Renesas R5F5210BBDLJ#U0

Overview

R5F5210BBDLJ#U0 from Renesas Electronics is a 32-bit RX CPU-based microcontroller operating at up to 50 MHz (78 DMIPS), featuring 1 Mbyte on-chip flash, 96 Kbytes SRAM, 8 Kbytes data flash, 12-bit A/D converter (16 channels), 10-bit D/A converter (2 channels), RTC, ELC, MPC, and IEC60730-compliant safety functions - deployed in industrial control panels requiring deterministic real-time response and functional safety support.

For engineers reviewing the R5F5210BBDLJ#U0 datasheet, R5F5210BBDLJ#U0 pinout, R5F5210BBDLJ#U0 application, or R5F5210BBDLJ#U0 equivalent, key selection considerations include its 100-pin TFLGA package (7 × 7 mm, 0.65-mm pitch), −40°C to +85°C temperature grade, chip version B feature set (including full 144-pin-equivalent peripheral count except external bus), and integrated event-link controller for low-latency peripheral coordination without CPU intervention.

Technical Context

The R5F5210BBDLJ#U0 implements the RXv1 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports little-endian or big-endian data arrangement and includes a dedicated 64-bit accumulator for single-cycle 32×32-bit multiply-accumulate operations.

Its clock system integrates PLL, main/sub-clock oscillators, on-chip high/low-speed oscillators, and IWDT-dedicated oscillator, with independent domain clocks (ICLK up to 50 MHz, PCLK up to 32 MHz, BCLK up to 12.5 MHz, FCLK up to 32 MHz). The ELC enables direct hardware-triggered peripheral operation during CPU sleep, reducing latency and power consumption.

Key Specifications

Pinout & Package

Package: 100-pin TFLGA (PTLG0100JA-A), 7 × 7 mm, 0.65-mm pitch, 5-V tolerant I/O on selected pins (4 pins), open-drain capability on 76 pins, and MPC-enabled peripheral pin remapping.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5210ABDLJ#U0 and R5F52108BDLJ#U0, the R5F5210BBDLJ#U0 delivers maximum on-chip memory (1 Mbyte flash/96 Kbytes SRAM) within the 100-pin TFLGA footprint while retaining full chip version B peripheral functionality - making it optimal for complex real-time firmware with large code size and extensive data logging requirements.

Availability

R5F5210BBDLJ#U0 is available at Aetrix Electronics and suitable for industrial control systems, smart metering platforms, and factory automation gateways requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for R5F5210BBDLJ#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX210 Group, including the R5F5210BBDLJ#U0, was designed for cost-sensitive industrial and consumer applications demanding high CPU performance, rich analog integration, functional safety support, and ultra-low-power operation across extended temperature ranges.

FAQ

What is the maximum operating frequency and associated performance metric for the R5F5210BBDLJ#U0?

The R5F5210BBDLJ#U0 operates at a maximum frequency of 50 MHz and delivers 78 DMIPS (Dhrystone MIPS) performance. This benchmark reflects real-world integer processing throughput under typical compiler-optimized code execution, validated per the RXv1 core specification. Its 5-stage pipeline and 64-bit accumulator enable efficient handling of control algorithms and signal processing tasks in the R5F5210BBDLJ#U0.

Does the R5F5210BBDLJ#U0 support IEC60730 Class B compliance out of the box?

The R5F5210BBDLJ#U0 includes dedicated hardware features to assist IEC60730 Class B compliance, including A/D converter self-diagnostic and analog input disconnection detection, clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT), and RAM test assistance functions. These are documented in the R01DS0041EJ0150 datasheet and require proper software initialization - the R5F5210BBDLJ#U0 itself provides the foundational hardware capabilities but does not constitute full certification.

What package type and physical dimensions does the R5F5210BBDLJ#U0 use?

The R5F5210BBDLJ#U0 uses a 100-pin TFLGA (Thin Fine-Pitch Land Grid Array) package designated PTLG0100JA-A, measuring 7 × 7 mm with 0.65-mm pitch. It features 4 pins rated for 5-V tolerance and supports MPC-based peripheral pin remapping. This compact, near-chip-scale package enables high-density PCB layouts while maintaining thermal and electrical performance for industrial applications.

How many serial communication interfaces does the R5F5210BBDLJ#U0 integrate, and what protocols are supported?

The R5F5210BBDLJ#U0 integrates up to 13 serial communication channels: 12 SCIc channels (SCI0–SCI11) and 1 SCId channel (SCI12), plus 1 RIIC (I²C/SMBus) and 1 RSPI (SPI/SSI). Protocols include asynchronous UART, clock-synchronous serial, smart card interface, I²C fast mode (400 kbps), and SPI master/slave with 8–32-bit frame support. All are accessible in the R5F5210BBDLJ#U0's 100-pin TFLGA package.

What is the flash and SRAM capacity of the R5F5210BBDLJ#U0, and are they zero-wait-state at maximum speed?

The R5F5210BBDLJ#U0 integrates 1 Mbyte of on-chip flash memory and 96 Kbytes of SRAM, both operating at zero wait states up to the maximum 50-MHz CPU clock frequency. Flash access time is specified at 20 ns, and both memories support read/write operations without CPU stalling - confirmed in the R01DS0041EJ0150 datasheet Section 1.1 and Table 1.1 for chip version B devices like the R5F5210BBDLJ#U0.