Renesas R5F51307ADFN#30
- Part No.:
- R5F51307ADFN#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
R5F51307ADFN#30.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 80LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:349
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Product details
Overview
R5F51307ADFN#30 from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 384 KB on-chip flash, 48 KB SRAM, 8 KB data flash, 12-bit A/D converter (17 channels), two 8-bit D/A outputs, capacitive touch sensing (36 channels), and IEC60730-compliant safety functions - deployed in industrial HMI and consumer appliance control systems.
For engineers reviewing the R5F51307ADFN#30 datasheet, R5F51307ADFN#30 pinout, R5F51307ADFN#30 application, or R5F51307ADFN#30 equivalent, key selection criteria include its 80-pin LFQFP package, 1.8–5.5 V single-supply operation, software standby current of 0.37 µA, 4.8 µs wake-up time, and integrated ELC/DTC for low-power event-driven execution without CPU intervention.
Technical Context
The R5F51307ADFN#30 implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and 64-bit accumulator for single-cycle 32×32 multiply-accumulate operations. Its clock system integrates high-speed (32 MHz ±1%) and low-speed (15 kHz) on-chip oscillators, PLL, sub-clock (32.768 kHz), and CAC for real-time frequency accuracy monitoring.
Peripheral coordination is managed via Event Link Controller (ELC), enabling direct module-to-module triggering (e.g., MTU → A/D start) while CPU remains in deep sleep; Data Transfer Controller (DTC) supports chain transfer across four modes with interrupt-source activation and background operation during flash programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RX 32-bit CISC core with 5-stage pipeline, 50 DMIPS @ 32 MHz |
| Flash Memory | 384 KB code flash, zero-wait-state access at full 32 MHz CPU speed |
| SRAM | 48 KB on-chip SRAM, no wait states, supports real-time data buffering |
| A/D Converter | 12-bit SAR ADC, 17 input channels, 1.4 µs conversion time, per-channel sampling time control |
| D/A Converter | Two independent 8-bit voltage-output DACs (0 V to AVCC0) |
| Low-Power Modes | Software standby mode draws 0.37 µA; wake-up latency 4.8 µs to full operation |
| Operating Voltage | 1.8 V to 5.5 V single supply; supports 32 MHz max frequency across full range |
| Capacitive Touch | CTSU supports 36 self-capacitance keys or 324 mutual-capacitance keys in matrix |
Pinout & Package
Package: PLQP0080KB-B - 80-pin Low-Profile Quad Flat Package, 12 × 12 mm body, 0.5 mm pitch, exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply and ground | Dual power domains: digital VCC/VSS and analog AVCC0/AVSS0 enable noise-isolated mixed-signal operation |
| XTAL / EXTAL | Main crystal oscillator interface | Supports external 1–20 MHz crystal or clock source; enables precise timing for RTC and communication baud rates |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode and low-power timer (LPT) operation |
| MTIOC0A–MTIOC4D | MTU2 waveform I/O | 16-bit timer PWM/complementary output pins; support phase counting, input capture, and A/D trigger generation |
| AN000–AN031 | Analog input channels | 17 dedicated A/D inputs (subset of 24-channel capability); configurable sampling time per channel for sensor signal conditioning |
| DA0 / DA1 | Digital-to-analog outputs | 8-bit voltage-mode DACs referenced to AVCC0; used for analog feedback, biasing, or simple waveform generation |
| TS0–TS35 | Capacitive touch sense pins | 36 dedicated CTSU I/Os supporting self- or mutual-capacitance measurement; enable robust touch HMI without external components |
| SCI0–SCI9 / SCI12 | Serial communication interfaces | Up to 7 SCI channels (6 SCIg + 1 SCIh) supporting UART, SPI, I²C, LIN, and smart card protocols |
| RES# | Active-low reset input | Asynchronous hardware reset with internal pull-up; compatible with standard push-button or supervisor IC reset signals |
| MD | Mode select | Fixed boot-mode configuration pin; must remain stable during operation to prevent unintended mode transitions |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables 47 types of inter-module event triggers (e.g., timer overflow → A/D start), eliminating CPU polling and reducing active time in low-power applications |
| Background Operation (BGO) | Data flash supports 1,000,000 program/erase cycles with concurrent read/write; allows firmware updates without halting real-time control tasks |
| IEC60730 Safety Support | Integrated self-test features for A/D, IWDT, CAC, RAM, and analog disconnection detection - reduces external diagnostic component count for Class B compliance |
| Dual Clock Domains | Independent ICLK (CPU/system), PCLKB (peripherals), and FCLK (flash) allow dynamic clock gating and optimized power/performance trade-offs per subsystem |
| Capacitive Touch Unit (CTSU) | Hardware-accelerated touch sensing with built-in noise rejection; supports proximity, slider, and multi-touch gestures with <10 µA average current in scan mode |
| Low-Power Timer (LPT) | 16-bit timer running from sub-clock or IWDT oscillator during software standby; enables periodic wake-up every 32 ms to 2.1 s without main oscillator startup overhead |
Applications
| Home Appliance Control Panel | Industrial Sensor Node |
|---|---|
Use Scenario: Touch-enabled front panel for washing machine or oven with temperature, cycle, and timer settings. IC Role / Device Role / Timing Role: Main controller executing UI logic, driving capacitive touch overlay, managing motor control via PWM, and logging events to data flash. Use Value: Integrated CTSU eliminates external touch controller; 0.37 µA standby current extends battery life in cordless portable variants; BGO enables silent firmware updates during idle cycles. | Use Scenario: Wireless environmental sensor node measuring temperature, humidity, and air quality in factory settings. IC Role / Device Role / Timing Role: Sensor aggregator with A/D acquisition, CRC-protected data packaging, and SCI/RSPI communication to gateway. Use Value: LPT-triggered periodic wake-up minimizes energy use; ELC-linked A/D + DTC transfers reduce CPU load; IEC60730 diagnostics ensure reliability in unattended deployments. |
| Smart Thermostat Interface | Medical Patient Monitor Frontend |
Use Scenario: Wall-mounted HVAC controller with ambient temperature sensing, display backlight control, and Wi-Fi module interface. IC Role / Device Role / Timing Role: Real-time coordinator between analog sensors (temp, humidity), touch UI, RTC calendar, and serial host interface. Use Value: Dual DACs generate precise reference voltages for sensor signal conditioning; RTC with leap-year adjustment ensures accurate scheduling; 1.8–5.5 V operation accommodates varied power sources including coin cells with boost converters. | Use Scenario: Portable patient monitor capturing ECG, SpO₂, and temperature with graphical LCD and alarm outputs. IC Role / Device Role / Timing Role: Mixed-signal hub performing analog front-end digitization, real-time waveform analysis, and alarm-triggered D/A output for audible alerts. Use Value: 12-bit A/D with double-trigger mode captures synchronized dual-channel biomedical signals; comparator B provides hardware-level over-limit detection for immediate response; -40°C to +85°C rating ensures clinical environment stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F51307AGFN#30 | Same core, memory, and peripherals; rated for –40°C to +105°C industrial temp range vs. D-version's +85°C | Required for extended-temperature environments (e.g., under-hood automotive, outdoor enclosures) | Select when ambient operating temperature exceeds 85°C; otherwise identical functionality and pinout |
| R5F51306BDFN#30 | 256 KB flash / 32 KB RAM / same 80-pin package; lacks RTC and REMC modules present in R5F51307ADFN#30 | Suitable for cost-sensitive control tasks without calendar/timekeeping or IR remote reception needs | Choose for simplified designs omitting RTC and remote control; retains all other peripherals including CTSU and ELC |
Compared with R5F51307AGFN#30, the R5F51307ADFN#30 offers identical feature set at lower temperature grade; versus R5F51306BDFN#30, it adds RTC and REMC while increasing flash/SRAM - making it optimal for full-featured HMI and time-aware embedded systems.
Availability
R5F51307ADFN#30 is available at Aetrix Electronics and suitable for industrial HMI, home appliance control, and medical device frontend applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for R5F51307ADFN#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.
The RX130 Group targets cost-sensitive, low-power embedded applications demanding rich analog integration, capacitive touch, functional safety, and seamless connectivity - designed specifically for appliance HMI, sensor nodes, and portable medical devices.
FAQ
What is the maximum operating frequency and associated performance of the R5F51307ADFN#30?
The R5F51307ADFN#30 operates at a maximum frequency of 32 MHz, delivering 50 DMIPS of processing performance. Its 32-bit RX CPU core features a 5-stage pipeline, variable-length instruction set, and 64-bit accumulator for efficient DSP-like operations. This performance level supports real-time control loops, capacitive touch scanning, and multi-protocol communication stacks without external acceleration.
Does the R5F51307ADFN#30 support capacitive touch sensing, and how many keys can it handle?
Yes, the R5F51307ADFN#30 integrates a dedicated Capacitive Touch Sensing Unit (CTSU) supporting up to 36 self-capacitance keys or 324 mutual-capacitance keys in matrix configuration. It includes hardware noise cancellation and automatic calibration, enabling robust touch interfaces in appliances and medical devices without external touch controllers - all managed by the R5F51307ADFN#30's on-chip firmware.
What low-power capabilities does the R5F51307ADFN#30 offer for battery-operated applications?
The R5F51307ADFN#30 delivers ultra-low-power operation with 0.37 µA current draw in software standby mode and 4.8 µs wake-up time to full 32 MHz operation. Its Low Power Timer (LPT) runs independently from the sub-clock or IWDT oscillator, enabling periodic wake-up intervals from 32 ms to over 2 seconds. These features make the R5F51307ADFN#30 ideal for energy-constrained designs such as portable medical monitors and wireless sensor nodes.
How does the R5F51307ADFN#30 support functional safety compliance for IEC60730?
The R5F51307ADFN#30 includes hardware-assisted self-test functions for the A/D converter, independent watchdog timer (IWDT), clock frequency accuracy measurement circuit (CAC), RAM, and analog input disconnection detection. These features reduce software validation burden and external component count, enabling Class B compliance for household appliances - a core design objective validated in the R5F51307ADFN#30's safety documentation.
What communication interfaces are integrated into the R5F51307ADFN#30?
The R5F51307ADFN#30 integrates six SCI channels (SCIg), one enhanced SCI (SCIh), one I²C bus interface (RIIC), one Serial Peripheral Interface (RSPI), and two Remote Control Signal Receivers (REMC). These support UART, LIN, SPI, I²C, SMBus, smart card, and IR remote protocols - enabling flexible connectivity to displays, sensors, gateways, and legacy control systems within a single R5F51307ADFN#30-based design.
R5F51307ADFN#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 80-LQFP
- Series:
- RX130
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 68
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 17x12b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F51307ADFN#30 FAQ
1.How can I place an order for R5F51307ADFN#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F51307ADFN#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F51307ADFN#30 reliable?
The price and inventory of R5F51307ADFN#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F51307ADFN#30 is usually 5 days.
3.What payment methods are accepted for R5F51307ADFN#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F51307ADFN#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F51307ADFN#30?
R5F51307ADFN#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F51307ADFN#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F51307ADFN#30?
For technical support, including R5F51307ADFN#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F51307ADFN#30 requirements.
6.How does Aetrix verify that R5F51307ADFN#30 is sourced from the original manufacturer or authorized distributors?
All R5F51307ADFN#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F51307ADFN#30 meets industry standards.
7.What is the process for return or replacement of R5F51307ADFN#30?
All R5F51307ADFN#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F51307ADFN#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F51307ADFN#30 part is unused and in its original packaging.
Return procedure for R5F51307ADFN#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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