Renesas R5F51308AGFL#30

Overview

R5F51308AGFL#30 from Renesas is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 512 KB on-chip flash, 48 KB SRAM, 8 KB data flash, 12-bit A/D converter (17 channels), dual 8-bit D/A outputs, capacitive touch sensing (24 keys), and IEC60730 compliance for safety-critical industrial control applications.

For engineers reviewing the R5F51308AGFL#30 datasheet, R5F51308AGFL#30 pinout, R5F51308AGFL#30 application, or R5F51308AGFL#30 equivalent, this page delivers verified functional specifications, package-confirmed pin roles, real-world use cases, and validated alternative parts - all aligned with the RX130 Group's PLQP0048KB-B 48-pin LFQFP footprint and −40°C to +105°C extended temperature grade.

Technical Context

The R5F51308AGFL#30 implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and 64-bit accumulator for single-cycle 32×32 multiplication. Its clock system integrates high-speed (32 MHz ±1%) and sub-clock (32.768 kHz) oscillators, PLL, and CAC for frequency accuracy measurement.

Peripheral integration includes ELC for event-driven module coordination without CPU wake-up, DTC for interrupt-triggered transfers, MTU2 (6-channel 16-bit timer) with complementary PWM and phase counting, and REMC for IR signal decoding - all mapped to its 48-pin LFQFP package with 38 GPIOs, 17 A/D inputs, and 24 CTSU channels.

Key Specifications

Pinout & Package

Package: PLQP0048KB-B - 48-pin Low-Profile Quad Flat Package, 7 mm × 7 mm, 0.5 mm pitch, exposed pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51308ADFL#30, the R5F51308AGFL#30 adds extended temperature operation critical for under-hood or outdoor deployments; versus R5F51306BGFL#30, it provides double flash and 50% more RAM for complex control stacks and OTA update staging.

Availability

R5F51308AGFL#30 is available at Aetrix Electronics and suitable for industrial motor control, smart appliance HMI, factory automation sensor nodes, and automotive body electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F51308AGFL#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for industrial, automotive, and IoT markets.

The RX130 Group targets cost-sensitive, safety-aware embedded applications - delivering IEC60730-ready MCUs with integrated touch, analog, and low-power features in compact packages like the R5F51308AGFL#30.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51308AGFL#30?

The R5F51308AGFL#30 operates at a maximum frequency of 32 MHz and delivers 50 DMIPS of processing performance. Its 32-bit RX CPU core features a 5-stage pipeline, variable-length instructions, and a 64-bit accumulator for efficient arithmetic. This performance level supports real-time control loops in motor drives and fast sensor data processing in industrial nodes - all while maintaining deterministic interrupt response due to the fast-interrupt architecture.

Does the R5F51308AGFL#30 support IEC60730 Class B compliance out of the box?

Yes, the R5F51308AGFL#30 includes hardware-assisted self-test features required for IEC60730 Class B certification, including A/D converter diagnostics, clock frequency accuracy measurement (CAC), independent watchdog timer (IWDT) validation, RAM test assistance via DOC, and analog input disconnection detection. These capabilities reduce software validation burden and accelerate safety certification - confirmed in Renesas Application Note R01AN2817EU0100.

What package type and pin count does the R5F51308AGFL#30 use?

The R5F51308AGFL#30 uses the PLQP0048KB-B package: a 48-pin Low-Profile Quad Flat Package measuring 7 mm × 7 mm with 0.5 mm pitch and an exposed thermal pad. This footprint matches other RX130 48-pin variants (e.g., R5F51308ADFL#30, R5F51306BGFL#30), enabling drop-in replacement within the same temperature and memory grade constraints.

How many channels does the capacitive touch sensing unit (CTSU) support on the R5F51308AGFL#30?

The R5F51308AGFL#30 supports up to 24 capacitive touch sensing channels via its CTSU peripheral, as confirmed for the 48-pin LFQFP package in Table 1.2 of the R01DS0273EJ0300 datasheet. This enables robust self-capacitance keypads or mutual-capacitance matrix interfaces - with hardware noise cancellation and shield driver support - ideal for appliance control panels exposed to moisture or EMI.

What are the key low-power capabilities of the R5F51308AGFL#30?

The R5F51308AGFL#30 offers three low-power modes: sleep, deep sleep, and software standby. In software standby mode, it draws just 0.37 µA while retaining SRAM content and waking in 4.8 µs - enabled by the low-power timer (LPT) running off the 32.768 kHz sub-clock. Combined with the 96 µA/MHz active-mode efficiency and module-stop control, it meets multi-year battery life requirements in wireless sensor endpoints.