Renesas R5F52108BDLK#U0

Overview

R5F52108BDLK#U0 from Renesas Electronics is a 32-bit RX CPU-based microcontroller operating at up to 50 MHz (78 DMIPS), featuring 512 KB on-chip flash, 64 KB SRAM, 8 KB data flash, 12-bit A/D converter (16 channels), 10-bit D/A converter (2 channels), RTC, ELC, MPC, and IEC60730 compliance functions for industrial control applications.

For engineers reviewing the R5F52108BDLK#U0 datasheet, R5F52108BDLK#U0 pinout, R5F52108BDLK#U0 application, or R5F52108BDLK#U0 equivalent, this page delivers verified specifications, package mapping, functional alternatives, and design-critical timing/peripheral details specific to the PTLG0145KA-A 145-pin TFLGA variant.

Technical Context

The R5F52108BDLK#U0 implements the RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and single-cycle 32×32-bit multiplication. It supports little-endian or big-endian data arrangement and includes a 64-bit accumulator for DSP operations.

Its clock system integrates PLL, sub-clock (32.768 kHz), high/low-speed on-chip oscillators, and IWDT-dedicated oscillator, with independent clock domains (ICLK up to 50 MHz, PCLK up to 32 MHz, BCLK up to 12.5 MHz, FCLK up to 32 MHz) enabling precise peripheral timing and low-power operation across four software-controllable power modes.

Key Specifications

Pinout & Package

Package: PTLG0145KA-A - 145-pin Thin Fine-Pitch Ball Grid Array (TFLGA), 7 mm × 7 mm, 0.5 mm pitch, 0.75 mm height, RoHS-compliant, tray-packaged (#U0 = SnCu termination).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F52108BDLK#U0, the R5F52108ADFP#V0 omits RTC and advanced timers-limiting time-stamped control-while R5F52108BDFB#30 retains full functionality but demands mechanical redesign; both require validation of voltage detection settings and IEC60730 diagnostic coverage.

Availability

R5F52108BDLK#U0 is available at Aetrix Electronics and suitable for industrial automation, smart metering, home appliance control, and building automation systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for R5F52108BDLK#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor manufacturer headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX210 Group-including R5F52108BDLK#U0-is designed for cost-sensitive industrial and consumer applications requiring robust real-time performance, functional safety support (IEC60730), and low-voltage operation down to 1.62 V.

FAQ

What is the maximum operating frequency and associated performance of the R5F52108BDLK#U0?

The R5F52108BDLK#U0 operates at a maximum frequency of 50 MHz, delivering 78 DMIPS performance. This is achieved using the RXv1 CPU core with a 5-stage pipeline and zero-wait-state access to its 512 KB on-chip flash and 64 KB SRAM. The device maintains full performance across its 1.62 V to 5.5 V supply range, with frequency scaling tied to VCC: 20 MHz at 1.62–1.8 V, 32 MHz at 1.8–2.7 V, and 50 MHz above 2.7 V. R5F52108BDLK#U0 sustains this speed without external wait states.

Does the R5F52108BDLK#U0 support IEC60730 Class B compliance, and which built-in features enable it?

Yes, the R5F52108BDLK#U0 includes dedicated hardware features for IEC60730 Class B compliance, including self-diagnostic support for the A/D converter, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance functions. These reduce firmware overhead during safety checks and provide deterministic fault detection. R5F52108BDLK#U0 also supports analog input disconnection detection and CRC calculation for data integrity-key elements validated in Renesas' functional safety documentation.

What package type and pin count does the R5F52108BDLK#U0 use, and what are its key mechanical attributes?

The R5F52108BDLK#U0 uses the PTLG0145KA-A package: a 145-pin Thin Fine-Pitch Ball Grid Array (TFLGA) with 7 mm × 7 mm body size, 0.5 mm ball pitch, and 0.75 mm maximum height. It features SnCu lead-free termination (#U0 suffix) and is supplied in trays. This package supports high I/O density and thermal performance in space-constrained industrial modules, with solder-ball interconnects enabling reliable mounting on standard PCB assembly lines.

How many A/D and D/A converter channels does the R5F52108BDLK#U0 integrate, and what are their key specifications?

The R5F52108BDLK#U0 integrates one 12-bit successive-approximation A/D converter with 16 input channels (AN000–AN015), capable of 1 μs conversion time at 50 MHz ADCLK, and supports sample-and-hold on three channels and synchronized multi-channel sampling. It also includes two 10-bit D/A converters (DA0, DA1) with output voltage range 0 V to VREFH. R5F52108BDLK#U0 provides A/D self-diagnosis and analog input disconnection detection-critical for sensor integrity monitoring in safety-critical applications.

What communication interfaces are available on the R5F52108BDLK#U0, and how are they allocated across the package?

The R5F52108BDLK#U0 provides 13 SCI channels (SCI0–SCI11 + SCId/SCI12), 1 I2C bus interface (RIIC) supporting 400 kbps and SMBus, and 1 RSPI channel supporting up to 16 Mbps. As a 145-pin TFLGA variant, it fully implements all these interfaces per the RX210 Group specification-unlike smaller packages that reduce SCI count or omit TPU/RTC. R5F52108BDLK#U0 allocates dedicated pins for each interface, with SCI0–SCI11 mapped to primary I/O banks and RSPI/RIIC assigned to optimized signal routing paths for noise immunity.