Renesas R5F52306AGFP#10

Overview

R5F52306AGFP#10 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 54 MHz (88.56 DMIPS), featuring 256 KB on-chip flash, 32 KB SRAM, 8 KB data flash, and integrated FPU compliant with IEEE 754 single-precision floating-point standard. It supports USB 2.0 full-speed host/function/OTG, CAN, 24-channel 12-bit A/D converter (0.83 µs conversion), dual 12-bit D/A outputs, capacitive touch sensing (24 keys), RTC, and TSIP-Lite encryption engine - deployed in industrial HMI and smart sensor edge nodes.

For engineers reviewing the R5F52306AGFP#10 datasheet, R5F52306AGFP#10 pinout, R5F52306AGFP#10 application, or R5F52306AGFP#10 equivalent, key selection criteria include its 100-pin LFQFP package (14 × 14 mm, 0.5 mm pitch), −40 to +105°C extended temperature grade, absence of SDHI and CAN modules (per Table 1.4), and compatibility with RX230 Group toolchains and debug interfaces including FINE.

Technical Context

The R5F52306AGFP#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates memory protection unit (MPU), on-chip debugging circuit, and three low-power modes (sleep, deep sleep, software standby) with LPT operation during standby.

Clock subsystem includes main oscillator (1–20 MHz), sub-clock (32.768 kHz), PLL (4–12.5 MHz input), USB-dedicated PLL (4/6/8/12 MHz), and IWDT-dedicated low-speed oscillator. Peripheral clock domains are independently configurable: ICLK (54 MHz max), PCLKA (54 MHz), PCLKD (54 MHz for A/D), and PCLKB (32 MHz for most peripherals).

Key Specifications

Pinout & Package

Package: 100-pin LFQFP (PLQP0100KB-B), 14 × 14 mm body, 0.5 mm pitch, exposed pad (thermal pad not electrically connected). Pinout conforms to RX230 Group standard layout with dedicated VCC/VSS pairs per power domain, separate analog/digital supplies (AVCC0/AVSS0), and multiplexed peripheral functions controlled via MPC.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F52316AGFP#30, R5F52306AGFP#10 reduces flash/SRAM capacity and omits SDHI/CAN while retaining full USB, touch, A/D, and encryption capability - making it ideal for compact, USB-centric edge devices. Against R5F52305AGFP#30, it adds 128 KB flash and 8 KB data flash for robust firmware versioning and field parameter storage.

Availability

R5F52306AGFP#10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, USB-capable test instruments, and motor control reference designs requiring stable component supply across extended temperature and long production lifecycles.

Supply support for R5F52306AGFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX230 Group - to which R5F52306AGFP#10 belongs - was designed for cost-optimized, high-integration industrial and consumer edge applications requiring USB connectivity, capacitive touch, precision analog, and functional safety support.

FAQ

What is the maximum operating frequency and CPU performance of the R5F52306AGFP#10?

The R5F52306AGFP#10 operates at a maximum system clock frequency of 54 MHz, delivering 88.56 DMIPS performance using the 32-bit RXv2 CPU core. Its 5-stage pipeline, variable-length instruction set, and on-chip FPU enable efficient real-time computation for industrial control and signal processing tasks within the R5F52306AGFP#10.

Does the R5F52306AGFP#10 include CAN or SD host interface functionality?

No, the R5F52306AGFP#10 does not include CAN or SD host interface (SDHI) modules. This is confirmed in Table 1.4 of the datasheet, which lists "Not available" for both SDHI and CAN under the R5F52306AGFP#10 entry. These peripherals are present only in higher-tier RX231 Group variants like R5F52316AGFP#30.

What are the memory resources available on the R5F52306AGFP#10?

The R5F52306AGFP#10 integrates 256 KB of on-chip flash memory (with no-wait access up to 32 MHz), 32 KB of SRAM (no-wait at 54 MHz), and 8 KB of data flash rated for 1,000,000 program/erase cycles. The data flash supports background operation (BGO), allowing concurrent firmware execution and nonvolatile parameter storage in the R5F52306AGFP#10.

Which package type and pin count does the R5F52306AGFP#10 use?

The R5F52306AGFP#10 uses a 100-pin LFQFP package designated PLQP0100KB-B, with 14 × 14 mm body size and 0.5 mm pin pitch. This package provides full I/O availability for the RX230 Group feature set, including dedicated USB, A/D, D/A, and touch-sensing pins, and is compatible with standard reflow assembly processes for the R5F52306AGFP#10.

What security and safety features does the R5F52306AGFP#10 support?

The R5F52306AGFP#10 includes TSIP-Lite for AES-128/256 encryption (GCM/ECB/CBC), true random number generation, and key protection. For functional safety, it supports IEC 60730 compliance via RAM test assistance (DOC), A/D self-diagnostic, clock accuracy measurement (CAC), and IWDT disconnection detection - all integral to the R5F52306AGFP#10's design.