Renesas R5F51303AGFK#30

Overview

R5F51303AGFK#30 from Renesas Electronics is a 32-bit RX CPU-based microcontroller in the RX130 Group, operating at up to 32 MHz with 50 DMIPS performance, 64 KB on-chip flash, 10 KB SRAM, and 8 KB data flash. It integrates a 12-bit A/D converter (14 channels), two 8-bit D/A outputs, capacitive touch sensing (32 channels), I²C, SCI, RSPI, RTC, low-power timer, and independent watchdog timer. It targets cost-sensitive industrial control and consumer HMI applications requiring robust IEC60730 compliance support.

For engineers reviewing the R5F51303AGFK#30 datasheet, R5F51303AGFK#30 pinout, R5F51303AGFK#30 application, or R5F51303AGFK#30 equivalent, key selection considerations include its LQFP-64 (0.8 mm pitch) package, –40°C to +105°C extended temperature rating, 1.8–5.5 V single-supply operation, and integrated capacitive touch sensing with self- and mutual-capacitance modes for up to 324 keys.

Technical Context

The R5F51303AGFK#30 implements the 32-bit RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and 1-instruction-per-cycle execution for critical real-time tasks. Its clock system includes a 32 MHz ±1% high-speed on-chip oscillator, sub-clock (32.768 kHz), PLL (4–8 MHz input), and dedicated 15 kHz IWDT oscillator, all managed via the Clock Frequency Accuracy Measurement Circuit (CAC).

Peripheral integration centers on event-driven efficiency: the Event Link Controller (ELC) enables direct inter-module triggering without CPU intervention, while the Data Transfer Controller (DTC) supports chain transfer across four modes. The Multi-function Timer Pulse Unit 2 (MTU2) provides six 16-bit channels with complementary PWM, phase counting, and A/D trigger generation-critical for motor control and timing-critical sensing.

Key Specifications

Pinout & Package

Package: PLQP0064GA-A - 64-pin LQFP, 14 × 14 mm body, 0.8 mm pitch, exposed pad not specified, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51303AGFK#30, R5F51303ADFK#30 reduces thermal margin but lowers unit cost, while R5F51305AGFK#30 adds memory headroom for complex control algorithms-both retain identical pinout, peripheral set, and toolchain compatibility.

Availability

R5F51303AGFK#30 is available at Aetrix Electronics and suitable for industrial HMI, smart appliance control, and battery-powered sensor nodes requiring stable component supply, extended temperature operation, and long-term manufacturing continuity.

Supply support for R5F51303AGFK#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX130 Group is designed for cost-optimized, low-power embedded applications demanding rich analog integration, capacitive touch capability, and functional safety support-targeting white goods, building automation, and portable industrial tools.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51303AGFK#30?

The R5F51303AGFK#30 operates at a maximum frequency of 32 MHz and delivers 50 DMIPS of processing performance. Its RXv1 32-bit CPU core features a 5-stage pipeline and variable-length instruction set, enabling efficient real-time execution. Performance is sustained across the full 1.8–5.5 V supply range, with frequency scaling tied to voltage (e.g., 32 MHz only above 2.7 V). This makes the R5F51303AGFK#30 suitable for deterministic control loops in appliances and industrial interfaces.

Does the R5F51303AGFK#30 support IEC60730 Class B compliance out of the box?

Yes, the R5F51303AGFK#30 includes hardware-assisted IEC60730 Class B compliance features: self-diagnostic routines for the A/D converter and clock accuracy measurement circuit (CAC), analog input disconnection detection, RAM test assistance via the Data Operation Circuit (DOC), and independent watchdog timer (IWDT) with dedicated 15 kHz oscillator. These are documented in the R01DS0273EJ0300 datasheet and require minimal software initialization-no external components needed to meet core diagnostic requirements for household appliance certification.

How many capacitive touch channels does the R5F51303AGFK#30 support, and what configurations are available?

The R5F51303AGFK#30 integrates a Capacitive Touch Sensing Unit (CTSU) supporting up to 32 dedicated touch pins (TS0–TS31). It enables both self-capacitance mode (one pin per key, up to 32 keys) and mutual-capacitance matrix mode (32 pins arranged as rows/columns, supporting up to 324 keys). Configuration is software-selectable, and the unit includes built-in noise suppression and baseline tracking-making the R5F51303AGFK#30 ideal for robust touch panels in humid or EMI-prone environments.

What are the memory resources allocated to the R5F51303AGFK#30?

The R5F51303AGFK#30 contains 64 KB of on-chip flash memory for program storage, 10 KB of SRAM for runtime variables and stack, and 8 KB of data flash memory rated for 1,000,000 program/erase cycles. Flash and SRAM operate with zero wait states at 32 MHz, and data flash supports Background Operation (BGO), allowing concurrent code execution during reprogramming. These allocations are fixed for this part number and confirmed in Table 1.3 of the R01DS0273EJ0300 datasheet.

Is the R5F51303AGFK#30 pin-compatible with other members of the RX130 Group in the same package?

Yes, the R5F51303AGFK#30 is pin-compatible with all other RX130 Group devices in the PLQP0064GA-A (64-pin LQFP, 0.8 mm pitch) package-including R5F51305AGFK#30 and R5F51306BGFK#30. Pin functions, power domains, and peripheral mappings are identical across the family within the same package variant. This allows hardware reuse and firmware scalability: upgrading flash/RAM capacity requires only binary replacement, not PCB revision.