Renesas R5F51306BDFM#30

Overview

R5F51306BDFM#30 from Renesas is a 32-bit RX CPU-based microcontroller with 256 KB on-chip flash, 32 KB SRAM, and 8 KB data flash, operating at up to 32 MHz (50 DMIPS), supporting IEC60730-compliant industrial control in 10–105°C ambient. It integrates a 12-bit A/D converter (17 channels, 1.4 µs conversion), dual 8-bit D/A outputs, capacitive touch sensing (32 keys), RTC, and low-power software standby mode (0.37 µA).

For engineers reviewing the R5F51306BDFM#30 datasheet, R5F51306BDFM#30 pinout, R5F51306BDFM#30 application, or R5F51306BDFM#30 equivalent, key selection criteria include its 64-pin LFQFP (PLQP0064KB-C) package, 32 MHz max frequency under 2.7–5.5 V supply, 17-channel ADC with disconnection detection, and ELC-triggered peripheral operation without CPU wake-up.

Technical Context

The R5F51306BDFM#30 implements the RXv1 core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and single-cycle 32×32 multiply. Its clock system includes HOCO (32 MHz ±1%), sub-clock (32.768 kHz), PLL, and dedicated IWDT oscillator (15 kHz), with independent ICLK/PCLK/FCLK domains for CPU, peripherals, and FlashIF.

Peripheral integration centers on event-driven autonomy: the Event Link Controller (ELC) enables 47 event sources-including MTU, RTC, and REMC-to trigger module actions (e.g., ADC start, PWM update) while the CPU remains in deep sleep. The Data Transfer Controller (DTC) supports chain transfer across four modes, activated by interrupts without CPU intervention.

Key Specifications

Pinout & Package

R5F51306BDFM#30 is housed in a 64-pin LFQFP package (PLQP0064KB-C), 10 × 10 mm, 0.5 mm pitch, with exposed pad for thermal management. Pin functions are validated per Renesas R01DS0273EJ0300 Rev.3.00, Table 1.4 and Figure 1.5 (64-pin assignment).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51306BDFM#30, R5F51306ADFM#30 offers identical performance but lacks long-term supply assurance, while R5F51305BDFM#30 trades flash/SRAM capacity for lower unit cost-making it viable where firmware size and runtime data storage are constrained.

Availability

R5F51306BDFM#30 is available at Aetrix Electronics and suitable for industrial control panels, home appliance mainboards, and medical diagnostic devices requiring stable component supply, extended temperature operation, and IEC60730 compliance support.

Supply support for R5F51306BDFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX130 Group targets cost-sensitive, safety-aware industrial and consumer applications-delivering high-efficiency 32-bit processing, integrated analog peripherals, and hardware-assisted functional safety features.

FAQ

What is the maximum operating frequency of the R5F51306BDFM#30 and what supply voltage is required?

The R5F51306BDFM#30 achieves a maximum operating frequency of 32 MHz, which requires a supply voltage of 2.7 V to 5.5 V. At 2.4–2.7 V, the max frequency is 16 MHz; at 1.8–2.4 V, it is limited to 8 MHz. This voltage-frequency scaling ensures reliable operation across wide input ranges while maintaining 50 DMIPS performance at full speed. The R5F51306BDFM#30 uses an internal high-speed on-chip oscillator (HOCO) calibrated to ±1% at 32 MHz.

Does the R5F51306BDFM#30 support capacitive touch sensing, and how many keys can it handle in the 64-pin package?

Yes, the R5F51306BDFM#30 integrates a Capacitive Touch Sensing Unit (CTSU) supporting up to 32 keys in self-capacitance mode for the 64-pin LFQFP package (PLQP0064KB-C). This is confirmed in Table 1.2 of the datasheet, which specifies "32 channels" for CTSU in 64-pin variants. The R5F51306BDFM#30 requires external decoupling on TSCAP (10 nF to VSS) and supports automatic calibration and noise immunity features essential for robust front-panel interfaces.

What low-power modes does the R5F51306BDFM#30 offer, and what is the current consumption in software standby mode?

The R5F51306BDFM#30 provides three low-power modes: sleep, deep sleep, and software standby. In software standby mode, supply current is 0.37 µA (typical) with the low-power timer (LPT) active-enabling periodic wake-up without CPU involvement. Recovery time from this state is 4.8 µs. The R5F51306BDFM#30 also supports module stop control and operating power modes (high/middle/low speed) to further optimize energy use across varying workload demands.

How many A/D converter channels does the R5F51306BDFM#30 have, and what is the minimum conversion time?

The R5F51306BDFM#30 features a 12-bit A/D converter with 17 input channels in the 64-pin package, as specified in Table 1.2. Minimum conversion time is 1.4 µs per channel when the ADCLK runs at 32 MHz. Each channel supports individually configurable sampling time, and the converter includes disconnection detection, self-diagnostic, and double-trigger (data duplication) functions-critical for motor control and safety applications. The R5F51306BDFM#30 routes these inputs to dedicated ANxx pins with dedicated reference voltage pins (VREFH0/VREFL0).

Is the R5F51306BDFM#30 pin-compatible with other members of the RX130 Group, such as the R5F51305BDFM#30?

Yes, the R5F51306BDFM#30 is pin-compatible with the R5F51305BDFM#30 and other 64-pin RX130 variants (e.g., R5F51307BDFM#30) in the PLQP0064KB-C package. All share identical pin assignments, electrical characteristics, and peripheral mapping-enabling scalable design reuse. The R5F51306BDFM#30 differs only in flash (256 KB vs. 128 KB) and SRAM (32 KB vs. 16 KB) capacity; no PCB changes are needed when migrating between these parts for firmware optimization or feature expansion.