Renesas R5F213J4MNNP#U0
- Part No.:
- R5F213J4MNNP#U0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 36-WFQFN Exposed Pad
- Datasheet:
-
R5F213J4MNNP#U0.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 36HWQFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,599
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Product details
Overview
R5F213J4MNNP from Renesas Electronics is a 16-bit R8C CPU core microcontroller with 16 KB program flash, 1.5 KB RAM, and 4 KB data flash (1 KB × 4 blocks) supporting background operation (BGO). It operates at up to 20 MHz (VCC = 2.7–5.5 V), integrates dual 8-bit timers (RA/RB), one 16-bit timer (RC), dual 16-bit timers (RD), real-time clock (RE), 10-bit ADC (10 channels), dual 8-bit DACs, LIN hardware module, and I²C/UART/SSU serial interfaces. It targets embedded control in consumer audio and office equipment.
For engineers reviewing the R5F213J4MNNP datasheet, R5F213J4MNNP pinout, R5F213J4MNNP application, or R5F213J4MNNP equivalent, key selection criteria include its 36-pin HWQFN package, -20°C to +85°C operating range, integrated LIN transceiver support via Timer RA and UART0, BGO-enabled data flash for firmware updates, and low-power stop mode (2.0 µA).
Technical Context
The R5F213J4MNNP implements the R8C CPU core with 89 fundamental instructions, 16×16→32-bit hardware multiplier, and multiply-accumulate capability. Its memory map spans 1 Mbyte (00000h–FFFFFh), with program ROM at 0C000h–0FFFFh and RAM at 00400h–009FFh.
It features four independent clock sources: XIN/XOUT (up to 20 MHz), XCIN/XCOUT (32 kHz), high-speed on-chip oscillator (adjustable), and low-speed on-chip oscillator. Peripheral control uses dedicated SFRs-including TRACR, TRBCR, TRCMR, TRECR1, ADINSEL, and LINCR-with interrupt vector table fixed at 0FFDCh–0FFFFh and 69 interrupt vectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | R8C 16-bit core with 89 instructions, 16×16→32-bit multiplier, and MAC support for efficient signal processing. |
| Memory | 16 KB program flash (ROM), 1.5 KB RAM, 4 KB data flash (1 KB × 4 blocks) with BGO for concurrent read/write during runtime. |
| Operating Frequency | 20 MHz max (VCC = 2.7–5.5 V); 5 MHz min (VCC = 1.8–5.5 V) - enables deterministic real-time response in motor control loops. |
| Power Consumption | 6.5 mA typical @ 5.0 V/20 MHz; 2.0 µA in stop mode - supports battery-backed applications requiring ultra-low standby current. |
| Analog Peripherals | 10-bit ADC (10 channels, sample-and-hold, sweep mode); dual 8-bit DACs (DA0/DA1) - suitable for closed-loop sensor feedback and audio waveform generation. |
| Serial Interfaces | UART0/1/2 (with I²C-bus mode on UART2), SSU (shared with I²C), hardware LIN module (Timer RA + UART0) - enables multi-protocol communication in appliance control networks. |
| Timers | Timer RA/RB (8-bit × 2), RC (16-bit × 1), RD (16-bit × 2 with 6-PWM output & complementary PWM), RE (8-bit RTC) - supports motor phase timing, PWM-driven LED dimming, and calendar-based scheduling. |
Pinout & Package
Packaged in a 36-pin HWQFN (package code PWQN0036KA-B), 6 mm × 6 mm body, 0.5 mm pitch, with exposed thermal pad. Pin 1 marked by dot; VSS/AVSS (pin 5) and VCC/AVCC (pin 7) provide separate analog/digital power domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (XCIN) | Low-frequency crystal input | Connects to 32 kHz tuning fork crystal for RTC accuracy; enables low-power timekeeping in stop mode. |
| Pin 4 (XOUT) | High-frequency oscillator output | Drives external ceramic resonator (or accepts external clock) for main system clock up to 20 MHz. |
| Pin 20 (ADTRG) | A/D external trigger input | Synchronizes ADC conversions to external events (e.g., motor commutation edge), ensuring precise sampling alignment. |
| Pin 29 (AN0/DA1) | Shared analog input / DAC output | Enables simultaneous analog sensing and waveform generation on same pin-reduces PCB routing complexity in compact designs. |
| Pin 35 (VREF) | ADC/DAC reference voltage input | Accepts external precision reference (e.g., 2.5 V) to improve ADC linearity and DAC output stability beyond internal VCC dependency. |
Key Features
| Feature | Design Value |
|---|---|
| Background Operation (BGO) Data Flash | Enables firmware updates or parameter storage without halting CPU execution - critical for uninterrupted real-time control during field upgrades. |
| Hardware LIN Module | Integrated LIN 2.1-compliant transceiver logic using Timer RA and UART0 - eliminates need for external LIN transceiver IC in automotive body electronics or appliance sub-nodes. |
| Multi-Source Clock System | Four independent clocks (XIN, XCIN, high-speed/low-speed on-chip oscillators) with selectable dividers (1/2/4/8/16) - allows dynamic power/performance scaling across operating modes. |
| Dual 16-bit Timer RD with Complementary PWM | Generates synchronized three-phase waveforms (6-pin output) with triangular/sawtooth modulation - directly drives gate drivers in BLDC motor inverters without external logic. |
| Voltage Detection & Watchdog | Configurable voltage detection (VDD monitor levels) plus 14-bit watchdog timer with independent low-speed oscillator - ensures fail-safe reset under brown-out or software hang conditions. |
Applications
| Audio Equipment Control | Office Equipment Motor Drive |
|---|---|
Use Scenario: Digital audio receiver managing volume, source selection, equalization, and display backlighting. IC Role / Device Role / Timing Role: Main system controller executing UI logic, decoding IR commands, driving DACs for analog output, and generating PWM for LED dimming. Use Value: Integrated 10-channel ADC monitors front-panel potentiometers and thermal sensors; dual DACs produce stereo line-level outputs; BGO flash allows seamless firmware updates during playback. | Use Scenario: Laser printer engine controller managing paper feed, fuser temperature, and toner delivery timing. IC Role / Device Role / Timing Role: Real-time motion controller coordinating stepper motor phases, reading encoder feedback via Timer RC capture, and regulating heater PWM via Timer RD. Use Value: Complementary PWM mode generates precise 3-phase drive signals; 32 kHz RTC (XCIN-based) schedules maintenance alerts; LIN interface communicates with main board for job status. |
| Consumer Appliance UI Panel | Home Automation Sensor Hub |
Use Scenario: Washing machine control panel handling keypad input, water level sensing, cycle timing, and buzzer feedback. IC Role / Device Role / Timing Role: Dedicated UI MCU interfacing with capacitive touch keys (KI0–KI3), reading pressure sensor ADC inputs, and driving piezo buzzer via Timer RA pulse output. Use Value: Key input interrupts (KI0–KI3) enable low-latency button response; 10-bit ADC resolves water level analog signals with 1024-step resolution; stop mode reduces standby power to 2.0 µA. | Use Scenario: Smart thermostat aggregating temperature, humidity, and occupancy data before transmitting via Zigbee or Wi-Fi module. IC Role / Device Role / Timing Role: Sensor fusion processor acquiring analog sensor data, performing local calibration, and buffering readings for wireless transmission. Use Value: Dual 8-bit DACs generate reference voltages for sensor excitation; data flash stores calibration coefficients per sensor; UART2 in I²C mode interfaces with digital ambient sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F213J5MNNP | 24 KB program ROM, 2 KB RAM, same package and peripheral set - no change in clock, ADC, or timer specs. | Preferred when larger firmware image size or additional RAM for complex state machines is required. | Select R5F213J5MNNP if future firmware growth or multitasking OS support demands >16 KB code space. |
| R5F213J2MNNP | 8 KB program ROM, 1 KB RAM, identical peripherals and pinout - reduced memory only. | Suitable for cost-sensitive, functionally minimal implementations (e.g., single-button remote control). | Choose R5F213J2MNNP only when application fits within 8 KB ROM and does not require BGO-intensive data logging. |
Compared with R5F213J2MNNP and R5F213J5MNNP, the R5F213J4MNNP offers optimal balance of memory (16 KB ROM/1.5 KB RAM), BGO-enabled data flash, and full peripheral integration - making it the default choice for mid-complexity consumer appliance control where firmware scalability and real-time data persistence are both required.
Availability
R5F213J4MNNP is available at Aetrix Electronics and suitable for audio equipment control, office equipment motor drive, consumer appliance UI panels, and home automation sensor hubs requiring stable component supply and long-term industrial availability.
Supply support for R5F213J4MNNP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The R8C/3JM Group, including R5F213J4MNNP, was designed for cost-effective, low-power embedded control in consumer electronics - emphasizing integrated analog peripherals, LIN connectivity, and robust flash reliability for mass-market appliances.
FAQ
What is the maximum operating frequency and supply voltage range for the R5F213J4MNNP?
The R5F213J4MNNP operates at up to 20 MHz when supplied with 2.7–5.5 V, and supports reduced-frequency operation down to 5 MHz at 1.8–5.5 V. This dual-voltage/frequency capability allows flexible design trade-offs between performance and ultra-low-power modes such as stop (2.0 µA) and wait (3.5 µA) - essential for battery-powered or energy-conscious consumer devices. The R5F213J4MNNP maintains full peripheral functionality across this entire voltage range.
Does the R5F213J4MNNP support background operation (BGO) for its data flash memory?
Yes, the R5F213J4MNNP includes 4 KB of data flash organized as four 1 KB blocks, all supporting background operation (BGO). This allows the CPU to execute code from program ROM while simultaneously erasing or programming data flash - enabling safe over-the-air updates, parameter storage, or calibration data logging without interrupting real-time control tasks. The R5F213J4MNNP's BGO implementation is confirmed in Section 1.1 and Table 1.2 of its official datasheet (R01DS0128EJ0100).
Which pins on the R5F213J4MNNP support hardware LIN communication?
The R5F213J4MNNP implements hardware LIN 2.1 using Timer RA and UART0, with dedicated pins P1_4 (/TXD0/TRCCLK) for LIN transmit and P1_5 (/INT1/RXD0/TRAIO) for LIN receive. These pins are configured automatically when the LINCR and LINCR2 registers are initialized - eliminating external transceiver components. The R5F213J4MNNP's LIN module supports automatic sync-break detection, checksum calculation, and slave node response timing per LIN specification, as documented in Section 1.2.2 and Figure 1.2 of R01DS0128EJ0100.
What are the ADC and DAC specifications of the R5F213J4MNNP?
The R5F213J4MNNP integrates a 10-bit successive-approximation ADC with 10 input channels (AN0–AN6, AN8–AN11), sample-and-hold circuitry, and sweep mode for automated channel sequencing. It also includes two independent 8-bit DACs (DA0 and DA1), each with dedicated registers (DA0, DA1) and shared VREF input (Pin 35). These analog resources are fully functional across the device's -20°C to +85°C operating range and support simultaneous use - a capability verified in Tables 1.1, 1.2, and Section 1.5 of the R5F213J4MNNP datasheet.
Is the R5F213J4MNNP pin-compatible with other members of the R8C/3JM Group?
Yes, the R5F213J4MNNP shares identical pin assignment, electrical characteristics, and package (PWQN0036KA-B) with all R8C/3JM Group variants including R5F213J2MNNP, R5F213J5MNNP, and R5F213J6MNNP. Differences are limited to memory size (ROM/RAM/data flash) and do not affect pin function mapping, peripheral register layout, or timing behavior. This uniformity allows direct PCB reuse across product tiers - a key design advantage confirmed in Figure 1.1 and Table 1.3 of R01DS0128EJ0100.
R5F213J4MNNP#U0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 36-WFQFN Exposed Pad
- Series:
- R8C/3x/3JM
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- R8C
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SIO, SSU, UART/USART
- Peripherals:
- POR, PWM, Voltage Detect, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 1.5K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 10x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F213J4MNNP#U0 FAQ
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7.What is the process for return or replacement of R5F213J4MNNP#U0?
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1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F213J4MNNP#U0 part is unused and in its original packaging.
Return procedure for R5F213J4MNNP#U0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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