Renesas R5F51306BGFL#30
- Part No.:
- R5F51306BGFL#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
R5F51306BGFL#30.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R5F51306BGFL#30 from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 256 KB on-chip flash, 32 KB SRAM, 8 KB data flash, 12-bit A/D converter (17 channels), two 8-bit D/A outputs, capacitive touch sensing (24 keys), and IEC60730-compliant safety functions for industrial control panels.
For engineers reviewing the R5F51306BGFL#30 datasheet, R5F51306BGFL#30 pinout, R5F51306BGFL#30 application, or R5F51306BGFL#30 equivalent, key selection criteria include its 48-pin LFQFP (PLQP0048KB-B) package, –40°C to +105°C extended temperature rating, integrated RTC with calendar mode, low-power software standby mode (0.37 µA), and ELC-driven event-linked peripheral operation without CPU wake-up.
Technical Context
The R5F51306BGFL#30 implements the RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and single-cycle 32×32-bit multiplication. Its clock system integrates HOCO (32 MHz ±1%), sub-clock (32.768 kHz), PLL, and dedicated IWDT oscillator (15 kHz), with independent ICLK/PCLK/FCLK domains.
Peripheral coordination is managed via Event Link Controller (ELC), supporting 47 event sources and enabling linked module operation (e.g., MTU-triggered ADC conversion) during CPU sleep. The MCU supports IEC60730 Class B compliance through hardware-assisted RAM test (DOC), A/D self-diagnostic, LVD voltage monitoring (14-level detection), and clock accuracy measurement (CAC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv1 32-bit CISC Harvard, 5-stage pipeline, 50 DMIPS @ 32 MHz |
| Max Operating Frequency | 32 MHz with no wait states on flash/SRAM access |
| Memory | 256 KB flash (code/data), 32 KB SRAM, 8 KB data flash (1M erase cycles) |
| A/D Converter | 12-bit resolution, 17 input channels, 1.4 µs min conversion time |
| D/A Converter | Two 8-bit channels, output range 0 V to AVCC0 |
| Operating Temperature | –40°C to +105°C (G-grade industrial/automotive-adjacent use) |
| Supply Voltage | 1.8 V to 5.5 V single supply, 96 µA/MHz active current |
Pinout & Package
Package: PLQP0048KB-B - 48-pin Low-Profile Quad Flat Package, 7 mm × 7 mm, 0.5 mm pitch, exposed pad (thermal enhancement), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power / Ground | Dual power domains: digital (VCC/VSS) and analog (AVCC0/AVSS0/VREFH0/VREFL0) require separate decoupling |
| XTAL / EXTAL | Main Clock Input | Supports external crystal (1–20 MHz) or clock source; enables precise timing for RTC and communication peripherals |
| XCIN / XCOUT | Sub-Clock Oscillator | 32.768 kHz crystal interface for RTC calendar mode and low-power timer (LPT) operation in standby |
| MTIOC0A–MTIOC3D | PWM/Compare Output | Sixteen pins across four MTU channels support complementary PWM, phase counting, and motor control triggers |
| AN000–AN016 | A/D Input | 17 dedicated analog inputs with per-channel sampling time control and disconnection detection |
| DA0 / DA1 | Analog Output | Two buffered 8-bit DAC outputs usable for sensor biasing, calibration references, or analog waveform generation |
| TS0–TS23 | Capacitive Touch | 24 dedicated CTSU pins support mutual-capacitance matrix (up to 24×24 keys) or self-capacitance key scanning |
| SCI0–SCI9 / SCI12 | Serial Interface | Seven SCI channels (asynchronous/clock-sync/I²C/SPI modes); SCI12 adds LIN protocol support |
| RSPIA | SPI Master/Slave | One high-speed SPI interface (up to 16 Mbps) with 128-bit TX/RX buffers and frame chaining capability |
| RES# | Reset Input | Active-low asynchronous reset with internal pull-up; initiates full system initialization including memory and peripheral registers |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables 47 event sources to trigger peripheral actions (e.g., MTU start → ADC conversion) without CPU interrupt latency or wake-up overhead |
| Software Standby Mode | 0.37 µA supply current with LPT running on sub-clock; 4.8 µs wake-up time preserves real-time responsiveness in battery-powered systems |
| IEC60730 Safety Support | Hardware-accelerated RAM test (DOC), A/D self-diagnostic, LVD level monitoring (14 selectable thresholds), and CAC for clock drift validation |
| Capacitive Touch Unit (CTSU) | 24-key mutual-capacitance support with noise immunity tuning, automatic drift compensation, and low-power scan modes |
| Background Operation (BGO) | Data flash programming/erasing proceeds concurrently with CPU execution-no code stalls during firmware updates or parameter storage |
Applications
| Home Appliance Control Panel | Industrial Sensor Node |
|---|---|
Use Scenario: Touch-enabled oven/microwave UI with temperature monitoring, timer, and safety interlocks. IC Role / Device Role / Timing Role: Main system controller executing UI logic, reading capacitive touch keys (TS0–TS23), sampling thermistor via 12-bit A/D, driving display backlight via DA0, and managing RTC-based cooking schedules. Use Value: Integrated CTSU eliminates external touch controller; IEC60730 features satisfy appliance safety certification; 0.37 µA standby extends battery life in wireless remote variants. | Use Scenario: DIN-rail mounted environmental monitor logging temperature, humidity, and vibration in factory settings. IC Role / Device Role / Timing Role: Data acquisition hub interfacing with analog sensors (A/D), digital I²C sensors (RIICa), and RS485 transceiver (SCI9); stores logs in data flash with timestamp from RTC. Use Value: Dual 8-bit DACs calibrate sensor offsets; ELC synchronizes sensor reads with PWM-driven signal conditioning; –40°C to +105°C rating ensures reliability in uncontrolled enclosures. |
| Smart Thermostat Interface | Motorized HVAC Actuator |
Use Scenario: Wall-mounted thermostat with OLED display, ambient temperature/humidity sensing, and Wi-Fi module control. IC Role / Device Role / Timing Role: Host processor managing capacitive buttons (CTSU), reading onboard temperature sensor (TEMPSA), communicating with Wi-Fi SoC via SCI6, and generating PWM fan speed signals via MTU. Use Value: Ultra-low 0.37 µA software standby enables multi-year coin-cell operation; RTC calendar mode maintains accurate scheduling across power cycles. | Use Scenario: Position-controlled damper actuator using brushed DC motor with current sensing and thermal protection. IC Role / Device Role / Timing Role: Motor controller generating complementary PWM (MTU0–MTU3), reading current sense resistor via A/D channel AN000, detecting overtemperature with internal TEMPSA, and signaling faults via SCI1. Use Value: Double-trigger A/D mode captures synchronized current/voltage samples for torque estimation; POE2# pins enable safe high-impedance shutdown during fault conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F51306ADFL#30 | Same RX130 core, 256 KB flash, 32 KB RAM, but rated for –40°C to +85°C (D-grade) | Lacks extended temperature support; unsuitable for under-hood or high-ambient industrial deployments | Select R5F51306ADFL#30 only for cost-sensitive commercial applications within standard temperature range. |
| R5F51305BGFL#30 | Lower memory configuration: 128 KB flash, 16 KB RAM, same 48-pin LFQFP and G-grade temp range | Reduced code space limits complex UI stacks or dual-firmware OTA schemes | Choose R5F51305BGFL#30 when application firmware fits within 128 KB and no additional peripherals beyond baseline are required. |
Compared with R5F51306ADFL#30, the R5F51306BGFL#30 provides guaranteed operation up to +105°C-critical for sealed enclosures or proximity to heat sources-while R5F51305BGFL#30 trades memory capacity for lower unit cost without sacrificing temperature robustness or peripheral count.
Availability
R5F51306BGFL#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart building sensor nodes, HVAC actuators, and appliance control systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F51306BGFL#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX130 Group targets cost-sensitive, safety-aware embedded applications-delivering IEC60730 compliance, capacitive touch integration, and low-power operation in compact packages for appliances, industrial controls, and building automation.
FAQ
What is the maximum operating frequency and core performance of the R5F51306BGFL#30?
The R5F51306BGFL#30 operates at a maximum frequency of 32 MHz using the RXv1 32-bit CPU core, delivering 50 DMIPS of processing performance. Its architecture supports single-cycle 32×32-bit multiplication, 64-bit accumulator results, and variable-length instructions for code density optimization-all verified in the R01DS0273EJ0300 datasheet. This performance level enables responsive UI handling and real-time sensor processing in the R5F51306BGFL#30.
Does the R5F51306BGFL#30 support capacitive touch sensing, and how many keys can it handle?
Yes, the R5F51306BGFL#30 integrates a Capacitive Touch Sensing Unit (CTSU) supporting up to 24 keys in mutual-capacitance mode using TS0–TS23 pins. It includes hardware acceleration for noise rejection, automatic drift compensation, and low-power scan modes-fully documented in Section 22 of the R01DS0273EJ0300 datasheet. This capability eliminates external touch controllers in designs using the R5F51306BGFL#30.
What are the power consumption characteristics of the R5F51306BGFL#30 in low-power modes?
The R5F51306BGFL#30 achieves 0.37 µA supply current in software standby mode while maintaining LPT operation on the sub-clock oscillator, with 4.8 µs wake-up time. Active-mode current is 96 µA/MHz at 32 MHz. These values are measured per the conditions in Section 27.3 of R01DS0273EJ0300 and confirm suitability for battery-powered applications using the R5F51306BGFL#30.
Which communication interfaces are available on the R5F51306BGFL#30, and what are their key capabilities?
The R5F51306BGFL#30 provides seven SCI channels (including LIN-capable SCI12), one I²C bus interface (RIICa, up to 400 kbps), and one high-speed RSPI (up to 16 Mbps with 128-bit buffers). All support event-link triggering via ELC. These interfaces are detailed in Sections 18–20 of R01DS0273EJ0300 and enable flexible connectivity for displays, sensors, and wireless modules in R5F51306BGFL#30-based systems.
How does the R5F51306BGFL#30 support IEC60730 functional safety compliance?
The R5F51306BGFL#30 includes hardware-assisted IEC60730 Class B features: DOC-based RAM test, A/D self-diagnostic and analog input disconnection detection, LVD with 14-level voltage monitoring, and CAC for clock accuracy validation. These are implemented without software overhead and are specified in Section 25 of R01DS0273EJ0300-enabling certified safety firmware development for the R5F51306BGFL#30.
R5F51306BGFL#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-LQFP
- Series:
- RX130
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F51306BGFL#30 FAQ
1.How can I place an order for R5F51306BGFL#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F51306BGFL#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F51306BGFL#30 reliable?
The price and inventory of R5F51306BGFL#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F51306BGFL#30 is usually 5 days.
3.What payment methods are accepted for R5F51306BGFL#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F51306BGFL#30 transactions.
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4.How is shipping managed for R5F51306BGFL#30?
R5F51306BGFL#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F51306BGFL#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F51306BGFL#30?
For technical support, including R5F51306BGFL#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F51306BGFL#30 requirements.
6.How does Aetrix verify that R5F51306BGFL#30 is sourced from the original manufacturer or authorized distributors?
All R5F51306BGFL#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F51306BGFL#30 meets industry standards.
7.What is the process for return or replacement of R5F51306BGFL#30?
All R5F51306BGFL#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F51306BGFL#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F51306BGFL#30 part is unused and in its original packaging.
Return procedure for R5F51306BGFL#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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