Renesas R5F51306ADFP#30

Overview

R5F51306ADFP#30 from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 256 KB on-chip flash, 32 KB SRAM, 8 KB data flash, 12-bit A/D converter (17 channels), two 8-bit D/A outputs, capacitive touch sensing (36 channels), RTC, and IEC60730-compliant safety functions - deployed in industrial HMI and consumer appliance control systems.

For engineers reviewing the R5F51306ADFP#30 datasheet, R5F51306ADFP#30 pinout, R5F51306ADFP#30 application, or R5F51306ADFP#30 equivalent, key selection criteria include its 100-pin LFQFP package, 1.8–5.5 V single-supply operation, software standby current of 0.37 µA, 4.8 µs wake-up time, and integrated event link controller (ELC) for low-power peripheral coordination without CPU intervention.

Technical Context

The R5F51306ADFP#30 implements the 32-bit RXv1 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions, delivering 50 DMIPS at 32 MHz. It integrates a dedicated 15 kHz IWDT oscillator, clock accuracy measurement circuit (CAC), and independent LPT running during software standby using sub-clock or IWDTCLK.

Its peripheral set includes MTU2 (6-channel 16-bit timer with complementary PWM), SCIg (6 channels), SCIh (1 channel), RIIC (1 channel), RSPI (1 channel), REMC (2 channels), and CTSU supporting both self- and mutual-capacitance modes - all coordinated via ELC to enable autonomous module interaction while CPU sleeps.

Key Specifications

Pinout & Package

Package: PLQP0100KB-B - 100-pin Low-Profile Quad Flat Package, 14 × 14 mm, 0.5 mm pitch, exposed pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51306ADFP#30, R5F51306BDFP#30 offers identical performance with updated manufacturing revision, while R5F51305ADFP#30 trades flash/SRAM capacity for lower unit cost - both retain full pin compatibility and peripheral feature parity.

Availability

R5F51306ADFP#30 is available at Aetrix Electronics and suitable for industrial HMI, home appliance control, smart thermostat nodes, and medical interface applications requiring stable component supply, long lifecycle assurance, and IEC60730-compliant safety features.

Supply support for R5F51306ADFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX130 Group targets cost-sensitive, low-power embedded applications requiring high integration, safety certification support, and rich human-machine interface capabilities - especially in white goods and industrial edge devices.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51306ADFP#30?

The R5F51306ADFP#30 operates at a maximum frequency of 32 MHz and delivers 50 DMIPS performance using the 32-bit RXv1 CPU core. Its 5-stage pipeline, variable-length instruction set, and on-chip multiplier/divider enable deterministic real-time execution. The R5F51306ADFP#30 achieves this performance across its full 1.8–5.5 V supply range, with no wait states on flash or SRAM access.

Does the R5F51306ADFP#30 support IEC60730 Class B compliance?

Yes, the R5F51306ADFP#30 includes hardware-assisted IEC60730 Class B compliance features: A/D converter self-diagnostic, clock frequency accuracy measurement (CAC), independent watchdog timer (IWDT) with dedicated oscillator, RAM test assistance via DOC, and analog input disconnection detection. These features are documented in the R01DS0273EJ0300 datasheet and enable certified safety firmware implementation without external components. The R5F51306ADFP#30 is designed specifically for such safety-critical applications.

What package type and pin count does the R5F51306ADFP#30 use?

The R5F51306ADFP#30 uses the PLQP0100KB-B package: a 100-pin Low-Profile Quad Flat Package measuring 14 × 14 mm with 0.5 mm pitch and an exposed thermal pad. This package is RoHS compliant and supports reflow soldering. Pin assignments are fully detailed in Figure 1.3 and Table 1.5 of the R01DS0273EJ0300 datasheet. The R5F51306ADFP#30 shares this footprint with other RX130 Group 100-pin variants, ensuring layout reuse across memory configurations.

How many capacitive touch channels does the R5F51306ADFP#30 support?

The R5F51306ADFP#30 integrates a Capacitive Touch Sensing Unit (CTSU) supporting up to 36 dedicated touch pins (TS0–TS35). It operates in self-capacitance mode for up to 36 independent keys or mutual-capacitance mode in matrix configuration for up to 324 keys. The CTSU includes hardware acceleration, noise cancellation, and automatic drift compensation - all confirmed in Section 1.4 and Table 1.2 of the R01DS0273EJ0300 datasheet. The R5F51306ADFP#30 leverages this for robust, low-power HMI in appliances and industrial panels.

What are the low-power consumption characteristics of the R5F51306ADFP#30?

The R5F51306ADFP#30 offers three low-power modes: sleep, deep sleep, and software standby. In software standby mode, it draws just 0.37 µA while retaining SRAM content and enabling wake-up via LPT, RTC, or external interrupt. Recovery time from this state is 4.8 µs. High-speed operating mode consumes 96 µA/MHz. These values are measured per the conditions in Section 1.1 of R01DS0273EJ0300 and make the R5F51306ADFP#30 suitable for battery-powered remote interfaces and energy-conscious designs.