Renesas R5F5210ABDLJ#U0

Overview

R5F5210ABDLJ#U0 from Renesas Electronics is a 32-bit RX210 Group microcontroller featuring a 50 MHz CPU core delivering 78 DMIPS, 768 KB on-chip flash memory, 96 KB SRAM, and 8 KB data flash. It integrates a 12-bit A/D converter (16 channels, 1 μs conversion), dual 10-bit D/A converters, RTC with deep software standby wake-up, ELC for event-driven peripheral operation, and IEC60730 safety support-targeting industrial control panels requiring deterministic real-time response and functional safety compliance.

For engineers reviewing the R5F5210ABDLJ#U0 datasheet, R5F5210ABDLJ#U0 pinout, R5F5210ABDLJ#U0 application, or R5F5210ABDLJ#U0 equivalent, key selection criteria include its 100-pin TFLGA package (7 × 7 mm, 0.65-mm pitch), chip version B feature set (full 145-pin-compatible peripheral count including 12-channel SCIc, 6-channel MTU2, and RTC), 5-V-tolerant I/O capability on four pins, and −40°C to +85°C operating range.

Technical Context

The R5F5210ABDLJ#U0 implements the 32-bit RX CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and single-cycle 32×32-bit multiplication. Its clock system includes PLL (4–12.5 MHz input), sub-clock oscillator (32.768 kHz), and dedicated IWDT oscillator (125 kHz), with independent ICLK (50 MHz), PCLK (32 MHz), BCLK (12.5 MHz), and FCLK (32 MHz) domains.

Peripheral integration centers on event-driven operation via the Event Link Controller (ELC), supporting direct module triggering without CPU intervention. The MCU supports four low-power modes-including deep software standby with RTC active-and incorporates hardware-assisted safety functions: A/D self-diagnostic, clock accuracy measurement (CAC), and RAM test assistance per IEC60730 Class B requirements.

Key Specifications

Pinout & Package

Package: 100-pin Thin Fine-Pitch Land Grid Array (TFLGA), 7 mm × 7 mm, 0.65-mm pitch, RoHS-compliant, tray-packaged (SnCu termination).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5210ABDLJ#U0, R5F5210BBDFB#30 offers greater memory and external bus capability at the expense of size and layout complexity, while R5F5210ABDFP#30 trades 5-V tolerance and compact TFLGA packaging for easier manufacturability and lower cost in less space-constrained applications.

Availability

R5F5210ABDLJ#U0 is available at Aetrix Electronics and suitable for industrial control panels, smart energy meters, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for R5F5210ABDLJ#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX210 Group, including R5F5210ABDLJ#U0, was designed for cost-sensitive industrial applications demanding high computational efficiency, integrated analog peripherals, functional safety support, and low-power operation across extended temperature ranges.

FAQ

What is the maximum operating frequency and CPU performance of the R5F5210ABDLJ#U0?

The R5F5210ABDLJ#U0 operates at a maximum frequency of 50 MHz and delivers 78 DMIPS of processing performance using the 32-bit RX CPU core. Its 5-stage pipeline, variable-length instruction set, and single-cycle 32×32-bit multiplier enable efficient execution of real-time control algorithms. This performance level is sustained across the full 1.62–5.5 V supply range, with no wait states on flash or SRAM access at rated speed.

Does the R5F5210ABDLJ#U0 support functional safety standards like IEC60730?

Yes, the R5F5210ABDLJ#U0 includes hardware-assisted features for IEC60730 Class B compliance, including self-diagnostic functions for the A/D converter, clock frequency accuracy measurement (CAC), independent watchdog timer (IWDT) with dedicated oscillator, and RAM test assistance. These capabilities reduce software certification burden and support safe operation in household appliances and industrial equipment.

What package type and pin count does the R5F5210ABDLJ#U0 use?

The R5F5210ABDLJ#U0 uses a 100-pin Thin Fine-Pitch Land Grid Array (TFLGA) package designated PTLG0100JA-A, measuring 7 mm × 7 mm with 0.65-mm pitch. This compact, RoHS-compliant package supports high-density PCB layouts and includes 4 pins with 5-V tolerance for interfacing with legacy logic or sensors without level-shifting circuitry.

How many communication interfaces does the R5F5210ABDLJ#U0 integrate?

The R5F5210ABDLJ#U0 integrates up to 15 communication channels: 12 Serial Communications Interfaces (SCIc) supporting asynchronous, clock-synchronous, and smart card modes; 1 I2C bus interface (RIIC) capable of 400 kbps and SMBus operation; and 1 Serial Peripheral Interface (RSPI) supporting master/slave operation at up to 16 Mbps. All are accessible within its 100-pin TFLGA footprint.

What is the flash and RAM capacity of the R5F5210ABDLJ#U0?

The R5F5210ABDLJ#U0 contains 768 KB of on-chip flash memory for program storage and 96 KB of SRAM for data and stack operations. It also includes 8 KB of data flash memory rated for 100,000 erase/write cycles, enabling reliable nonvolatile storage of calibration data, configuration parameters, or firmware update images without external EEPROM.