Renesas R5F52108CDFP#30

Overview

R5F52108CDFP#30 from Renesas Electronics is a 32-bit RX CPU-based microcontroller operating at up to 50 MHz (78 DMIPS), featuring 512 KB on-chip flash, 64 KB SRAM, and 8 KB data flash. It integrates a 12-bit A/D converter (16 channels, 1 µs conversion), dual 10-bit D/A converters, RTC with deep software standby wake-up, and ELC for event-driven peripheral operation-targeted for industrial control and smart sensor nodes requiring IEC60730 compliance.

For engineers reviewing the R5F52108CDFP#30 datasheet, R5F52108CDFP#30 pinout, R5F52108CDFP#30 application, or R5F52108CDFP#30 equivalent, this MCU delivers deterministic real-time performance with low-power modes (deep software standby, four power states), hardware-accelerated CRC, temperature sensor, and flexible multi-function pin control (MPC) for layout optimization in space-constrained embedded designs.

Technical Context

The R5F52108CDFP#30 implements the RXv1 core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. Its clock system includes PLL (4–12.5 MHz input), sub-clock oscillator (32.768 kHz), and dedicated IWDT oscillator (125 kHz), with independent ICLK (50 MHz), PCLK (32 MHz), BCLK (12.5 MHz), and FCLK (32 MHz) domains.

Peripheral integration centers on event-driven operation: ELC directly links 59 event sources (e.g., timer overflows, external pins) to modules like MTU2, TPU, and ADC without CPU intervention; MPC enables dynamic reassignment of up to 122 I/O functions across pins; and DTC/DMAC support chain transfers and low-CPU-load DMA for SCI, RSPI, and RIIC.

Key Specifications

Pinout & Package

Package: PLQP0100KB-A - 100-pin LQFP, 14 mm × 14 mm, 0.5 mm pitch, exposed pad, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52108ADFP#V0, R5F52108CDFP#30 adds RTC, TPU, and full ELC capability for autonomous peripheral coordination; versus R5F52108BDFP#30, it omits external bus but retains identical core peripherals and power efficiency-making it ideal for self-contained, space-constrained industrial controllers.

Availability

R5F52108CDFP#30 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, and building automation sensor nodes requiring stable component supply, long-term lifecycle support, and IEC60730-compliant design assurance.

Supply support for R5F52108CDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX210 Group-including R5F52108CDFP#30-is designed for cost-sensitive industrial and consumer applications demanding high reliability, low power, and integrated functional safety features without external support components.

FAQ

What is the maximum operating frequency and core performance of the R5F52108CDFP#30?

The R5F52108CDFP#30 operates at a maximum frequency of 50 MHz, delivering 78 DMIPS of processing performance. Its RXv1 32-bit CPU core supports 64-bit accumulator operations for 32×32-bit multiplication, fast interrupt response, and ultra-compact code density-enabling real-time deterministic execution in industrial control loops. The R5F52108CDFP#30 maintains no-wait-state access to both flash and SRAM at full speed.

Does the R5F52108CDFP#30 include hardware support for functional safety standards like IEC60730?

Yes, the R5F52108CDFP#30 integrates multiple hardware-assisted safety features for IEC60730 Class B compliance, including a clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT) with dedicated 125 kHz oscillator, A/D converter self-diagnostic mode, analog input disconnection detection, and RAM test assist logic. These reduce firmware validation burden and improve system-level fault coverage without external components.

What package type and pin count does the R5F52108CDFP#30 use?

The R5F52108CDFP#30 uses the PLQP0100KB-A package: a 100-pin LQFP measuring 14 mm × 14 mm with 0.5 mm pitch and an exposed thermal pad. This RoHS-compliant, Pb-free package supports 122 general-purpose I/O pins, 4 of which are 5-V tolerant, and provides robust thermal performance for continuous industrial operation at −40°C to +85°C.

How does the Event Link Controller (ELC) in the R5F52108CDFP#30 improve system efficiency?

The ELC in the R5F52108CDFP#30 enables direct hardware-level connection of 59 event sources (e.g., timer overflows, external pin edges, ADC completion) to peripheral modules-bypassing CPU interrupts entirely. This reduces latency, eliminates CPU polling overhead, and allows peripherals like MTU2 or ADC to operate autonomously during sleep modes, significantly lowering power consumption and improving real-time responsiveness in the R5F52108CDFP#30.

What are the key differences between chip versions A, B, and C of the RX210 Group, specifically for the R5F52108CDFP#30?

The R5F52108CDFP#30 belongs to chip version C, which includes full RTC, TPU, and ELC functionality-unlike version A (no RTC/TPU) and version B (adds external bus interface and 144-pin LQFP). All three share identical CPU, memory sizes (512 KB flash/64 KB RAM), and core peripherals, but version C delivers the optimal balance of integrated timing, event handling, and industrial I/O for compact controllers where external memory expansion is unnecessary.