Renesas R5F52315AGFP#30

Overview

R5F52315AGFP#30 from Renesas is a 32-bit RXv2 core MCU operating at up to 54 MHz (88.56 DMIPS), featuring 128 KB on-chip flash, 32 KB SRAM, 8 KB data flash, IEEE 754-compliant FPU, and integrated USB 2.0 full-speed host/function/OTG, CAN, SD host interface, capacitive touch sensing unit (24 channels), 12-bit A/D (24 ch), 12-bit D/A (2 ch), RTC, and TSIP-Lite encryption engine. It targets industrial HMI and smart sensor nodes requiring secure, low-power, mixed-signal control with rich connectivity.

For engineers reviewing the R5F52315AGFP#30 datasheet, R5F52315AGFP#30 pinout, R5F52315AGFP#30 application, or R5F52315AGFP#30 equivalent, this device delivers verified 54-MHz real-time performance, hardware-accelerated AES-128/256, USB-CAN coexistence in a 100-pin LFQFP package, and IEC60730-ready self-test functions for safety-critical embedded designs.

Technical Context

The R5F52315AGFP#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and single-cycle instruction execution at 54 MHz. Its memory subsystem includes 128 KB flash (no-wait access ≤32 MHz, wait-state managed ≥32 MHz), 32 KB SRAM (no-wait at 54 MHz), and 8 KB data flash rated for 1M program/erase cycles with background operation (BGO).

Peripherals are orchestrated via the Event Link Controller (ELC), enabling interrupt-free module triggering and linked operation during CPU sleep. Clocking supports multiple sources: main oscillator (1–20 MHz), sub-clock (32.768 kHz), on-chip high-/low-speed oscillators, PLL (4–12.5 MHz input), and USB-dedicated PLL-allowing independent 54-MHz system clock and 48-MHz USB clock generation.

Key Specifications

Pinout & Package

Package: PLQP0100KB-B - 100-pin Low-Profile Quad Flat Package, 14 mm × 14 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52315AGFP#30, the R5F52315ADFP#30 offers identical functionality at lower cost for non-extended-temp use, while R5F52316AGFP#30 provides scalable flash headroom without changing PCB layout or thermal design.

Availability

R5F52315AGFP#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, USB-capable test instruments, and secure industrial gateways requiring stable component supply across long production lifecycles.

Supply support for R5F52315AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group-including R5F52315AGFP#30-is designed for high-integrity industrial applications demanding real-time performance, functional safety support (IEC60730), and integrated security (TSIP-Lite), with emphasis on human-machine interaction and edge intelligence.

FAQ

What is the maximum operating frequency and CPU performance of the R5F52315AGFP#30?

The R5F52315AGFP#30 operates at a maximum system clock frequency of 54 MHz, delivering 88.56 DMIPS of processing performance using the RXv2 32-bit CPU core. Its Harvard architecture with 5-stage pipeline and variable-length instruction set enables deterministic real-time execution, making it suitable for time-critical tasks such as motor control loops and USB isochronous transfers. The R5F52315AGFP#30 achieves this performance while maintaining low power consumption through dynamic operating mode control.

Does the R5F52315AGFP#30 support USB 2.0 host, device, and OTG functionality?

Yes, the R5F52315AGFP#30 integrates a full-featured USB 2.0 host/function module compliant with USB 2.0 specification, supporting full-speed (12 Mbps) and low-speed (1.5 Mbps) modes, isochronous transfer, and Battery Charging Specification 1.2 (BC1.2). It also supports On-The-Go (OTG) operation, allowing dynamic role switching between host and device. The R5F52315AGFP#30 includes an internal USB power supply, eliminating the need for external VCC_USB regulation when VCC is 4.0–5.5 V.

What security features does the R5F52315AGFP#30 include for firmware protection?

The R5F52315AGFP#30 incorporates TSIP-Lite (Trusted Secure IP Lite), a hardware encryption engine supporting AES-128 and AES-256 in ECB, CBC, GCM, CMAC, XTS, CTR, and GCTR modes, along with SHA-256 hash and a true random number generator. Key access is strictly controlled via an access management circuit to prevent unauthorized readout or tampering. These features enable secure boot, encrypted firmware updates, and protected communication-critical for meeting IEC60730 Class B requirements. The R5F52315AGFP#30 implements these without software overhead.

How many analog-to-digital and digital-to-analog channels does the R5F52315AGFP#30 provide?

The R5F52315AGFP#30 integrates a 12-bit S12ADE analog-to-digital converter with 24 input channels and a minimum conversion time of 0.83 µs at 54 MHz ADCLK, plus two 12-bit R12DAA digital-to-analog converter channels with output voltage range of 0.4 V to AVCC0 − 0.5 V. Each ADC channel supports individually configurable sampling time and disconnection detection, while the DACs support simultaneous or independent updates. These capabilities make the R5F52315AGFP#30 well-suited for closed-loop control and sensor signal conditioning.

What is the operating temperature range and package type of the R5F52315AGFP#30?

The R5F52315AGFP#30 is a G-version device rated for operation from −40°C to +105°C, qualified for extended industrial and under-hood automotive environments. It is packaged in a 100-pin LFQFP (PLQP0100KB-B) with 14 mm × 14 mm body size, 0.5 mm lead pitch, and exposed thermal pad for enhanced heat dissipation. This package supports standard reflow soldering and provides mechanical robustness for high-vibration applications. The R5F52315AGFP#30's thermal rating and footprint ensure drop-in compatibility with other RX231 Group devices in the same package family.