Renesas R5F52305AGND#20

Overview

R5F52305AGND#20 from Renesas is a 32-bit RXv2 microcontroller targeting industrial and consumer applications requiring integrated security, capacitive touch, and mixed-signal capability. It operates at up to 54 MHz, integrates 128 KB on-chip flash, 32 KB SRAM, 8 KB data flash, a 12-bit 24-channel ADC (0.83 µs conversion), two 12-bit DAC channels, and TSIP-Lite encryption with AES-128/256 support. Its 64-pin HWQFN package (9 × 9 mm, 0.5 mm pitch) supports CAN, USB 2.0 full-speed OTG, and RTC functionality.

For engineers reviewing the R5F52305AGND#20 datasheet, R5F52305AGND#20 pinout, R5F52305AGND#20 application, or R5F52305AGND#20 equivalent, key selection considerations include its −40 to +105°C operating range (G version), lack of SDHI and CAN modules per package-specific function mapping, presence of CTSU (24-channel self-capacitance), and compatibility with Renesas' E2 studio and CS+ development tools.

Technical Context

The R5F52305AGND#20 belongs to the RX230 Group and implements the RXv2 CPU core with IEEE 754-compliant single-precision FPU, 32-bit MAC, and hardware divider (2-cycle min). It supports little- or big-endian data arrangement and executes instructions at one per cycle at 54 MHz.

Its peripheral set includes DMAC (4 channels), DTC, ELC for event-driven operation without CPU wake-up, MPC for flexible pin assignment, and dual TPU/MTU2 timer units enabling PWM, input capture, and phase counting. Clocking uses main (1–20 MHz), sub (32.768 kHz), and on-chip oscillators with PLL for system (54 MHz) and USB (48 MHz) clocks.

Key Specifications

Pinout & Package

PWQN0064KC-A is a 64-pin heat-sink exposed pad HWQFN package (9 × 9 mm, 0.5 mm pitch) with wettable flank profile for automated optical inspection. Pin 1 is marked by a dot; thermal pad (EP) must be soldered to PCB ground plane for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F52305AGND#20, R5F52306AGND#U0 offers scalable flash capacity without changing layout or firmware architecture, while R5F52315AGFL#30 trades CTSU and ADC resources for smaller size-neither is pin-compatible, but both share identical peripheral register maps and toolchain support.

Availability

R5F52305AGND#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance controllers, medical diagnostic devices, and building automation sensors requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F52305AGND#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX230 Group, including R5F52305AGND#20, was designed for cost-sensitive industrial and consumer applications demanding robust security, capacitive touch, and high-precision analog integration in compact packages.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F52305AGND#20?

The R5F52305AGND#20 features a 32-bit RXv2 CPU core with a maximum operating frequency of 54 MHz, delivering 88.56 DMIPS. It includes an IEEE 754-compliant single-precision floating-point unit, 32-bit multiply-accumulate instructions, and a hardware divider with minimum 2-cycle execution. The core uses CISC Harvard architecture with a 5-stage pipeline and variable-length instructions for ultra-compact code density.

Does the R5F52305AGND#20 support CAN or SD host interface functionality?

No, the R5F52305AGND#20 does not support CAN or SD host interface (SDHI) functionality. According to Table 1.2 of the official datasheet (R01DS0261EJ0120), these modules are explicitly excluded from the RX230 Group in all package variants-including the PWQN0064KC-A used by R5F52305AGND#20. Only RX231 Group parts in 100-pin packages include CAN and SDHI.

What is the operating temperature range and package type of the R5F52305AGND#20?

The R5F52305AGND#20 is a G-version device rated for −40 to +105°C operation and housed in a PWQN0064KC-A package: a 64-pin HWQFN measuring 9 × 9 mm with 0.5 mm pitch and an exposed thermal pad. This package supports automated optical inspection via wettable flanks and requires soldering the EP pad to PCB ground for thermal management.

How many capacitive touch channels does the R5F52305AGND#20 support, and what method is used?

The R5F52305AGND#20 integrates a Capacitive Touch Sensing Unit (CTSU) supporting up to 24 keys using the self-capacitance method. Each key maps to a dedicated CTSU_Sx pin (x = 0–23), with built-in charge-transfer measurement, noise cancellation, and low-power scanning-requiring no external RC components or dedicated touch controller IC.

What encryption capabilities does the R5F52305AGND#20 provide through TSIP-Lite?

The R5F52305AGND#20 includes TSIP-Lite, Renesas' Trusted Secure IP module, supporting AES-128 and AES-256 encryption in ECB, CBC, GCM, CMAC, XTS, CTR, and GCTR modes. It also provides a true random number generator and secure key management to prevent unauthorized access-enabling compliance with IEC 60730 Class B safety requirements for secure firmware updates and data protection.