Renesas R5F51308AGFP#50

Overview

R5F51308AGFP#50 from Renesas Electronics is a 32-bit RX CPU-based microcontroller operating at up to 32 MHz (50 DMIPS), featuring 512 KB on-chip flash, 48 KB SRAM, 8 KB data flash, 12-bit A/D converter (17 channels), dual 8-bit D/A outputs, capacitive touch sensing (36 channels), RTC, and IEC60730-compliant safety functions - deployed in industrial HMI and consumer appliance control systems.

For engineers reviewing the R5F51308AGFP#50 datasheet, R5F51308AGFP#50 pinout, R5F51308AGFP#50 application, or R5F51308AGFP#50 equivalent, key selection criteria include extended temperature support (–40°C to +105°C), 100-pin LFQFP package with 5-V-tolerant I/O, low-power software standby mode (0.37 µA), and integrated event link controller (ELC) for interrupt-free peripheral coordination.

Technical Context

The R5F51308AGFP#50 implements a CISC Harvard-architecture RX CPU core with 5-stage pipeline, 32-bit × 32-bit multiplier/divider, and 64-bit accumulator - enabling deterministic real-time execution. It integrates an Event Link Controller (ELC) supporting 47 event sources and direct module triggering without CPU intervention.

Its clock system includes high-speed on-chip oscillator (32 MHz ±1%), sub-clock (32.768 kHz), PLL (4–8 MHz input), and dedicated IWDT oscillator (15 kHz), all managed via Clock Frequency Accuracy Measurement Circuit (CAC). Power management supports three low-power modes, including software standby with 4.8 µs wake-up and active LPT operation.

Key Specifications

Pinout & Package

Package: PLQP0100KB-B - 100-pin Low-Profile Quad Flat Package (LFQFP), 14 mm × 14 mm, 0.5 mm pitch, lead-free and RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F51308AGFP#50, the R5F51308ADFP#30 offers identical functionality at a lower temperature grade, while R5F51306BGFP#30 reduces memory capacity to lower cost - both retain the same 100-pin LFQFP package, ELC, CTSU, and IEC60730 features required for HMI and appliance control.

Availability

R5F51308AGFP#50 is available at Aetrix Electronics and suitable for industrial HMI panels, smart home appliances, medical monitoring devices, and energy management systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F51308AGFP#50 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX130 Group is designed for cost-sensitive, safety-aware embedded applications demanding rich analog integration, capacitive touch, low-power operation, and functional safety compliance - targeting industrial controls and intelligent consumer devices.

FAQ

What is the maximum operating frequency and CPU performance of the R5F51308AGFP#50?

The R5F51308AGFP#50 operates at a maximum frequency of 32 MHz and delivers 50 DMIPS of processing performance. Its RX CPU core features a 5-stage pipeline, 32-bit × 32-bit multiplication in one cycle, and a 64-bit accumulator - enabling deterministic real-time execution for motor control and sensor fusion tasks. The R5F51308AGFP#50 maintains zero-wait-state flash access at full speed, preserving throughput in interrupt-driven applications.

Does the R5F51308AGFP#50 support IEC60730 functional safety compliance?

Yes, the R5F51308AGFP#50 includes dedicated hardware features for IEC60730 Class B compliance, including self-diagnostic support for the A/D converter, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), RAM test assistance via the Data Operation Circuit (DOC), and analog input disconnection detection. These capabilities are documented in the R01DS0273EJ0300 datasheet and enable certified safety routines without external components. The R5F51308AGFP#50 leverages these to simplify certification in white-goods and medical auxiliary equipment.

What package type and pin count does the R5F51308AGFP#50 use?

The R5F51308AGFP#50 uses the PLQP0100KB-B package: a 100-pin Low-Profile Quad Flat Package (LFQFP) with 14 mm × 14 mm body size and 0.5 mm pin pitch. It is RoHS-compliant and pin-compatible with other RX130 Group 100-pin variants. This package provides 88 general-purpose I/O pins, including 5-V-tolerant and open-drain options, and supports full peripheral routing for HMI, communication, and motor control applications. The R5F51308AGFP#50's pinout is fully detailed in Table 1.4 and Figure 1.3 of its datasheet.

How does the Event Link Controller (ELC) enhance system efficiency in the R5F51308AGFP#50?

The Event Link Controller (ELC) in the R5F51308AGFP#50 allows 47 internal event sources - such as timer overflows, ADC completions, or GPIO transitions - to directly trigger peripheral operations (e.g., starting an A/D conversion or updating a PWM duty cycle) without CPU involvement or interrupt latency. This reduces software overhead, improves determinism in real-time loops, and enables ultra-low-power operation by keeping the CPU in sleep mode longer. The R5F51308AGFP#50's ELC is especially valuable in synchronized sensor acquisition and motor commutation where timing jitter must be minimized.

What are the key differences between the R5F51308AGFP#50 and R5F51308ADFP#30?

The R5F51308AGFP#50 and R5F51308ADFP#30 share identical CPU architecture, memory sizes (512 KB flash, 48 KB SRAM, 8 KB data flash), peripherals, and 100-pin LFQFP package. Their sole difference is operating temperature grade: the R5F51308AGFP#50 is rated for –40°C to +105°C (G-grade), while the R5F51308ADFP#30 is rated for –40°C to +85°C (D-grade). Both meet the same IEC60730 safety feature set. The R5F51308AGFP#50 is selected for extended-temperature industrial deployments where ambient heat exceeds +85°C.