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Renesas R5F51114AGFK#3A

Part No.:
R5F51114AGFK#3A
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixR5F51114AGFK#3A.pdf
Description:
IC MCU 32BIT 96KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:720

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Product details

Overview

R5F51114AGFK#3A from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 96 KB on-chip flash, 16 KB SRAM, 8 KB data flash, 14-channel 12-bit ADC, dual 8-bit DACs, USB 2.0 full-speed host/function/OTG, RTC with calendar mode, and six communication interfaces - deployed in industrial sensor nodes and low-power HMI control systems.

For engineers reviewing the R5F51114AGFK#3A datasheet, R5F51114AGFK#3A pinout, R5F51114AGFK#3A application, or R5F51114AGFK#3A equivalent, key selection criteria include its 64-pin LQFP (PLQP0064GA-A) package, −40 to +105°C extended temperature grade, integrated E2 data flash endurance (1M erase/write cycles), and hardware-accelerated event link controller (ELC) for interrupt-free peripheral coordination.

Technical Context

The R5F51114AGFK#3A implements a CISC Harvard-architecture RX core with five-stage pipeline, variable-length instructions, and 64-bit accumulator for single-cycle 32×32 multiply-accumulate operations. Its clock system integrates PLL, high-speed on-chip oscillator (32 MHz ±1%), sub-clock (32.768 kHz), and CAC for real-time frequency accuracy monitoring.

Peripheral subsystems include a 6-channel MTU2 timer with complementary PWM and phase counting, DTC supporting chain transfers triggered by 82 interrupt sources, and ELC enabling direct module-to-module triggering without CPU intervention - all synchronized to independent ICLK/PCLK/FCLK domains.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RX 32-bit CISC Harvard, 32 MHz max, 50 DMIPS, 64-bit accumulator, 73 basic + 9 DSP instructions
Memory 96 KB flash (no wait states @32 MHz), 16 KB SRAM, 8 KB data flash (1M erase/write cycles)
Analog Peripherals 14-channel 12-bit ADC (1.0 µs min conversion), dual 8-bit DACs (0–VCC output), integrated temperature sensor
Communication USB 2.0 FS host/function/OTG (12 Mbps), 3× SCI, 1× RIIC (400 kbps), 1× RSPI (16 Mbps), 1× CAN not present
Timers & Control 6-channel MTU2 (PWM/complementary/phase count), 2× CMT, RTC with leap-year/calendar mode, IWDT with 15 kHz dedicated oscillator
Power & Environment 1.8–3.6 V supply, −40 to +105°C (G-grade), software standby current = 0.44 µA, wake-up time = 4.8 µs
Package 64-pin LQFP (PLQP0064GA-A), 14 × 14 mm, 0.8 mm pitch, lead-free (Sn only)

Pinout & Package

Package: 64-pin LQFP (PLQP0064GA-A), 14 × 14 mm body, 0.8 mm pitch, exposed pad not present, RoHS-compliant Sn-only termination.

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Core power / ground Dual 3.3 V supply domains: VCC powers digital logic; VSS provides reference return path for all circuits
XTAL / EXTAL Main crystal oscillator interface Supports external 1–20 MHz crystal; enables precise timing for USB and RTC when paired with sub-clock (XCIN/XCOUT)
USB0_DP / USB0_DM USB 2.0 differential data pair Integrated transceiver supports full-speed (12 Mbps) host/function/OTG; requires 3.3 V VCC_USB and VSS_USB isolation
AN000–AN015 Analog input channels 14 of 16 pins support 12-bit A/D conversion; AVCC0/AVSS0/VREFH0/VREFL0 define analog domain voltage references
DA0 / DA1 Digital-to-analog outputs Two independent 8-bit voltage-output DACs (0–VCC range); available only on 64-pin packages per datasheet Table 1.2
MTIOC0A–MTIOC5W Multi-function timer I/O 16 dedicated pins for PWM, input capture, complementary outputs, and external pulse counting across six MTU2 channels
RES# Active-low reset input Asynchronous hardware reset; assertion forces CPU into reset state regardless of clock or power mode

Key Features

Feature Design Value
Event Link Controller (ELC) Enables 35 event types to trigger peripheral actions (e.g., MTU start, ADC conversion) without CPU interrupt latency or overhead
Data Transfer Controller (DTC) Hardware DMA with chain transfer; relieves CPU from memory-mapped peripheral data movement during burst transfers
Background Operation (BGO) Allows simultaneous execution of code from flash while erasing/writing data flash - critical for firmware updates in field-deployed devices
Clock Accuracy Measurement (CAC) On-chip circuit measures internal oscillator drift vs. external reference; supports IEC 60730 Class B functional safety compliance
Realtime Clock (RTC) Sub-clock-driven calendar counter with leap-year correction, alarm/periodic interrupts, and software-standby wake-up capability
Low-Power Modes Three distinct modes: high-speed (0.11 mA/MHz), deep sleep, and software standby (0.44 µA, 4.8 µs wake-up)

Applications

Industrial Sensor Node USB-Capable HMI Controller

Use Scenario: Compact environmental monitor with temperature, humidity, and CO₂ sensing, transmitting data via USB to gateway.

IC Role / Device Role / Timing Role: Central MCU managing sensor acquisition (ADC + temp sensor), USB device enumeration, and RTC-stamped logging.

Use Value: Integrated 12-bit ADC, USB 2.0 function mode, and 8 KB data flash enable local storage and plug-and-play host connectivity without external PHY.

Use Scenario: Touch-enabled panel controller for HVAC or lighting systems requiring local UI rendering and USB configuration upload.

IC Role / Device Role / Timing Role: Real-time UI processor with PWM-driven LED backlight control, touch scan via GPIO, and USB mass-storage emulation for firmware updates.

Use Value: Dual 8-bit DACs drive analog backlight dimming; ELC synchronizes touch scan with display refresh; USB OTG allows field reprogramming via USB stick.

Energy Metering Subsystem Programmable Logic Controller (PLC) I/O Module

Use Scenario: DIN-rail mounted metering module measuring voltage/current harmonics and communicating via USB or RS-485 (SCI).

IC Role / Device Role / Timing Role: Precision measurement engine using ADC double-trigger mode for motor control-grade sampling, with CRC-protected data logging.

Use Value: 1.0 µs ADC conversion + double-trigger duplication ensures accurate harmonic analysis; CRC calculator validates flash-resident calibration tables.

Use Scenario: Modular PLC base unit handling discrete I/O expansion, analog input conditioning, and fieldbus bridging (e.g., RSPI-to-Modbus).

IC Role / Device Role / Timing Role: Deterministic I/O coordinator using MTU2 for pulse-width modulation of solenoid drivers and SCI for Modbus RTU protocol stack.

Use Value: Six MTU2 channels support simultaneous PWM outputs and encoder quadrature decoding; RSPI's 128-bit buffers reduce CPU load during burst register reads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F51114AGFM#3A Same core, memory, peripherals; differs only in package: 64-pin LFQFP (PLQP0064KB-A), 10 × 10 mm, 0.5 mm pitch Higher pin density; better suited for space-constrained PCBs where thermal dissipation permits smaller footprint Select R5F51114AGFM#3A for compact designs needing finer pitch; R5F51114AGFK#3A preferred for manual assembly or thermal margin-critical layouts
R5F51115AGFK#3A 128 KB flash, 16 KB RAM, same package; otherwise identical peripheral set and timing specs Supports larger firmware images (e.g., USB host stacks with HID + MSC class drivers) without external memory Choose R5F51115AGFK#3A when firmware growth exceeds 96 KB; no PCB changes required if migrating within same package family

Compared with R5F51114AGFK#3A, R5F51114AGFM#3A offers identical functionality in a smaller 0.5 mm-pitch LQFP, while R5F51115AGFK#3A adds 32 KB flash for complex USB host implementations - both retain full pin compatibility and temperature rating.

Availability

R5F51114AGFK#3A is available at Aetrix Electronics and suitable for industrial sensor nodes, USB-capable HMI controllers, and energy metering subsystems requiring stable component supply, long-term lifecycle assurance, and extended temperature operation.

Supply support for R5F51114AGFK#3A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX111 Group targets cost-sensitive, low-power industrial applications - delivering high integration (USB, RTC, ADC, DAC) and functional safety readiness (IEC 60730) in compact packages.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51114AGFK#3A?

The R5F51114AGFK#3A operates at a maximum frequency of 32 MHz and delivers 50 DMIPS performance. Its RX CPU core features a five-stage pipeline, variable-length instruction encoding, and a 64-bit accumulator enabling single-cycle 32×32 multiply-accumulate operations - verified in Renesas documentation R01DS0190EJ0130.

Does the R5F51114AGFK#3A support USB On-The-Go (OTG) functionality?

Yes, the R5F51114AGFK#3A integrates a USB 2.0 host/function module compliant with USB 2.0 specification, supporting full-speed (12 Mbps), low-speed (1.5 Mbps), isochronous transfers, Battery Charger (BC) detection, and On-The-Go (OTG) operation - confirmed in Section 1.4 of datasheet R01DS0190EJ0130.

What are the analog capabilities of the R5F51114AGFK#3A, particularly regarding ADC and DAC?

The R5F51114AGFK#3A includes a 14-channel 12-bit A/D converter with minimum 1.0 µs conversion time and double-trigger mode for motor control, plus two 8-bit D/A converters (DA0/DA1) with 0–VCC output range - both features explicitly enabled in 64-pin packages per Table 1.2 of R01DS0190EJ0130.

What low-power modes does the R5F51114AGFK#3A support, and what are their key characteristics?

The R5F51114AGFK#3A supports three low-power modes: high-speed operating mode (0.11 mA/MHz), deep sleep mode, and software standby mode (0.44 µA typical, 4.8 µs wake-up time). These are managed via the LPMCR register and validated across −40 to +105°C per Section 1.1 of R01DS0190EJ0130.

Is the R5F51114AGFK#3A qualified for extended temperature operation, and what is its grade designation?

Yes, the R5F51114AGFK#3A is rated for −40 to +105°C operation and carries the 'G' grade suffix in its part number - indicating extended temperature qualification per Renesas product coding in Figure 1.1 of R01DS0190EJ0130.

R5F51114AGFK#3A Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
RX111
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RX
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
I2C, SCI, SPI, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x12b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F51114AGFK#3A FAQ

1.How can I place an order for R5F51114AGFK#3A through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F51114AGFK#3A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F51114AGFK#3A reliable?

The price and inventory of R5F51114AGFK#3A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F51114AGFK#3A is usually 5 days.

3.What payment methods are accepted for R5F51114AGFK#3A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F51114AGFK#3A transactions.

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4.How is shipping managed for R5F51114AGFK#3A?

R5F51114AGFK#3A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F51114AGFK#3A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F51114AGFK#3A?

For technical support, including R5F51114AGFK#3A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F51114AGFK#3A requirements.

6.How does Aetrix verify that R5F51114AGFK#3A is sourced from the original manufacturer or authorized distributors?

All R5F51114AGFK#3A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F51114AGFK#3A meets industry standards.

7.What is the process for return or replacement of R5F51114AGFK#3A?

All R5F51114AGFK#3A units undergo pre-shipment inspection (PSI). If there is an issue with R5F51114AGFK#3A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F51114AGFK#3A part is unused and in its original packaging.

Return procedure for R5F51114AGFK#3A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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