 16-bit core with 89 instructions and 16×16→32-bit hardware multiplier
Flash ROM32 KB program ROM; supports in-system programming and ROM code protection
Data Flash4 KB (1 KB × 4 blocks) with background operation (BGO) for concurrent read/write
RAM2.5 KB internal RAM mapped at 00400h–00DFFh, used for data and stack
ADC/DAC10-bit resolution × 8 channels with sample-and-hold; dual 8-bit DAC outputs (DA0/DA1)
TimersTimer RA (8-bit), RB (8-bit), RC (16-bit w/ 4 capture/compare registers), RE (8-bit RTC)
Serial InterfacesUART0, UART2 (with I²C mode), SSU (shared with I²C), and hardware LIN module
Operating Range-20°C to +85°C (N version); supply voltage 1.8–5.5 V with voltage detection circuit

Pinout & Package

Package: 24-pin HWQFN (PWQN0024KC-A), 4 mm × 4 mm body, 0.5 mm pitch, exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
1 (MODE)Mode configuration inputMust be pulled high via resistor to enable single-chip mode at power-up
2 (RESET)Active-low reset inputDrives full system reset when asserted low; supports power-on reset and voltage detection
3 (XOUT/XCOUT)Crystal oscillator outputDrives external crystal/resonator for XIN or XCIN clock circuits
4 (VSS/AVSS)Digital/analog groundCommon reference for digital logic and analog peripherals; requires separate AVSS decoupling
5 (XIN/XCIN)Crystal oscillator inputAccepts external 20 MHz crystal (XIN) or 32 kHz watch crystal (XCIN)
6 (VCC/AVCC)Digital/analog supply1.8–5.5 V main supply; AVCC powers A/D and D/A converters, requires local decoupling
7 (P3_7)Multi-function I/OConfigurable as SDA (I²C), SSO (SSU), TRAO (Timer RA output), or RXD2/TXD2
11 (P4_5)Interrupt/trigger inputServes as INT0, ADTRG (ADC external trigger), and RXD2/SCL2 signal
20 (P0_7)Analog/digital I/OAN0 analog input channel and DA1 DAC output; supports simultaneous use in mixed-signal designs
24 (P4_2)Analog reference inputVREF pin for A/D and D/A converters; enables precise ratiometric measurements

Key Features

FeatureDesign Value
Background Operation (BGO)Enables real-time firmware updates and parameter rewrites without halting CPU execution
Hardware LIN ModuleIntegrates LIN protocol handling via Timer RA and UART0-no external transceiver required for basic node operation
Low-Power Stop ModeConsumes only 2.0 µA at 3.0 V, ideal for battery-backed real-time clock and wake-on-event applications
Programmable Clock SourcesFour independent clocks (XIN, XCIN, high-speed/low-speed on-chip oscillators) with selectable dividers (1/2/4/8/16)
Dual DAC OutputsTwo independent 8-bit voltage outputs (DA0/DA1) usable for analog waveform generation or sensor biasing
Voltage Detection CircuitThree-level detection (VDD monitor + two user-selectable thresholds) with programmable reset and interrupt behavior

Applications

Audio Equipment ControlOffice Equipment Motor Control

Use Scenario: Volume, tone, and source selection logic in portable audio systems with LED display and button interface.

IC Role / Device Role / Timing Role: Main system controller executing UI state machine, driving 7-segment LEDs via GPIO, sampling buttons with key-interrupt inputs (KI0–KI3), and generating PWM for backlight dimming.

Use Value: Integrated 10-bit ADC reads potentiometer positions; dual DACs generate analog reference voltages for op-amp-based audio stage biasing.

Use Scenario: Bidirectional DC motor control in document feeders and paper path actuators of multifunction printers.

IC Role / Device Role / Timing Role: Real-time motion sequencer using Timer RB PWM output and Timer RC input capture for encoder feedback, coordinated via DTC for burst transfers.

Use Value: Hardware LIN interface communicates status to main controller; low-power stop mode extends standby battery life between print jobs.

Consumer Appliance UIHome Automation Sensor Hub

Use Scenario: Touchless proximity sensing and display management in microwave ovens and induction cooktops.

IC Role / Device Role / Timing Role: Capacitive touch acquisition frontend using ADC sweep mode and comparator A for threshold detection, synchronized with Timer RE for time-of-day logging.

Use Value: Data flash BGO allows field-upgradable UI language packs; voltage detection ensures safe shutdown during brown-out events.

Use Scenario: Multi-sensor aggregation (temperature, humidity, ambient light) with wireless gateway handoff in smart thermostats.

IC Role / Device Role / Timing Role: Sensor data concentrator with I²C master interface to local sensors, UART0 for UART-to-Bluetooth bridge, and RTC for timestamped event logging.

Use Value: 2.5 KB RAM buffers sensor readings; 32 KB flash stores protocol stacks and OTA update handlers without external memory.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F213G5MNNP24 KB program ROM, 2 KB RAM, same package and peripheral setLower firmware capacity margin; suitable for simpler UI or fixed-feature appliancesSelect when application firmware size remains under 24 KB and cost optimization is prioritized over future feature expansion
R5F213G4MNNP16 KB program ROM, 1.5 KB RAM, identical clock/peripheral architectureLimited memory for complex communication stacks or multi-sensor bufferingChoose for cost-sensitive, low-complexity control tasks where BGO and LIN are still required but code footprint is tightly constrained

Compared with R5F213G5MNNP and R5F213G4MNNP, the R5F213G6MNNP provides the highest on-chip memory headroom (32 KB ROM/2.5 KB RAM) within the R8C/3GM family's 24-pin footprint-enabling richer feature sets, larger OTA update partitions, and extended data logging without external memory.

Availability

R5F213G6MNNP is available at Aetrix Electronics and suitable for audio equipment control, office equipment motor control, consumer appliance UI, and home automation sensor hub applications requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for R5F213G6MNNP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The R8C/3GM Group is designed for cost-sensitive, low-power embedded control in consumer electronics-emphasizing integrated analog peripherals (ADC/DAC/comparators), LIN connectivity, and robust EMI/EMS performance in compact QFN packages.

FAQ

What is the maximum operating frequency and corresponding supply voltage range for the R5F213G6MNNP?

The R5F213G6MNNP operates at up to 20 MHz when supplied with 2.7–5.5 V, achieving a minimum instruction execution time of 50 ns. At lower frequencies (e.g., 5 MHz), it supports down to 1.8 V, enabling ultra-low-power operation in battery-powered devices while maintaining full peripheral functionality.

Does the R5F213G6MNNP support in-application programming (IAP) of its data flash?

Yes, the R5F213G6MNNP supports background operation (BGO) for data flash, allowing the R5F213G6MNNP to execute code from program ROM while simultaneously erasing or programming data flash blocks-critical for firmware updates, calibration storage, and secure parameter retention without system interruption.

How many analog input channels does the R5F213G6MNNP ADC support, and what is its resolution?

The R5F213G6MNNP integrates a 10-bit successive-approximation ADC with eight configurable analog input channels (AN0–AN11, with some shared pins). It includes sample-and-hold capability and sweep mode for automatic sequential conversion-enabling accurate voltage monitoring across multiple sensors or controls in consumer appliance applications.

What peripheral resources enable LIN bus communication on the R5F213G6MNNP?

The R5F213G6MNNP implements hardware LIN 2.0/2.1 compliance using Timer RA for baud rate timing and pulse-width modulation, combined with UART0 for data framing and error checking. This integrated LIN module eliminates the need for external transceivers in slave-node applications such as automotive body electronics or appliance sub-systems.

What are the low-power modes supported by the R5F213G6MNNP, and what is the typical current draw in stop mode?

The R5F213G6MNNP supports standard operating mode, wait mode, and stop mode. In stop mode-with the low-speed on-chip oscillator (32 kHz) active-the R5F213G6MNNP draws just 2.0 µA at 3.0 V, retaining RTC operation and wake-up capability via INT0, INT1, INT3, or key-input interrupts for energy-efficient embedded control.

R5F213G6MNNP#W4 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
24-WFQFN Exposed Pad
Series:
R8C/3x/3GM
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
R8C
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SIO, SSU, UART/USART
Peripherals:
POR, PWM, Voltage Detect, WDT
Number of I/O:
19
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.5K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F213G6MNNP#W4 FAQ

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Please submit a Request for Quotation (RFQ) for R5F213G6MNNP#W4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R5F213G6MNNP#W4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F213G6MNNP#W4 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F213G6MNNP#W4?

For technical support, including R5F213G6MNNP#W4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F213G6MNNP#W4 requirements.

6.How does Aetrix verify that R5F213G6MNNP#W4 is sourced from the original manufacturer or authorized distributors?

All R5F213G6MNNP#W4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F213G6MNNP#W4 meets industry standards.

7.What is the process for return or replacement of R5F213G6MNNP#W4?

All R5F213G6MNNP#W4 units undergo pre-shipment inspection (PSI). If there is an issue with R5F213G6MNNP#W4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F213G6MNNP#W4 part is unused and in its original packaging.

Return procedure for R5F213G6MNNP#W4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F213G6MNNP#W4 Tags

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