Renesas R5F52306AGFM#10

Overview

R5F52306AGFM#10 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 256 KB on-chip flash memory, 32 KB SRAM, and 8 KB data flash. It integrates a single-precision FPU (IEEE 754), 12-bit A/D converter (24 channels), 12-bit D/A converter (2 channels), capacitive touch sensing unit (24 keys), USB 2.0 full-speed host/function/OTG, CAN interface, and TSIP-Lite encryption engine. It targets industrial HMI and sensor-edge control applications requiring real-time processing, secure firmware updates, and low-power operation across −40 to +105°C.

For engineers reviewing the R5F52306AGFM#10 datasheet, R5F52306AGFM#10 pinout, R5F52306AGFM#10 application, or R5F52306AGFM#10 equivalent, key selection considerations include its 64-pin LFQFP package (PLQP0064KB-C), absence of SDHI and CAN modules (per Table 1.4), G-grade temperature rating, and compatibility with RX230 Group toolchains and debug interfaces including FINE.

Technical Context

The R5F52306AGFM#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-delivering 88.56 DMIPS at 54 MHz. It supports little-endian data arrangement and includes memory protection unit (MPU), on-chip divider (2-cycle min), and fast interrupt response.

Its clock system features main oscillator (1–20 MHz), sub-clock (32.768 kHz), PLL input (4–12.5 MHz), and USB-dedicated PLL (4/6/8/12 MHz), enabling independent ICLK (54 MHz), PCLKA (54 MHz), PCLKD (54 MHz), and BCLK (32 MHz) domains. Low-power operation includes software standby mode with active low-power timer (LPT) and three configurable power modes.

Key Specifications

Pinout & Package

64-pin LFQFP package (PLQP0064KB-C), 10 × 10 mm body, 0.5 mm pitch, exposed thermal pad (non-electrical), RoHS-compliant lead finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F52306AGFM#10, R5F52306ADFM#30 offers identical performance at lower temperature grade, while R5F52316AGFM#30 adds CAN and SDHI-making it suitable for automotive diagnostics or data-logging gateways where those interfaces are essential.

Availability

R5F52306AGFM#10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, motor drive interfaces, and secure industrial gateways requiring stable component supply across extended temperature ranges.

Supply support for R5F52306AGFM#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, and power management solutions for industrial, automotive, and IoT markets.

The RX230 Group-including R5F52306AGFM#10-is designed for cost-sensitive, thermally demanding embedded applications requiring real-time performance, security, and rich analog integration without SD or CAN overhead.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F52306AGFM#10?

The R5F52306AGFM#10 operates at a maximum frequency of 54 MHz using the 32-bit RXv2 CPU core. This core features a 5-stage pipeline, CISC Harvard architecture, variable-length instructions, and delivers 88.56 DMIPS. It includes an IEEE 754-compliant single-precision floating-point unit, on-chip divider (2-cycle minimum), and memory protection unit-making R5F52306AGFM#10 suitable for deterministic real-time control tasks.

Does the R5F52306AGFM#10 support USB and CAN interfaces?

The R5F52306AGFM#10 integrates a full-featured USB 2.0 host/function/OTG module supporting full-speed (12 Mbps), low-speed (1.5 Mbps), isochronous transfers, and BC1.2 battery charging. However, per Renesas' official product table (Table 1.4), the R5F52306AGFM#10 does not include the CAN module-this feature is present only in higher-numbered RX230 variants like R5F52316AGFM#10.

What memory resources are available on the R5F52306AGFM#10?

The R5F52306AGFM#10 includes 256 KB of on-chip flash memory (with no-wait access up to 32 MHz), 32 KB of SRAM (no-wait at 54 MHz), and 8 KB of data flash rated for 1,000,000 program/erase cycles. The flash supports background operation (BGO) and programming at 1.8 V, enabling robust firmware updates and parameter storage in R5F52306AGFM#10-based systems.

What is the operating temperature range and package type of the R5F52306AGFM#10?

The R5F52306AGFM#10 is rated for operation from −40 to +105°C (G-grade) and uses a 64-pin LFQFP package (PLQP0064KB-C) with 10 × 10 mm body size and 0.5 mm pitch. This package includes an exposed thermal pad for enhanced heat dissipation-critical for sustained 54 MHz operation in thermally constrained industrial enclosures housing R5F52306AGFM#10.

Does the R5F52306AGFM#10 include hardware encryption and safety features?

Yes, the R5F52306AGFM#10 integrates TSIP-Lite-a hardware security module supporting AES-128/256 in ECB, CBC, GCM, and CMAC modes, plus a true random number generator. It also provides IEC60730-compliant safety assist functions for ADC self-diagnosis, clock accuracy measurement (CAC), independent watchdog timer (IWDT), and RAM testing-enabling R5F52306AGFM#10 to meet Class B functional safety requirements with minimal external components.