Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas R5F51405BGNE#30

Part No.:
R5F51405BGNE#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-WFQFN Exposed Pad
Datasheet:
AetrixR5F51405BGNE#30.pdf
Description:
IC MCU 32BIT 128MB FLASH 48WFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:832

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

R5F51405BGNE#30 from Renesas is a 48 MHz, 32-bit RXv2 core MCU with on-chip FPU, 128 KB flash, 32 KB SRAM, and hardware AES/RNG encryption. It integrates CAN, 6-channel MTU2, 12-bit A/D (11 external channels), D/A (2×8-bit), CTSU2SL capacitive touch (24-key self-capacitance), RTC, and IEC60730 safety support - deployed in industrial HMI and sensor gateway control.

For engineers reviewing the R5F51405BGNE#30 datasheet, R5F51405BGNE#30 pinout, R5F51405BGNE#30 application, or R5F51405BGNE#30 equivalent, this page delivers verified package mapping (PWQN0048KC-A, 48-pin HWQFN, 7×7 mm, 0.5 mm pitch), confirmed low-power modes (0.25 µA standby), real-time clock operation, CAN 1 Mbps compliance, and encryption module availability - all validated against Renesas R01DS0379EJ0120 Rev.1.20.

Technical Context

The R5F51405BGNE#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and IEEE-754-compliant 32-bit FPU - enabling deterministic floating-point math at 48 MHz. Its memory subsystem includes no-wait SRAM, 128 KB flash with 1.8 V programming, and 8 KB data flash supporting background operation (BGO) for firmware updates without halting execution.

Peripherals are orchestrated via Event Link Controller (ELC), allowing timer-triggered ADC conversions and CAN message transmission without CPU intervention. The device supports dual-voltage detection (LVD0–LVD2), independent watchdog (IWDT) with dedicated 15 kHz oscillator, and low-power timer (LPT) active during software standby - critical for battery-powered edge nodes requiring sub-µA sleep current and 6.2 µs wake-up latency.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv2 32-bit CISC Harvard, 48 MHz max, 204 CoreMark score - enables real-time control with deterministic interrupt latency.
Memory 128 KB flash (1.8 V programmable), 32 KB SRAM (no wait states), 8 KB data flash (1M erase cycles, BGO enabled).
Analog Peripherals 12-bit S12ADE ADC (11 external + 1 internal channel, 0.67 µs conversion), 2×8-bit DA, 2-channel CMPB, TEMPSA sensor.
Timers & Control MTU2 (6×16-bit channels, PWM/complementary output), CMT (2×16-bit), TMR (4×8-bit), LPT (16-bit, sub-clock sourced), RTCB.
Communication CAN 2.0B (1 Mbps, ISO11898-1), SCIg/SCIk/SCIh (6 total UART/SPI/I2C-capable ports), RIIC (400 kbps SMBus), RSPI (16 Mbps master/slave).
Security & Safety AESA (AES-128/256 ECB/CBC/CTR), RNGA (32-bit true random), IEC60730 self-test support (ADC, clock accuracy, RAM, IWDT).
Power & Environment 1.8–5.5 V single supply; –40 to +105°C operating range; 0.25 µA software standby (typ.), 6.2 µs wake-up (HOCO 32 MHz).

Pinout & Package

Packaged in PWQN0048KC-A: 48-pin HWQFN, 7 × 7 mm body, 0.5 mm pitch, exposed thermal pad (VSS-connected). Pin functions validated per Renesas R01DS0379EJ0120 Table 1.4.

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Single 1.8–5.5 V rail; VSS also connects to thermal pad for thermal dissipation and noise reduction.
XTAL / EXTAL Main crystal oscillator interface Supports up to 20 MHz external crystal; enables precise timing for CAN, USB, or RTC synchronization.
XCIN / XCOUT Sub-clock oscillator (32.768 kHz) Drives RTCB calendar mode and LPT in deep-sleep states - essential for timekeeping during 0.25 µA standby.
MTIOC0A–MTIOC4D MTU2 waveform I/O Configurable as PWM outputs, input capture, or complementary drive - used for motor gate control or encoder interfacing.
TXD12 / RXD12 / SCL0 / SDA0 SCIh UART / RIIC I2C Dual-purpose pins: SCIh supports LIN protocol; RIIC operates at 400 kbps with SMBus compatibility for sensor bus integration.
CTSU0–CTSU23 Capacitive touch sensing inputs 24 dedicated CTSU2SL channels (self-capacitance) - enables robust touch HMI on metal-front panels without external ICs.
RES# Active-low reset input Asynchronous hardware reset; debounced internally - ensures reliable boot after brown-out or power sequencing.

Key Features

Feature Design Value
Hardware AES/RNG acceleration AESA module executes AES-128 in 176 cycles; RNGA provides FIPS-compliant entropy for secure key generation - eliminates software crypto overhead.
Event Link Controller (ELC) Direct hardware routing of 48 event signals (e.g., timer overflow → ADC start) - enables ultra-low-latency sensor-to-actuator chains without CPU wake-up.
IEC60730 Class B support Integrated self-test logic for ADC, clock accuracy (CAC), IWDT, and RAM - reduces certification effort for industrial safety-critical applications.
Low-power timer (LPT) 16-bit counter running on sub-clock or IWDT oscillator during software standby - maintains real-time scheduling at 0.25 µA, enabling battery life >5 years.
Capacitive touch unit (CTSU2SL) 24-key self-capacitance support with automatic correction/judgment - achieves >60 V common-mode noise immunity for noisy factory environments.

Applications

Industrial HMI Panel Smart Sensor Gateway

Use Scenario: Touch-enabled local control panel for PLCs and motor drives in factory automation.

IC Role / Device Role / Timing Role: Main controller executing real-time UI rendering, CAN bus communication with field devices, and local alarm handling.

Use Value: CTSU2SL's 24-key self-capacitance interface tolerates glove operation and ESD; 48 MHz RXv2 core renders graphics while servicing 1 Mbps CAN traffic.

Use Scenario: Edge node aggregating temperature, pressure, and vibration data from analog sensors before forwarding via CAN or RSPI to central controller.

IC Role / Device Role / Timing Role: Sensor fusion hub performing ADC sampling, CRC validation, AES encryption, and buffered packet transmission.

Use Value: 12-bit S12ADE achieves 0.67 µs conversion across 11 channels; AESA encrypts payloads in hardware - no CPU cycle penalty for security.

Energy Metering Subsystem Thermal Management Controller

Use Scenario: Secondary metering unit in smart breakers monitoring line voltage/current harmonics and reporting anomalies over CAN.

IC Role / Device Role / Timing Role: Precision analog front-end controller with synchronized sampling, real-time FFT preprocessing, and fault logging to data flash.

Use Value: Double-trigger ADC mode captures simultaneous voltage/current samples; 8 KB data flash stores 1M+ events with BGO for zero-downtime logging.

Use Scenario: Fan speed and heatsink temperature regulator in industrial power supplies or inverters.

IC Role / Device Role / Timing Role: Closed-loop thermal manager using TEMPSA sensor, 2×8-bit DA for analog fan control, and MTU2 PWM for digital fan drivers.

Use Value: LPT-driven PWM maintains fan speed during 0.25 µA standby; RTCB logs thermal history for predictive maintenance analytics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F51405ADNE#30 No AES/RNG hardware; same 128 KB flash, 32 KB SRAM, and PWQN0048KC-A package. Lacks cryptographic acceleration - unsuitable for secure firmware updates or TLS offload. Select when IEC60730 functional safety suffices without data-at-rest encryption requirements.
R5F51403AGNE#30 64 KB flash, 16 KB SRAM, 4 KB data flash; retains AES/RNG, CAN, CTSU2SL (24-key), and same -40 to +105°C rating. Reduced memory footprint limits complex UI or large OTA update buffers. Choose for cost-sensitive, compact designs where 64 KB flash meets firmware size constraints and full peripheral set is retained.

Compared with R5F51405BGNE#30, R5F51405ADNE#30 removes encryption but matches all timing, analog, and communication specs - ideal for non-secure legacy upgrades; R5F51403AGNE#30 trades memory capacity for identical security and interface capability - better suited for space-constrained thermal or sensor nodes.

Availability

R5F51405BGNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor gateways, energy metering subsystems, thermal management controllers, and CAN-based distributed control systems requiring stable component supply across extended temperature ranges.

Supply support for R5F51405BGNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX140 Group targets cost-optimized, safety-aware industrial applications - delivering high-integration MCUs with IEC60730 support, low-power operation, and robust peripheral sets including CAN, touch, and encryption.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F51405BGNE#30?

The R5F51405BGNE#30 operates at a maximum frequency of 48 MHz and features the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and IEEE-754-compliant FPU. This architecture delivers 204 CoreMark performance and supports deterministic real-time execution - critical for time-sensitive industrial control tasks within the R5F51405BGNE#30's design envelope.

Does the R5F51405BGNE#30 include hardware encryption and what algorithms does it support?

Yes, the R5F51405BGNE#30 includes the AESA hardware accelerator supporting AES-128 and AES-256 in ECB, CBC, and CTR modes, plus the RNGA true random number generator. These modules are fully integrated into the R5F51405BGNE#30 silicon - enabling secure firmware updates, TLS handshake acceleration, and cryptographic key generation without consuming CPU cycles or external components.

What package type and pin count does the R5F51405BGNE#30 use?

The R5F51405BGNE#30 uses the PWQN0048KC-A package: a 48-pin HWQFN with 7 × 7 mm body, 0.5 mm pitch, and an exposed thermal pad connected to VSS. This package is confirmed in Renesas R01DS0379EJ0120 Table 1.3 and Figure 1.1 - ensuring mechanical compatibility with standard 0.5 mm pitch QFN footprints and thermal performance suitable for industrial ambient conditions.

How many analog-to-digital converter channels does the R5F51405BGNE#30 support and what is its conversion speed?

The R5F51405BGNE#30 integrates the S12ADE 12-bit A/D converter with 11 external input channels and one internal channel (temperature sensor). At 48 MHz ADCLK, it achieves a minimum conversion time of 0.67 µs per channel - verified in R01DS0379EJ0120 Section 1.1 and Table 1.2 - enabling high-speed sampling for motor control or power quality monitoring within the R5F51405BGNE#30's feature set.

Is the R5F51405BGNE#30 qualified for extended temperature operation and what is its range?

Yes, the R5F51405BGNE#30 is rated for operation from –40°C to +105°C (G-grade), as specified in Renesas R01DS0379EJ0120 Table 1.3 and Section 1.1. This extended temperature range is validated across all peripherals - including CAN, CTSU2SL, and AESA - making the R5F51405BGNE#30 suitable for under-hood automotive subsystems, industrial drives, and outdoor infrastructure deployments.

R5F51405BGNE#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-WFQFN Exposed Pad
Series:
RX140
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
AES, Capacitive Touch, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
39
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F51405BGNE#30 FAQ

1.How can I place an order for R5F51405BGNE#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F51405BGNE#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F51405BGNE#30 reliable?

The price and inventory of R5F51405BGNE#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F51405BGNE#30 is usually 5 days.

3.What payment methods are accepted for R5F51405BGNE#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F51405BGNE#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F51405BGNE#30?

R5F51405BGNE#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F51405BGNE#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F51405BGNE#30?

For technical support, including R5F51405BGNE#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F51405BGNE#30 requirements.

6.How does Aetrix verify that R5F51405BGNE#30 is sourced from the original manufacturer or authorized distributors?

All R5F51405BGNE#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F51405BGNE#30 meets industry standards.

7.What is the process for return or replacement of R5F51405BGNE#30?

All R5F51405BGNE#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F51405BGNE#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F51405BGNE#30 part is unused and in its original packaging.

Return procedure for R5F51405BGNE#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F51405BGNE#30 Tags

  • R5F51405BGNE#30
  • R5F51405BGNE#30 PDF
  • R5F51405BGNE#30 Datasheet
  • R5F51405BGNE#30 Specifications
  • R5F51405BGNE#30 Images
  • Renesas
  • Renesas R5F51405BGNE#30
  • Buy R5F51405BGNE#30
  • R5F51405BGNE#30 Price
  • R5F51405BGNE#30 Distributor
  • R5F51405BGNE#30 Supplier
  • R5F51405BGNE#30 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER