Renesas R5F52107BDLK#U0

Overview

R5F52107BDLK#U0 from Renesas Electronics is a 32-bit RX CPU-based microcontroller operating at up to 50 MHz (78 DMIPS), featuring 384 KB on-chip flash, 64 KB SRAM, 8 KB data flash, 12-bit A/D converter (16 channels), 10-bit D/A converter (2 channels), RTC, ELC, MPC, and IEC60730-compliant safety functions - deployed in industrial control panels requiring deterministic real-time response and low-power operation.

For engineers reviewing the R5F52107BDLK#U0 datasheet, R5F52107BDLK#U0 pinout, R5F52107BDLK#U0 application, or R5F52107BDLK#U0 equivalent, key selection criteria include its 145-pin TFLGA package (7 × 7 mm, 0.5-mm pitch), full peripheral set (including 144-pin LQFP-compatible MTU2/TPU/SCI12/RIIC/RSPI), deep software standby with RTC wake-up, and voltage detection across three independent LVD circuits.

Technical Context

The R5F52107BDLK#U0 implements the RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It supports little-endian or big-endian data arrangement and executes 32 × 32-bit multiply in one cycle with 64-bit accumulator output.

Its clock system integrates PLL (4–12.5 MHz input), sub-clock oscillator (32.768 kHz), high-/low-speed on-chip oscillators, and IWDT-dedicated 125-kHz oscillator. Peripheral clocks (PCLK up to 32 MHz) and system clock (ICLK up to 50 MHz) are independently configurable for power/performance trade-offs.

Key Specifications

Pinout & Package

Package: 145-pin TFLGA (PTLG0145KA-A), 7 × 7 mm, 0.5-mm pitch, 0.75-mm height, RoHS-compliant, tray-packaged (#U0).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52107BDLK#U0, R5F52107BDFB#30 offers identical functionality in a larger LQFP package for easier prototyping and thermal management, while R5F52106BDLK#U0 reduces memory capacity by 33% to lower unit cost without altering pin compatibility or peripheral availability.

Availability

R5F52107BDLK#U0 is available at Aetrix Electronics and suitable for industrial control panels, smart energy meters, and factory automation gateways requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for R5F52107BDLK#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX210 Group - including R5F52107BDLK#U0 - was designed for cost-sensitive industrial applications demanding high reliability, functional safety compliance (IEC60730), and rich analog/mixed-signal integration in compact packages.

FAQ

What is the maximum operating frequency and associated performance metric for the R5F52107BDLK#U0?

The R5F52107BDLK#U0 operates at a maximum frequency of 50 MHz, delivering 78 DMIPS (Dhrystone MIPS) performance. This is achieved using the 32-bit RXv1 CPU core with 5-stage pipeline and single-cycle 32 × 32-bit multiplication. The device sustains this speed with zero wait states on both flash and SRAM accesses, ensuring deterministic real-time execution critical for industrial control tasks handled by the R5F52107BDLK#U0.

Does the R5F52107BDLK#U0 support IEC60730 Class B compliance out of the box?

Yes, the R5F52107BDLK#U0 includes dedicated hardware features for IEC60730 Class B compliance, including self-diagnostic routines for the A/D converter, clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT), RAM test assist, and analog input disconnection detection. These capabilities are integrated into the silicon and documented in Renesas' functional safety manual, enabling certified implementations without external monitoring circuitry - a key requirement for the R5F52107BDLK#U0 in safety-critical industrial equipment.

What package type and physical dimensions does the R5F52107BDLK#U0 use?

The R5F52107BDLK#U0 uses a 145-pin TFLGA (Thin Fine-Pitch Land Grid Array) package designated PTLG0145KA-A, measuring 7 × 7 mm with 0.5-mm pitch and 0.75-mm height. It features an exposed thermal pad on the underside for enhanced heat dissipation and is supplied in trays with SnCu lead-free termination (#U0). This compact, high-density package supports fine-pitch PCB assembly and meets IPC/JEDEC standards for industrial reflow profiles - essential for the R5F52107BDLK#U0's deployment in space-constrained automation modules.

How many communication interfaces does the R5F52107BDLK#U0 integrate, and what are their key capabilities?

The R5F52107BDLK#U0 integrates 13 SCI channels (SCI0–SCI11 + SCI12), 1 I2C bus interface (RIIC) supporting 400 kbps and SMBus, and 1 high-speed RSPI channel capable of 16 Mbps transfers. SCI supports asynchronous, clock-synchronous, and smart card modes; RIIC includes master/slave operation; RSPI offers double-buffered TX/RX with 8–32-bit frame flexibility. These interfaces collectively enable the R5F52107BDLK#U0 to serve as a central protocol bridge in multi-interface industrial systems.

What low-power modes are available on the R5F52107BDLK#U0, and which peripherals remain active in deep software standby?

The R5F52107BDLK#U0 offers four low-power modes: sleep, all-module clock stop, software standby, and deep software standby. In deep software standby, the CPU and nearly all peripherals halt, but the RTC remains fully operational - retaining calendar/time data, accepting alarm triggers, and generating wake-up interrupts via external pins or periodic events. This mode draws minimal current while preserving time-critical functionality, making it ideal for battery-backed applications relying on the R5F52107BDLK#U0 for long-duration scheduling and event logging.