Renesas R5F51307AGFM#30

Overview

R5F51307AGFM#30 from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 384 KB on-chip flash, 48 KB SRAM, 8 KB data flash, 12-bit A/D converter (17 channels), dual 8-bit D/A outputs, capacitive touch sensing (32 keys), RTC, and IEC60730 compliance - deployed in industrial HMI and consumer appliance control systems.

For engineers reviewing the R5F51307AGFM#30 datasheet, R5F51307AGFM#30 pinout, R5F51307AGFM#30 application, or R5F51307AGFM#30 equivalent, key selection criteria include its 64-pin LFQFP (PLQP0064KB-C) package, –40°C to +105°C extended temperature rating, 1.8–5.5 V single-supply operation, and integrated low-power timer with 4.8 µs wake-up from software standby mode.

Technical Context

The R5F51307AGFM#30 implements the RXv1 core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates an Event Link Controller (ELC) for interrupt-free peripheral coordination and a Data Transfer Controller (DTC) supporting normal, repeat, and block transfer modes triggered by 47 event sources.

Its clock system includes high-speed (32 MHz ±1%) and low-speed (15 kHz) on-chip oscillators, PLL, sub-clock (32.768 kHz), and Clock Accuracy Measurement (CAC) circuit. Power management features three low-power modes, including software standby consuming just 0.37 µA with LPT active.

Key Specifications

Pinout & Package

Package: PLQP0064KB-C - 64-pin Low-Profile Quad Flat Package, 10 × 10 mm body, 0.5 mm pitch, exposed pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51307AGFM#30, the R5F51307ADFM#30 reduces thermal margin but lowers cost, while R5F51308AGFM#30 adds 128 KB flash without changing footprint or power profile - enabling scalable firmware development across temperature grades and memory tiers.

Availability

R5F51307AGFM#30 is available at Aetrix Electronics and suitable for industrial HMI, home appliance control, and medical device frontend applications requiring stable component supply, extended temperature operation, and long-term lifecycle support.

Supply support for R5F51307AGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RX130 Group targets cost-sensitive, safety-aware applications in appliances and industrial controls, emphasizing IEC60730 compliance, capacitive touch integration, and ultra-low-power operation across extended temperature ranges.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51307AGFM#30?

The R5F51307AGFM#30 operates at a maximum frequency of 32 MHz and delivers 50 DMIPS of processing performance using the 32-bit RXv1 CPU core. Its 5-stage pipeline, variable-length instruction set, and 64-bit accumulator enable efficient execution of control algorithms and real-time tasks. The R5F51307AGFM#30 achieves this performance while maintaining low power consumption - 96 µA per MHz in high-speed mode - making it suitable for responsive yet energy-conscious designs.

Does the R5F51307AGFM#30 support IEC60730 Class B functional safety requirements?

Yes, the R5F51307AGFM#30 includes dedicated hardware features for IEC60730 Class B compliance, including self-diagnostic functions for the A/D converter, clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance via the data operation circuit (DOC). It also provides analog input disconnection detection and double-trigger A/D functionality for motor control redundancy. These capabilities are documented in the R5F51307AGFM#30 datasheet and supported by Renesas' safety application notes.

What package type and pin count does the R5F51307AGFM#30 use?

The R5F51307AGFM#30 uses the PLQP0064KB-C package: a 64-pin Low-Profile Quad Flat Package measuring 10 × 10 mm with 0.5 mm pitch and an exposed thermal pad. This package is RoHS-compliant and optimized for reflow soldering. Pin assignments match other RX130 Group members in the same 64-pin LFQFP variant, ensuring layout compatibility across memory-graded variants like R5F51306BGFM#30 and R5F51308AGFM#30.

How much flash, SRAM, and data flash memory does the R5F51307AGFM#30 include?

The R5F51307AGFM#30 integrates 384 KB of on-chip flash memory (with zero wait states at 32 MHz), 48 KB of SRAM, and 8 KB of data flash memory rated for 1,000,000 program/erase cycles. The flash supports in-system programming at 1.8 V and stores both instructions and operands. The data flash is managed via background operation (BGO), allowing concurrent execution and data logging without CPU interruption - a key capability in the R5F51307AGFM#30 for firmware updates and parameter storage.

What are the key low-power features of the R5F51307AGFM#30?

The R5F51307AGFM#30 offers three low-power modes: sleep, deep sleep, and software standby. In software standby mode, it consumes only 0.37 µA while keeping the low-power timer (LPT) running and enabling wake-up in 4.8 µs. Its supply voltage range (1.8–5.5 V) and dynamic operating mode control (high/middle/low-speed) allow fine-grained power optimization. These features make the R5F51307AGFM#30 well-suited for battery-backed or energy-harvesting applications where duty-cycled operation is essential.