Renesas R5F51113AGNF#2A

Overview

R5F51113AGNF#2A from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 64 KB on-chip flash, 10 KB SRAM, 8 KB data flash, 12-bit A/D converter (10 channels), USB 2.0 full-speed host/function/OTG, and RTC - deployed in industrial sensor nodes requiring low-power, real-time control with embedded connectivity.

For engineers reviewing the R5F51113AGNF#2A datasheet, R5F51113AGNF#2A pinout, R5F51113AGNF#2A application, or R5F51113AGNF#2A equivalent, key selection criteria include its 40-pin HWQFN (PWQN0040KC-A, 6 × 6 mm, 0.5 mm pitch) package, −40 to +105°C extended temperature grade, USB OTG support with BC (Battery Charger) compliance, and integrated DTC/ELC for deterministic low-latency peripheral coordination without CPU intervention.

Technical Context

The R5F51113AGNF#2A implements a CISC Harvard-architecture RX core with five-stage pipeline, variable-length instructions, and 64-bit accumulator for single-cycle 32×32 multiply-accumulate operations. Its clock system integrates PLL, high-speed on-chip oscillator (32 MHz ±1%), sub-clock (32.768 kHz), and CAC for IEC 60730-compliant frequency monitoring.

Peripheral subsystems include Event Link Controller (ELC) enabling direct module-to-module triggering (e.g., MTU timer event → A/D conversion start), Data Transfer Controller (DTC) supporting chain transfers across four modes, and USB 2.0 controller with dual-role OTG, isochronous transfer, and BC 1.2 support - all synchronized to independent ICLK/PCLK/FCLK domains.

Key Specifications

Pinout & Package

Packaged in a 40-pin HWQFN (PWQN0040KC-A, 6 × 6 mm, 0.5 mm pitch) with exposed thermal pad, the R5F51113AGNF#2A supports 24 general-purpose I/O pins, 4 5-V-tolerant inputs, 19 pull-up resistors, and 19 open-drain outputs - optimized for space-constrained industrial and portable designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F51113ADNF#UA, the R5F51113AGNF#2A provides extended temperature operation critical for under-hood or factory-floor deployment; versus R5F51114AGNF#UA, it trades flash/RAM capacity for lower BOM cost while retaining identical USB, ELC, and low-power architecture - making it optimal for thermally demanding, resource-constrained edge nodes.

Availability

R5F51113AGNF#2A is available at Aetrix Electronics and suitable for industrial sensor nodes, USB-C portable diagnostics, smart home thermostats, and factory automation edge nodes requiring stable component supply, long-term lifecycle assurance, and extended temperature operation.

Supply support for R5F51113AGNF#2A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX111 Group targets cost-sensitive, low-power embedded applications requiring USB connectivity, real-time control, and functional safety support - designed specifically for industrial sensors, building automation, and portable medical devices.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51113AGNF#2A?

The R5F51113AGNF#2A operates at a maximum frequency of 32 MHz and delivers 50 DMIPS of processing performance. Its RX CPU core features a five-stage pipeline, variable-length instruction set, and 64-bit accumulator capable of single-cycle 32×32 multiply-accumulate operations - enabling efficient real-time signal processing and control loop execution within the R5F51113AGNF#2A's thermal and power envelope.

Does the R5F51113AGNF#2A support USB On-The-Go (OTG) functionality?

Yes, the R5F51113AGNF#2A integrates a USB 2.0 full-speed host/function module that fully supports On-The-Go (OTG) operation. It complies with USB BC 1.2 for battery charger detection, supports isochronous transfers, and includes dedicated pins (USB0_DP/USB0_DM), VBUS monitoring (USB0_VBUS), and OTG control signals (USB0_ID, USB0_EXICEN) - all implemented in silicon within the R5F51113AGNF#2A die.

What are the memory resources available on the R5F51113AGNF#2A?

The R5F51113AGNF#2A includes 64 KB of on-chip flash memory (executed with zero wait states at 32 MHz), 10 KB of SRAM, and 8 KB of data flash rated for 1,000,000 erase/write cycles. The flash supports self-programming and serial programming via USB or SCI, while the data flash enables reliable parameter storage and field firmware updates - all accessible directly by the R5F51113AGNF#2A's CPU without external memory controllers.

Which analog peripherals are included in the R5F51113AGNF#2A?

The R5F51113AGNF#2A integrates a 12-bit successive-approximation A/D converter with 10 input channels (AN000–AN009), 1.0 µs minimum conversion time at 32 MHz ADCLK, and double-trigger mode for motor control redundancy. It also includes a temperature sensor interfaced to the A/D converter. Notably, the 8-bit D/A converter (DA0/DA1) is absent in the 40-pin HWQFN package - confirmed in Table 1.2 of the R5F51113AGNF#2A datasheet.

What low-power modes does the R5F51113AGNF#2A support, and what are their key characteristics?

The R5F5113AGNF#2A supports three low-power modes: Sleep, Deep Sleep, and Software Standby. In Software Standby mode, it draws just 0.44 µA while retaining SRAM and RTC operation, with a 4.8 µs wake-up time to full-speed execution. The high-speed operating mode consumes 0.11 mA/MHz, and voltage scaling allows dynamic adjustment between 8/16/32 MHz based on VCC level - all managed autonomously by the R5F51113AGNF#2A's on-chip power control unit.