Renesas R5F51117ADFL#3A

Overview

R5F51117ADFL#3A from Renesas is a 32-bit RX111 Group microcontroller featuring a 32 MHz CPU core delivering 50 DMIPS, 384 KB on-chip flash memory, 64 KB SRAM, and 8 KB data flash with 1M erase/write cycles. It integrates USB 2.0 full-speed host/function/OTG, 12-bit A/D converter (14 channels), 8-bit D/A converter (2 channels), RTC, and operates from 1.8–3.6 V across −40 to +85°C - used in industrial HMI and portable medical sensor nodes.

For engineers reviewing the R5F51117ADFL#3A datasheet, R5F51117ADFL#3A pinout, R5F51117ADFL#3A application, or R5F51117ADFL#3A equivalent, this page delivers verified specifications, package mapping to PLQP0048KB-A (48-pin LFQFP, 7×7 mm, 0.5 mm pitch), validated peripheral configurations, and real-world design context for rapid integration into low-power embedded systems.

Technical Context

The R5F51117ADFL#3A implements a CISC Harvard-architecture RX CPU with five-stage pipeline, variable-length instructions, and 64-bit accumulator for single-cycle 32×32 multiply-accumulate operations. Its clock system includes high-speed on-chip oscillator (32 MHz ±1%), PLL, sub-clock (32.768 kHz), and CAC for frequency accuracy monitoring.

Peripheral coordination is managed via Event Link Controller (ELC) enabling direct module-to-module triggering without CPU intervention, and Data Transfer Controller (DTC) supporting chain transfers across four modes. The MCU supports IEC 60730 Class B compliance with IWDT, RAM test assist, and LVD circuits.

Key Specifications

Pinout & Package

Package: PLQP0048KB-A - 48-pin Low-Profile Quad Flat Package, 7 mm × 7 mm body, 0.5 mm lead pitch, exposed pad (non-electrical), RoHS-compliant Sn finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51117ADFL#3A, R5F51117ADFM#3A offers higher I/O density and peripheral scalability in a larger package, while R5F51115ADFL#3A trades flash/RAM capacity for lower unit cost - all three share identical clock architecture, USB stack, and safety features for consistent software reuse.

Availability

R5F51117ADFL#3A is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical sensor nodes, smart home energy meters, and programmable logic controller I/O modules requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for R5F51117ADFL#3A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX111 Group, including R5F51117ADFL#3A, was designed for cost-sensitive, low-power embedded applications demanding USB connectivity, analog integration, and functional safety support - targeting industrial controls and portable instrumentation.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51117ADFL#3A?

The R5F51117ADFL#3A operates at a maximum frequency of 32 MHz and delivers 50 DMIPS (Dhrystone MIPS) performance. Its RX CPU core features a five-stage pipeline, 64-bit accumulator, and single-cycle 32×32 multiplication - enabling deterministic real-time execution for motor control and sensor processing tasks in the R5F51117ADFL#3A.

Does the R5F51117ADFL#3A support USB On-The-Go (OTG) functionality?

Yes, the R5F51117ADFL#3A integrates a USB 2.0 host/function module compliant with OTG specification, supporting full-speed (12 Mbps) and low-speed (1.5 Mbps) modes, isochronous transfers, and Battery Charging (BC) detection. USB0_ID, USB0_VBUS, and USB0_EXICEN pins enable dual-role operation - confirmed in the R5F51117ADFL#3A datasheet section 1.4 and Table 1.1.

What are the memory resources available on the R5F51117ADFL#3A?

The R5F51117ADFL#3A includes 384 KB of on-chip flash memory (executed at full 32 MHz with zero wait states), 64 KB of SRAM, and 8 KB of data flash rated for 1,000,000 erase/write cycles. All memory blocks operate without wait states at maximum CPU speed, and the data flash supports background operation (BGO) - key attributes of the R5F51117ADFL#3A's embedded architecture.

Which package type does the R5F51117ADFL#3A use, and what are its mechanical dimensions?

The R5F51117ADFL#3A uses the PLQP0048KB-A package: a 48-pin Low-Profile Quad Flat Package measuring 7 mm × 7 mm with 0.5 mm lead pitch and an exposed thermal pad. This footprint is optimized for compact industrial and portable designs and is explicitly listed in Table 1.3 of the R5F51117ADFL#3A datasheet (R01DS0190EJ0130).

Does the R5F51117ADFL#3A include hardware support for functional safety standards like IEC 60730?

Yes, the R5F51117ADFL#3A integrates dedicated hardware for IEC 60730 Class B compliance, including a Clock Frequency Accuracy Measurement Circuit (CAC), Independent Watchdog Timer (IWDT) with dedicated 15 kHz oscillator, RAM test assist functions, and dual-level Low Voltage Detection (LVD). These features are documented in the R5F51117ADFL#3A datasheet sections "On-chip functions for IEC 60730 compliance" and Table 1.1.