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Renesas R5F51305BGFP#30
- Part No.:
- R5F51305BGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F51305BGFP#30.pdf
- Description:
- IC MCU 32BIT 128MB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:540
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Product details
Overview
R5F51305BGFP#30 from Renesas is a 32-bit RX CPU-based microcontroller with 128 KB flash, 16 KB SRAM, and 8 KB data flash, operating at up to 32 MHz (50 DMIPS), featuring integrated 12-bit A/D (17 channels), dual 8-bit D/A, capacitive touch sensing (36 channels), RTC, and IEC60730-compliant safety functions for industrial control panels and appliance HMI systems.
For engineers reviewing the R5F51305BGFP#30 datasheet, R5F51305BGFP#30 pinout, R5F51305BGFP#30 application, or R5F51305BGFP#30 equivalent, key selection criteria include its 100-pin LFQFP package, –40°C to +105°C temperature grade, 1.8–5.5 V single-supply operation, and support for ELC-driven low-power peripheral coordination without CPU wake-up.
Technical Context
The R5F51305BGFP#30 implements a CISC Harvard-architecture RX core with 5-stage pipeline, variable-length instructions, and 64-bit accumulator for single-cycle 32×32 multiply operations. Its clock system integrates high-speed on-chip oscillator (32 MHz ±1%), sub-clock (32.768 kHz), PLL, and dedicated IWDT oscillator (15 kHz).
Peripheral coordination is enabled by the Event Link Controller (ELC), allowing direct module-to-module triggering (e.g., MTU timer event → A/D conversion start) while the CPU remains in deep sleep mode. The Data Transfer Controller (DTC) supports normal, repeat, and block transfer modes triggered by 115 interrupt sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RX 32-bit CISC with 5-stage pipeline, 50 DMIPS @32 MHz |
| Flash Memory | 128 KB on-chip flash with zero wait states at full speed |
| SRAM | 16 KB on-chip SRAM, no wait states |
| A/D Converter | 12-bit resolution, 17 input channels, 1.4 µs min conversion time |
| D/A Converter | 2 × 8-bit channels, output range 0 V to AVCC0 |
| Operating Temp | –40°C to +105°C (G-grade industrial/automotive-qualified) |
| Supply Voltage | 1.8 V to 5.5 V single supply, enabling direct interface with 3.3 V or 5 V peripherals |
Pinout & Package
Package: PLQP0100KB-B - 100-pin Low-Profile Quad Flat Package, 14 mm × 14 mm, 0.5 mm pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: digital VCC/VSS and analog AVCC0/AVSS0 enable noise-isolated mixed-signal operation |
| XTAL / EXTAL | Main clock oscillator interface | Supports external crystal up to 20 MHz or direct clock input for precise timing control |
| AN000–AN007, AN016–AN031 | Analog inputs | 17-channel 12-bit A/D input mapping with per-channel sampling time programmability |
| DA0 / DA1 | Analog outputs | Two independent 8-bit voltage-output DACs for sensor biasing or actuator control |
| MTIOC0A–MTIOC4D | PWM/timer I/O | Six 16-bit MTU channels supporting complementary PWM, phase counting, and input capture for motor control |
| TS0–TS35 | Capacitive touch sense | 36 dedicated CTSU pins supporting self- or mutual-capacitance configurations for up to 324-key touch matrix |
Key Features
| Feature | Design Value |
|---|---|
| IEC60730 Safety Support | Integrated RAM test assistance, A/D self-diagnostic, clock accuracy measurement (CAC), and analog disconnection detection |
| Low-Power Operation | Software standby current of 0.37 µA with LPT active; 4.8 µs wake-up time from standby |
| Event-Driven Peripherals | ELC enables 47 event types to trigger peripheral actions (e.g., timer overflow → A/D start) without CPU intervention |
| Capacitive Touch Unit | CTSU supports both self-capacitance (36 keys) and mutual-capacitance (324 keys) with built-in noise suppression |
| Communication Flexibility | 6 × SCI (asynchronous/clock-sync/Smart Card), 1 × RIIC (400 kbps), 1 × RSPI (16 Mbps), all configurable via MPC |
Applications
| Home Appliance Control Panel | Industrial Sensor Node |
|---|---|
Use Scenario: Touch-enabled microwave oven or washing machine UI with real-time status feedback and motor control. IC Role / Device Role / Timing Role: Main MCU executing HMI logic, driving capacitive touch overlay, generating PWM for BLDC fan/motor, and managing RTC-based cycle timing. Use Value: Single-chip integration of touch sensing, 12-bit A/D for temperature/pressure monitoring, dual DACs for analog sensor calibration, and IEC60730 compliance reduces BOM count and certification effort. | Use Scenario: Battery-powered environmental monitor deployed in factory HVAC ducts with wireless telemetry. IC Role / Device Role / Timing Role: Low-power sensor aggregator collecting temperature, humidity, and airflow data via A/D and internal TEMPSA, then transmitting via SCI/RSPI to gateway. Use Value: 0.37 µA software standby current with LPT running enables multi-year battery life; ELC-triggered A/D sampling eliminates CPU wake-ups, extending duty cycle. |
| Medical Front-End Device | Automotive Body Control Module |
Use Scenario: Portable blood pressure cuff with analog front-end, display driver, and USB/UART communication. IC Role / Device Role / Timing Role: Signal processor interfacing with analog pressure transducer (via A/D), driving segment LCD (via GPIO/SCI), and managing user input (CTSU). Use Value: Integrated 12-bit A/D with double-trigger mode ensures accurate systolic/diastolic pulse capture; DACs provide reference voltages for analog signal conditioning. | Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN/UART diagnostics. IC Role / Device Role / Timing Role: Body controller executing LIN protocol (SCIh channel 12), managing PWM dimming (MTU), and detecting switch inputs (GPIO with IRQ). Use Value: –40°C to +105°C rating ensures reliability under hood/door cavity thermal stress; 5-V tolerant I/O simplifies interface with legacy automotive switches and sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F51305ADFP#30 | Same RX130 core, identical peripherals, but rated for –40°C to +85°C (D-grade) instead of +105°C (G-grade) | Suitable for commercial indoor applications; not qualified for under-hood or high-ambient industrial environments | Select when extended temperature range is unnecessary and cost optimization is prioritized |
| R5F51306BGFP#30 | 256 KB flash / 32 KB SRAM variant; otherwise identical pinout, peripherals, and G-grade temperature rating | Required when firmware complexity exceeds 128 KB or additional SRAM is needed for buffering or RTOS stacks | Choose for future-proofing or larger application code footprint without changing PCB layout |
Compared with R5F51305BGFP#30, R5F51305ADFP#30 offers identical functionality at lower thermal qualification, while R5F51306BGFP#30 provides scalable memory headroom-both retain full pin compatibility and peripheral feature parity, enabling seamless migration within the same 100-pin LFQFP footprint.
Availability
R5F51305BGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, appliance control, medical front-ends, and automotive body electronics requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F51305BGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.
The RX130 Group targets cost-sensitive, safety-aware embedded applications requiring rich analog integration, capacitive touch, and IEC60730 compliance-all in compact packages like the R5F51305BGFP#30's 100-pin LFQFP.
FAQ
What is the maximum operating frequency and performance of the R5F51305BGFP#30?
The R5F51305BGFP#30 operates at a maximum frequency of 32 MHz, delivering 50 DMIPS of processing performance. Its RX CPU core features a 5-stage pipeline, variable-length instructions, and a 64-bit accumulator capable of single-cycle 32×32 multiplication. This enables deterministic real-time response for motor control, touch processing, and sensor fusion tasks in the R5F51305BGFP#30.
Does the R5F51305BGFP#30 support IEC60730 functional safety requirements?
Yes, the R5F51305BGFP#30 includes hardware-assisted IEC60730 compliance features: A/D converter self-diagnostic and analog input disconnection detection, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT) with dedicated 15 kHz oscillator, RAM test assistance via DOC, and voltage monitoring with multiple LVD levels. These capabilities are documented in the R5F51305BGFP#30 datasheet sections covering safety support.
What package type and pin count does the R5F51305BGFP#30 use?
The R5F51305BGFP#30 uses the PLQP0100KB-B package: a 100-pin Low-Profile Quad Flat Package measuring 14 mm × 14 mm with 0.5 mm pitch. This is confirmed in Table 1.3 of the R5F51305BGFP#30 datasheet (R01DS0273EJ0300), where "FP" denotes 100-pin LFQFP and "G" indicates the +105°C temperature grade.
How many capacitive touch channels does the R5F51305BGFP#30 support?
The R5F51305BGFP#30 integrates a Capacitive Touch Sensing Unit (CTSUa) supporting up to 36 touch channels in self-capacitance mode (one pin per key) or up to 324 keys in mutual-capacitance matrix configuration using 36 pins. This capability is specified in Table 1.2 of the R5F51305BGFP#30 datasheet and applies specifically to the 100-pin variant.
What are the memory resources available on the R5F51305BGFP#30?
The R5F51305BGFP#30 includes 128 KB of on-chip flash memory (zero wait states at 32 MHz), 16 KB of SRAM (no wait states), and 8 KB of data flash rated for 1,000,000 program/erase cycles. These values are explicitly listed in Table 1.3 of the R5F51305BGFP#30 datasheet under the "ROM Capacity", "RAM Capacity", and "E2 DataFlash" columns for part number R5F51305BGFP#30.
R5F51305BGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX130
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 88
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F51305BGFP#30 FAQ
1.How can I place an order for R5F51305BGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F51305BGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F51305BGFP#30 reliable?
The price and inventory of R5F51305BGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F51305BGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F51305BGFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F51305BGFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F51305BGFP#30?
R5F51305BGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F51305BGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F51305BGFP#30?
For technical support, including R5F51305BGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F51305BGFP#30 requirements.
6.How does Aetrix verify that R5F51305BGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F51305BGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F51305BGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F51305BGFP#30?
All R5F51305BGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F51305BGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F51305BGFP#30 part is unused and in its original packaging.
Return procedure for R5F51305BGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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