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Renesas R5F213M8QNNP#U0

Part No.:
R5F213M8QNNP#U0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
40-WFQFN Exposed Pad
Datasheet:
AetrixR5F213M8QNNP#U0.pdf
Description:
IC MCU 16BIT 64KB FLASH 40HWQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,119

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Product details

Overview

R5F213M8QNNP from Renesas Electronics is a 64 KB flash, 6 KB RAM, 40-pin HWQFN single-chip MCU integrating an IEEE 802.15.4-compliant 2.4 GHz RF transceiver, R8C CPU core, AES-128 encryption engine, and background operation (BGO) data flash. It operates at up to 16 MHz with 1.8–3.6 V supply and supports low-power wait/stop modes down to 2 µA. It targets wireless sensor nodes in consumer electronics.

For engineers reviewing the R5F213M8QNNP datasheet, R5F213M8QNNP pinout, R5F213M8QNNP application, or R5F213M8QNNP equivalent, key selection criteria include its integrated 2.4 GHz RF front-end (−95 dBm sensitivity, 0 dBm output), on-chip AES-128 acceleration, 40-pin 6×6 mm HWQFN package with dedicated RF power domains, and support for IEEE 802.15.4 MAC layer implementation in firmware.

Technical Context

The R5F213M8QNNP implements the R8C CPU core with 89 fundamental instructions, 16×16→32-bit hardware multiplier, and 20-bit address space (1 Mbyte). Its RF subsystem includes baseband logic with 127-byte TX/RX RAM buffers, automatic ACK response, and 26-bit timer with three compare channels.

It integrates dual clock systems: high-speed XIN (16 MHz crystal), low-speed XCIN (32 kHz crystal), and low-power on-chip oscillator (15.6 kHz). Power management includes voltage detection (VDD monitoring), multiple low-power modes (wait mode at 4.5 µA, stop mode at 2 µA), and separate analog/RF power domains (VCCRF, VREG1–VREG4).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreR8C core with 89 instructions, 16×16→32-bit multiplier, 20-bit PC, 1 Mbyte address space
Memory64 KB program flash, 6 KB RAM, 4 KB data flash (1 KB × 4 blocks) with BGO support
RF Performance2405–2480 MHz ISM band, −95 dBm RX sensitivity, 0 dBm TX output, IEEE 802.15.4 compliant
Power ConsumptionStop mode: 2 µA; Wait mode (XCIN, peripherals off): 4.5 µA; RF Tx: 21.5 mA @ 16 MHz, 2.7–3.6 V
Clock SourcesXIN (16 MHz crystal), XCIN (32 kHz crystal), low-speed on-chip oscillator (15.6 kHz)
SecurityAES-128 encryption/decryption engine, ROM code protect, ID code check, on-chip debug lock
Operating Range−20°C to +85°C ambient, 1.8–3.6 V supply (VCC and VCCRF)

Pinout & Package

Package: 40-pin HWQFN (PWQN0040KB-A), 6 mm × 6 mm body, 0.5 mm pitch, exposed die pad (DIEGND) requiring PCB GND connection.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSS1 / VSS2 / DIEGNDPower and ground railsDigital supply (1.8–3.6 V), analog/RF ground isolation, and thermal pad tied to system GND
XIN / XOUTHigh-speed clock oscillator16 MHz crystal interface for main system clock generation
XCIN / XCOUTLow-speed clock oscillator32 kHz crystal interface for real-time clock and low-power timing
RFIOP / RFIONRF differential I/ODirect connection to external balun and antenna matching network
VCCRF / VSSRF / VSSRF1 / VSSRF2RF power domainIsolated 1.8–3.6 V supply and dedicated ground for RF transceiver section
VREG1–VREG4 / VREGOUT1–VREGOUT3On-chip regulator outputs1.5 V analog/PLL/VCO/oscillator supplies - each requires dedicated bypass capacitor
ASWAntenna switch controlOpen-drain output to drive external RF antenna switch (e.g., SPDT)
P0_4 / P1_0–P1_7 / P3_0–P3_7 / P4_3–P4_5Programmable CMOS I/O18 general-purpose pins with software-selectable pull-up resistors and peripheral function multiplexing

Key Features

FeatureDesign Value
Integrated IEEE 802.15.4 RF TransceiverEliminates need for external RF IC; enables compact, certified 2.4 GHz wireless node design
Hardware AES-128 EngineAccelerates encryption/decryption in <10 µs per block, reducing CPU load and improving security latency
Background Operation (BGO) Data FlashAllows concurrent flash erase/write and program execution - critical for over-the-air firmware updates
Dual Independent Clock DomainsEnables simultaneous high-speed processing (16 MHz) and ultra-low-power RTC operation (32 kHz)
Multi-Rail Power ArchitectureSeparate VCCRF, VREG1–VREG4, and digital rails minimize noise coupling and optimize RF performance

Applications

Smart Home Sensor NodeWireless Remote Control

Use Scenario: Battery-powered temperature/humidity/motion sensor transmitting data every 30 seconds to a hub via Zigbee or custom 802.15.4 stack.

IC Role / Device Role / Timing Role: Primary MCU and RF transceiver; handles sensor acquisition, AES-encrypted packet assembly, and 2.4 GHz transmission with precise timing via Timer RC and 32 kHz RTC.

Use Value: Single-chip integration reduces BOM count by ≥3 components (MCU + RF IC + crypto accelerator); 2 µA stop mode extends CR2032 battery life to >2 years.

Use Scenario: IR-to-Zigbee bridge remote controlling lighting, HVAC, or AV equipment using encrypted 802.15.4 commands.

IC Role / Device Role / Timing Role: Dual-role controller: processes IR decode, manages button debouncing, and executes secure RF transmission with ACK handling and retransmission logic.

Use Value: On-chip AES-128 ensures command integrity; integrated RF eliminates external transceiver layout complexity and EMI tuning effort.

Industrial Wireless MonitorConsumer Audio Remote

Use Scenario: DIN-rail mounted vibration/temperature monitor in factory settings, reporting to gateway via mesh network.

IC Role / Device Role / Timing Role: Real-time data acquisition host with RF MAC layer implementation; uses Timer RE for time-stamped logging and DTC for DMA-assisted sensor reads.

Use Value: 6 KB RAM supports multi-sensor buffering and protocol stack; −20°C to +85°C rating ensures reliability in uncontrolled environments.

Use Scenario: Compact Bluetooth LE companion remote with secondary 802.15.4 channel for proprietary audio sync or firmware update.

IC Role / Device Role / Timing Role: Secondary wireless controller coexisting with BLE SoC; provides authenticated, low-latency audio metadata channel using AES-encrypted packets.

Use Value: Dedicated RF baseband avoids BLE stack interference; 0 dBm output meets FCC Part 15 Class B radiated emission limits without shielding.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2.4 GHz wireless MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TI CC2652R1FARM Cortex-M4F core, 352 KB flash, integrated BLE 5.0 + IEEE 802.15.4, higher RF output (+5 dBm), no on-chip AES acceleratorTargets BLE-centric designs requiring dual-mode connectivity; lacks dedicated AES hardware but offers richer RTOS supportSelect when BLE interoperability or larger firmware footprint is required; verify RF regulatory certification alignment
Silicon Labs EFR32MG21A020F768IM32ARM Cortex-M33 core, 768 KB flash, +20 dBm output, hardware crypto (AES, ECC, SHA), 2.4 GHz + sub-GHz multi-bandDesigned for high-performance, long-range, secure IoT gateways; significantly higher cost and power vs. R5F213M8QNNPSelect for applications needing >100 m range or FIPS-compliant cryptography; not suitable for cost-sensitive consumer nodes

Compared with CC2652R1F and EFR32MG21A020F768IM32, the R5F213M8QNNP delivers optimal balance of RF integration, ultra-low-power operation (2 µA stop), and hardware AES acceleration in a compact 40-pin QFN-ideal for volume consumer wireless sensors where BOM cost and board space are constrained.

Availability

R5F213M8QNNP is available at Aetrix Electronics and suitable for smart home sensor nodes, wireless remote controls, industrial wireless monitors, and consumer audio remotes requiring stable component supply and long-term production continuity.

Supply support for R5F213M8QNNP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The R8C/3MQ Group is designed specifically for ultra-low-power, IEEE 802.15.4-compliant wireless sensor and control applications-integrating RF, MCU, and security in a single chip to reduce system complexity and certification burden.

FAQ

What is the maximum operating frequency and supply voltage range for the R5F213M8QNNP?

The R5F213M8QNNP operates at up to 16 MHz with a supply voltage range of 1.8 V to 3.6 V for both digital (VCC) and RF (VCCRF) domains. At 16 MHz, it requires VCC = VCCRF = 2.7–3.6 V; lower frequencies (8 MHz, 4 MHz) extend operation down to 2.15 V and 1.8 V respectively, enabling flexible power/performance trade-offs in battery-powered designs.

Does the R5F213M8QNNP support hardware-accelerated AES encryption?

Yes, the R5F213M8QNNP includes a dedicated AES-128 encryption/decryption engine that performs full-block operations in under 10 µs. This hardware accelerator offloads cryptographic processing from the R8C CPU, enabling secure IEEE 802.15.4 frame encryption without compromising real-time responsiveness or increasing firmware size.

What RF performance specifications does the R5F213M8QNNP provide?

The R5F213M8QNNP delivers −95 dBm receiver sensitivity and 0 dBm transmit output power across the 2405–2480 MHz ISM band. Its RF baseband includes 127-byte TX/RX RAM, automatic ACK response, and 26-bit timer with three compare channels-enabling robust, low-latency 802.15.4 MAC layer implementation directly in firmware.

How does the R5F213M8QNNP manage power in low-power modes?

The R5F213M8QNNP supports multiple low-power states: stop mode draws just 2 µA (all clocks off), wait mode with XCIN clock and peripherals off consumes 4.5 µA, and RF idle mode draws 7.5 mA at 16 MHz. Its dual clock domains and isolated RF power rails allow selective subsystem shutdown while maintaining real-time wake-up capability via INT0/INT3 or RF events.

What package type and pin count does the R5F213M8QNNP use?

The R5F213M8QNNP uses a 40-pin HWQFN package (package code PWQN0040KB-A), measuring 6 mm × 6 mm with 0.5 mm pitch and an exposed die pad (DIEGND) that must be soldered to the PCB ground plane for thermal and electrical performance. This compact, thermally efficient package supports high-density wireless module layouts.

R5F213M8QNNP#U0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
40-WFQFN Exposed Pad
Series:
R8C/3x/3MQ
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
R8C
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SIO, SSU, UART/USART
Peripherals:
POR, PWM, Voltage Detect, WDT
Number of I/O:
18
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F213M8QNNP#U0 FAQ

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Please submit a Request for Quotation (RFQ) for R5F213M8QNNP#U0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R5F213M8QNNP#U0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F213M8QNNP#U0 is usually 5 days.

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5.How can I obtain technical support or documentation for R5F213M8QNNP#U0?

For technical support, including R5F213M8QNNP#U0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F213M8QNNP#U0 requirements.

6.How does Aetrix verify that R5F213M8QNNP#U0 is sourced from the original manufacturer or authorized distributors?

All R5F213M8QNNP#U0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F213M8QNNP#U0 meets industry standards.

7.What is the process for return or replacement of R5F213M8QNNP#U0?

All R5F213M8QNNP#U0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F213M8QNNP#U0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F213M8QNNP#U0 part is unused and in its original packaging.

Return procedure for R5F213M8QNNP#U0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F213M8QNNP#U0 Tags

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