Renesas R5F51305BDFP#30

Overview

R5F51305BDFP#30 from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 128 KB on-chip flash, 16 KB SRAM, 8 KB data flash, 12-bit A/D converter (17 channels), dual 8-bit D/A outputs, capacitive touch sensing (36 channels), and IEC60730-compliant safety functions - deployed in industrial control panels requiring low-power operation and embedded touch interfaces.

For engineers reviewing the R5F51305BDFP#30 datasheet, R5F51305BDFP#30 pinout, R5F51305BDFP#30 application, or R5F51305BDFP#30 equivalent, key selection criteria include its 100-pin LFQFP package, 1.8–5.5 V single-supply operation, software standby current of 0.37 µA, 4.8 µs wake-up time, and integrated RTC with calendar mode.

Technical Context

The R5F51305BDFP#30 implements the RXv1 core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates an Event Link Controller (ELC) that enables direct module-to-module triggering without CPU intervention - critical for deterministic low-power sensor node operation.

Its clock system includes independent high-speed (32 MHz ±1%) and low-speed (15 kHz IWDT-dedicated) on-chip oscillators, plus PLL, sub-clock (32.768 kHz), and main oscillator inputs - all managed via the Clock Frequency Accuracy Measurement Circuit (CAC) for IEC60730 compliance.

Key Specifications

Pinout & Package

Package: PLQP0100KB-B - 100-pin Low-Profile Quad Flat Package, 14 mm × 14 mm, 0.5 mm pitch, exposed pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51305ADFP#30 (obsolete A-version) and R5F51306BDFP#30 (256 KB variant), the R5F51305BDFP#30 delivers optimal balance of cost, footprint, and feature set for mid-complexity industrial HMI and sensor nodes - offering full RX130 peripheral integration without over-provisioning memory.

Availability

R5F51305BDFP#30 is available at Aetrix Electronics and suitable for industrial control panels, smart appliance HMIs, energy monitoring gateways, and portable medical devices requiring stable component supply and long-term lifecycle support.

Supply support for R5F51305BDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX130 Group is designed for cost-sensitive, low-power embedded applications demanding rich analog integration, capacitive touch, functional safety, and real-time performance - targeting industrial HMIs and white goods.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51305BDFP#30?

The R5F51305BDFP#30 operates at a maximum frequency of 32 MHz and delivers 50 DMIPS of processing performance using the 32-bit RXv1 CPU core. Its 5-stage pipeline, variable-length instruction set, and on-chip multiplier/divider enable efficient execution of real-time control algorithms. The R5F51305BDFP#30 achieves this performance across its full 1.8–5.5 V supply range, with no wait states on flash access.

Does the R5F51305BDFP#30 support IEC60730 functional safety compliance?

Yes, the R5F51305BDFP#30 includes dedicated hardware features for IEC60730 Class B compliance, including self-diagnostic functions for the A/D converter, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance via the Data Operation Circuit (DOC). These capabilities are documented in the R01DS0273EJ0300 datasheet and reduce external safety component requirements. The R5F51305BDFP#30 itself is not certified, but provides the necessary building blocks for system-level certification.

What package type and pin count does the R5F51305BDFP#30 use?

The R5F51305BDFP#30 uses the PLQP0100KB-B package: a 100-pin Low-Profile Quad Flat Package measuring 14 mm × 14 mm with 0.5 mm pitch and an exposed thermal pad. This package is pin-compatible with other RX130 Group members in the 100-pin variant, enabling scalable design across memory configurations. The R5F51305BDFP#30's pin functions - including 36 CTSU channels, 17 ADC inputs, and 24 MTU2 waveform I/O - are fully defined in the datasheet's Pin Functions table.

How much on-chip memory does the R5F51305BDFP#30 include?

The R5F51305BDFP#30 integrates 128 KB of on-chip flash memory (with no wait states at 32 MHz), 16 KB of SRAM, and 8 KB of data flash rated for 1,000,000 program/erase cycles. The flash supports in-system programming at 1.8 V, and the data flash enables background operation (BGO) for concurrent code execution and firmware updates. All memory blocks are accessible without external components, and the R5F51305BDFP#30's memory map is linear and unified per the RX architecture.

What communication interfaces are available on the R5F51305BDFP#30?

The R5F51305BDFP#30 provides seven Serial Communications Interface (SCI) channels (SCI0,1,5,6,8,9,12), one I²C bus interface (RIIC), one Serial Peripheral Interface (RSPI), and supports Simple I²C/SPI modes on SCI channels. It also includes an Event Link Controller (ELC) for hardware-triggered transfers. These interfaces operate concurrently - for example, SCI0 for debug, RIIC for sensor communication, and RSPI for display driver - all managed without CPU overhead via ELC and DTC. The R5F51305BDFP#30 does not include CAN or Ethernet peripherals.