Renesas R5F51105AGNE#20

Overview

R5F51105AGNE#20 from Renesas is a 32-bit RX CPU core microcontroller operating at up to 32 MHz (50 DMIPS), featuring 128 Kbytes of on-chip flash memory, 16 Kbytes of SRAM, and integrated peripherals including a 12-bit A/D converter (14 channels), RTC, dual SCI interfaces, I²C, RSPI, MTU2 timers, and low-power software standby mode (0.35 μA). It targets compact industrial sensors and battery-powered IoT edge nodes requiring deterministic real-time control and IEC 60730-compliant safety functions.

For engineers reviewing the R5F51105AGNE#20 datasheet, R5F51105AGNE#20 pinout, R5F51105AGNE#20 application, or R5F51105AGNE#20 equivalent, key selection criteria include its HWQFN-48 package (7 × 7 mm, 0.5 mm pitch), −40 to +105°C extended temperature grade, 1.8–3.6 V single-supply operation, and support for IEC 60730 Class B compliance via CAC, IWDT, and RAM test assist functions.

Technical Context

The R5F51105AGNE#20 implements a CISC Harvard architecture with five-stage pipeline and variable-length instructions, enabling ultra-compact code and single-cycle instruction execution. Its clock system integrates multiple oscillators - high-speed on-chip (32 MHz ±1%), sub-clock (32.768 kHz), and IWDT-dedicated (15 kHz) - with independent ICLK/PCLK/FCLK domains and a Clock Accuracy Measurement circuit (CAC) for self-validation.

Peripheral integration includes a Data Transfer Controller (DTC) supporting normal, repeat, and block transfer modes triggered by 65 interrupt vectors; a 12-bit S12AD converter with 1.0 μs minimum conversion time and double-trigger capability for motor control; and multi-function timer unit MTU2 with four 16-bit channels supporting input capture, output compare, phase counting, and A/D trigger generation.

Key Specifications

Pinout & Package

Packaged in a 48-pin HWQFN (PWQN0048KB-A), the R5F51105AGNE#20 measures 7 × 7 mm with 0.5 mm pitch and requires connection of the exposed die pad to VSS for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51105ADNE#U0 and R5F51104AGNE#U0, the R5F51105AGNE#20 provides the highest thermal resilience (−40 to +105°C) and maximum flash capacity (128 Kbytes) within the HWQFN-48 footprint, making it optimal for mission-critical embedded systems where long-term reliability and firmware scalability are mandatory.

Availability

R5F51105AGNE#20 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart metering endpoints, and home appliance control systems requiring stable component supply, extended temperature operation, and IEC 60730 Class B compliance.

Supply support for R5F51105AGNE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX110 Group, including the R5F51105AGNE#20, was designed for cost-sensitive, space-constrained embedded applications demanding high code efficiency, ultra-low power consumption, and functional safety features - particularly in industrial automation and consumer white goods.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51105AGNE#20?

The R5F51105AGNE#20 operates at a maximum frequency of 32 MHz and delivers 50 DMIPS of processing performance. Its 32-bit RX CPU core features a five-stage pipeline, variable-length instruction encoding, and single-cycle execution for most instructions. Performance is sustained across the full 1.8–3.6 V supply range, with frequency scaling tied to voltage (e.g., 32 MHz only above 2.7 V).

Does the R5F51105AGNE#20 support IEC 60730 Class B functional safety certification?

Yes, the R5F51105AGNE#20 includes on-chip hardware features required for IEC 60730 Class B compliance: a Clock Accuracy Measurement circuit (CAC), Independent Watchdog Timer (IWDT) with dedicated oscillator, voltage detection circuits (LVDA), and RAM test assist functions. These enable runtime self-checks without external components, simplifying safety-certified designs.

What package type and dimensions does the R5F51105AGNE#20 use?

The R5F51105AGNE#20 uses the PWQN0048KB-A package: a 48-pin HWQFN measuring 7 × 7 mm with 0.5 mm pitch. The exposed die pad must be soldered to VSS for thermal dissipation and signal integrity. This compact footprint supports high-density PCB layouts typical in space-constrained IoT and appliance applications.

How many communication interfaces does the R5F51105AGNE#20 integrate?

The R5F51105AGNE#20 integrates five communication channels: two SCI modules (SCI1 and SCI5) supporting asynchronous, clock-synchronous, simple I²C, and simple SPI; one SCIf module (SCI12) with extended serial mode; one RIIC interface (I²C bus, up to 400 kbps); and one RSPI interface (SPI master/slave, up to 16 Mbps with 128-bit buffers).

What are the key low-power features of the R5F51105AGNE#20?

The R5F51105AGNE#20 offers three low-power modes: software standby (0.35 μA), deep sleep, and sleep. Recovery from software standby takes just 4.8 μs. Power consumption in high-speed operating mode is 0.1 mA/MHz. The MCU also supports module stop control and operating power control (high/middle/low-speed modes) to dynamically scale performance versus energy use.