Renesas R5F5210ABDFB#30
- Part No.:
- R5F5210ABDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F5210ABDFB#30.pdf
- Description:
- IC MCU 32BIT 768KB FLSH 144LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,631
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F5210ABDFB#30 from Renesas Electronics is a 32-bit RX CPU-based microcontroller operating at up to 50 MHz (78 DMIPS), featuring 768 KB on-chip flash, 96 KB SRAM, 8 KB data flash, 12-bit A/D converter (16 channels, 1 µs conversion), and real-time clock with deep software standby wake-up capability - deployed in industrial HMI, motor control interfaces, and smart appliance main control units.
For engineers reviewing the R5F5210ABDFB#30 datasheet, R5F5210ABDFB#30 pinout, R5F5210ABDFB#30 application, or R5F5210ABDFB#30 equivalent, this page delivers verified package mapping (144-pin LQFP, PLQP0144KA-A), confirmed peripheral count (145-pin-equivalent TPU/MTU/SCI resources), IEC60730-compliant self-test functions, and exact chip version B feature set per Renesas R01DS0041EJ0150 Rev.1.50.
Technical Context
The R5F5210ABDFB#30 implements the RXv1 CPU core with 5-stage CISC Harvard pipeline, 64-bit accumulator for single-cycle 32×32 multiply-accumulate, and on-chip debugging via FINE interface. It supports little-endian or big-endian data arrangement and executes instructions in one system clock cycle at full 50 MHz operation.
Its clock system integrates PLL (4–12.5 MHz input), sub-clock oscillator (32.768 kHz), dedicated IWDT oscillator (125 kHz), and clock accuracy measurement circuit (CAC). Peripheral clocks are independently configurable: ICLK (50 MHz max), PCLK (32 MHz max), BCLK (12.5 MHz max), FCLK (32 MHz max).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv1 32-bit CISC Harvard, 5-stage pipeline, 78 DMIPS @ 50 MHz |
| Max Operating Frequency | 50 MHz (VCC ≥ 2.7 V); no wait states for flash/SRAM access |
| Memory | 768 KB flash (code/data), 96 KB SRAM, 8 KB data flash (100k erase/write cycles) |
| Analog Peripherals | 12-bit S12AD (16 ch, 1 µs conv.), 10-bit DA (2 ch), 2× CMPA/B, TEMPS sensor |
| Timers & Control | 6× MTU2 (16-bit PWM/complementary), 6× TPU (16-bit encoder/PWM), RTC + IWDT + WDTA |
| Communication | 13× SCI (async/sync/smart card), 1× RIIC (400 kbps), 1× RSPI (16 Mbps), ELC event linking |
| Package & Environment | 144-pin LQFP (PLQP0144KA-A, 20×20 mm, 0.5 mm pitch), −40°C to +85°C |
Pinout & Package
Package: 144-pin LQFP (PLQP0144KA-A), 20 × 20 mm body, 0.5 mm pitch, exposed pad not present, RoHS-compliant matte tin lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply / Ground | Dual 1.62–5.5 V supply domains; separate analog/digital VCC pins support noise isolation |
| XTAL, EXTAL | Main clock oscillator input/output | Supports external crystal up to 20 MHz; internal PLL generates 50 MHz system clock |
| RTC_XT1, RTC_XT2 | Sub-clock oscillator terminals | Connect 32.768 kHz crystal for RTC and deep software standby timekeeping |
| RES# | Active-low reset input | Asynchronous hardware reset; complements POR, LVD, and watchdog resets |
| IRQ0–IRQ7, NMI | External interrupt inputs | Eight configurable edge-triggered IRQ lines plus non-maskable interrupt pin |
| P00–P15, PA–PF | General-purpose I/O ports | 122 total GPIOs; 5-V tolerant on select pins; MPC enables flexible peripheral pin assignment |
Key Features
| Feature | Design Value |
|---|---|
| IEC60730 Class B Support | Integrated self-test for A/D, clock accuracy (CAC), IWDT, RAM, and analog input disconnection detection |
| Event Link Controller (ELC) | Direct hardware triggering of 59 peripheral events without CPU intervention or interrupt latency |
| Multi-function Pin Controller (MPC) | Run-time reassignment of peripheral functions (SCI, I2C, timers) across multiple GPIO pins |
| Low-Power Operation | Four modes including deep software standby with RTC active and IWDT running at 125 kHz |
| On-chip Debugging | FINE interface compatible with Renesas E1 emulator; supports real-time trace and breakpoint debugging |
Applications
| Industrial Motor Drive Interface | Smart Home Appliance Controller |
|---|---|
Use Scenario: Real-time control of BLDC motor commutation, current sensing, and thermal monitoring in HVAC blowers and washing machine drives. IC Role / Device Role / Timing Role: Main system MCU executing field-oriented control (FOC) algorithms, managing 12-bit ADC sampling at 1 µs intervals, and generating complementary PWM via MTU2. Use Value: Integrated 768 KB flash stores complex motor control firmware; ELC enables zero-latency trigger of ADC conversions from MTU2 PWM edges. |
Use Scenario: Central control unit in connected refrigerators and ovens managing display, user input, temperature regulation, and Wi-Fi module communication. IC Role / Device Role / Timing Role: System orchestrator handling RTOS scheduling, 10-bit DAC-driven analog outputs, RTC-based defrost timing, and SCI-based UART bridge to wireless SoC. Use Value: 96 KB SRAM accommodates FreeRTOS + middleware stacks; deep software standby mode reduces standby power while preserving RTC state. |
| Factory Automation I/O Module | Medical Diagnostic Device Front-End |
Use Scenario: DIN-rail mounted remote I/O node acquiring analog sensor data (pressure, flow), driving relays, and communicating via RS485 (SCI) to PLC master. IC Role / Device Role / Timing Role: Deterministic peripheral controller using TPU for quadrature encoder input, SCI for Modbus RTU, and CRC calculator for packet integrity. Use Value: 144-pin package provides 122 GPIOs for discrete I/O expansion; built-in voltage detection (LVDA) ensures safe shutdown during brown-out. |
Use Scenario: Signal conditioning and timing management in portable blood glucose meters and pulse oximeters requiring FDA Class II compliance. IC Role / Device Role / Timing Role: Safety-critical subsystem MCU performing A/D conversion of biosensor signals, self-diagnostic checks, and RTC-stamped data logging to data flash. Use Value: IEC60730-assisted diagnostics (A/D self-test, clock accuracy check, RAM test) reduce external safety component count and simplify certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5210BBDFB#30 | 1 MB flash, 96 KB SRAM, same package/peripherals; chip version B with full 145-pin-equivalent peripheral set | Required where firmware size exceeds 768 KB or future-proofing for feature expansion is needed | Select when additional flash headroom or guaranteed full peripheral availability (e.g., TPU) is mandatory |
| R5F5210ABGFB#30 | Identical memory/peripherals but rated for −40°C to +105°C; same chip version B and 144-pin LQFP package | Necessary for under-hood automotive modules or high-ambient industrial enclosures | Choose for extended temperature operation without changing PCB layout or firmware |
Compared with R5F5210ABDFB#30, R5F5210BBDFB#30 offers 232 KB more flash for larger firmware or OTA update partitions, while R5F5210ABGFB#30 maintains identical functionality with extended thermal qualification - both retain pin compatibility and require no schematic or layout changes.
Availability
R5F5210ABDFB#30 is available at Aetrix Electronics and suitable for industrial motor control, smart appliance main control, and factory automation I/O modules requiring stable component supply, long-term lifecycle assurance, and Renesas-authorized traceability.
Supply support for R5F5210ABDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.
The RX210 Group, including R5F5210ABDFB#30, was designed for cost-sensitive industrial and consumer applications demanding high CPU performance, integrated analog peripherals, functional safety support (IEC60730), and low-power operation across wide temperature ranges.
FAQ
What is the maximum operating frequency and voltage range for the R5F5210ABDFB#30?
The R5F5210ABDFB#30 operates at up to 50 MHz when supplied with 2.7–5.5 V, 32 MHz at 1.8–2.7 V, and 20 MHz at 1.62–1.8 V. Its flash and SRAM operate with zero wait states across all supported frequencies, enabling deterministic real-time execution without performance penalties from memory latency.
Does the R5F5210ABDFB#30 support IEC60730 Class B compliance out of the box?
Yes, the R5F5210ABDFB#30 includes hardware-assisted self-test features required for IEC60730 Class B: A/D converter diagnostic, clock accuracy measurement (CAC), independent watchdog timer (IWDT) verification, RAM test routines, and analog input disconnection detection - all documented in Renesas Application Note R01AN1309.
What package type and pin count does the R5F5210ABDFB#30 use?
The R5F5210ABDFB#30 uses a 144-pin LQFP package (PLQP0144KA-A), measuring 20 × 20 mm with 0.5 mm pitch. This package supports the full peripheral complement of chip version B, including 6-channel MTU2, 6-channel TPU, 13-channel SCI, and 16-channel 12-bit A/D converter as specified in R01DS0041EJ0150.
How many communication interfaces does the R5F5210ABDFB#30 include?
The R5F5210ABDFB#30 integrates 13 serial communications interface (SCI) channels (SCI0–SCI11 + SCId), 1 I2C bus interface (RIIC) supporting SMBus and fast-mode (400 kbps), and 1 serial peripheral interface (RSPI) capable of 16 Mbps master/slave operation - enabling simultaneous connectivity to displays, sensors, wireless modules, and legacy industrial buses.
Is on-chip debugging supported for the R5F5210ABDFB#30, and what toolchain is required?
Yes, the R5F5210ABDFB#30 supports on-chip debugging via the FINE interface using Renesas E1 emulator. Development is enabled with e2 studio IDE, GCC-based RX compiler (CS+ also supported), and Renesas' RX Driver Package - all freely available from the Renesas website with full documentation for the R5F5210ABDFB#30 device variant.
R5F5210ABDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX200
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- RX
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- EBI/EMI, I2C, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 122
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5210ABDFB#30 FAQ
1.How can I place an order for R5F5210ABDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5210ABDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5210ABDFB#30 reliable?
The price and inventory of R5F5210ABDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5210ABDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F5210ABDFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5210ABDFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5210ABDFB#30?
R5F5210ABDFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5210ABDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5210ABDFB#30?
For technical support, including R5F5210ABDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5210ABDFB#30 requirements.
6.How does Aetrix verify that R5F5210ABDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F5210ABDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5210ABDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F5210ABDFB#30?
All R5F5210ABDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5210ABDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5210ABDFB#30 part is unused and in its original packaging.
Return procedure for R5F5210ABDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F5210ABDFB#30 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

