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Renesas R5F52316AGFP#30
- Part No.:
- R5F52316AGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F52316AGFP#30.pdf
- Description:
- IC MCU 32BIT 256KB FLSH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:339
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Product details
Overview
R5F52316AGFP#30 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 256 KB on-chip flash, 32 KB SRAM, and 8 KB data flash. It integrates a single-precision IEEE 754 FPU, 12-bit 24-channel ADC (0.83 µs conversion), dual 12-bit DACs, USB 2.0 full-speed host/function/OTG, CAN, capacitive touch sensing (24 keys), and TSIP-Lite encryption. It targets industrial HMI and sensor gateway applications requiring real-time control, secure communication, and low-power operation across −40 to +105°C.
For engineers reviewing the R5F52316AGFP#30 datasheet, R5F52316AGFP#30 pinout, R5F52316AGFP#30 application, or R5F52316AGFP#30 equivalent, this MCU delivers verified 54 MHz deterministic execution, hardware-accelerated AES-128/256 via TSIP-Lite, integrated CAN and USB PHY, and validated RTC+LPT support for battery-backed timing in embedded systems.
Technical Context
The R5F52316AGFP#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling 88.56 DMIPS at 54 MHz. It includes an on-chip FPU compliant to IEEE 754 and a 32-bit × 32-bit multiplier with 2-cycle divider.
Its peripheral set centers on event-driven operation: the Event Link Controller (ELC) enables 61 event sources to trigger module actions-including A/D conversion starts and timer outputs-without CPU intervention, while the Data Transfer Controller (DTC) supports chain transfers for low-latency data movement between memory and peripherals like USB, SDHI, or RSPI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 54 MHz max, 88.56 DMIPS, IEEE 754 FPU, MPU, fast interrupt |
| Memory | 256 KB flash (no-wait ≤32 MHz), 32 KB SRAM (no-wait @54 MHz), 8 KB data flash (1M erase cycles) |
| Analog Peripherals | 12-bit S12ADE ADC (24 channels, 0.83 µs min conversion), dual 12-bit R12DAA DACs (0.4–AVCC0−0.5 V output) |
| Communication | USB 2.0 full-speed host/function/OTG (12 Mbps), CAN (ISO 11898-1, 1 Mbps), 7× SCI, 1× RIIC, 1× RSPI, 1× SSI, 1× SDHI |
| Security & Timing | TSIP-Lite AES-128/256 (GCM/ECB/CBC), true RNG, RTC with calendar mode, LPT running in software standby |
| Package & Environment | 100-pin LFQFP (PLQP0100KB-B), 14 × 14 mm, 0.5 mm pitch, −40 to +105°C operating range |
Pinout & Package
100-pin Low-Profile Quad Flat Package (LFQFP), PLQP0100KB-B, 14 × 14 mm body, 0.5 mm pitch, exposed thermal pad (non-electrical), RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply / Ground | Dual 1.8–5.5 V supply domains; separate analog/digital ground pins reduce noise coupling in mixed-signal operation |
| XTAL, EXTAL | Main clock oscillator input/output | Supports 1–20 MHz crystal; enables precise system clock generation and PLL reference for USB/RTC synchronization |
| USB_VBUS, USB_DP, USB_DM | USB transceiver interface | Dedicated pins with internal pull-up/down; enable full-speed USB device/host operation without external PHY |
| TXD0, RXD0 | SCI0 asynchronous serial I/O | Hardware UART channel for debug console or host communication; supports bit-rate modulation for robust noise immunity |
| CTX0–CTX23 | Capacitive touch sensing inputs | 24 dedicated CTSU channels; support self-capacitance (24 keys) or mutual-capacitance matrix (up to 144 keys) with built-in digital filtering |
| AD00–AD23 | 12-bit A/D converter inputs | 24 analog input channels with per-channel sampling time configuration; support triggered conversion via ELC, MTU, or TPU |
| DA0, DA1 | 12-bit D/A converter outputs | Two independent voltage-output DACs; used for analog waveform generation, sensor calibration offset, or feedback control signals |
| CLKOUT | Programmable clock output | Outputs selected internal clock (e.g., PCLK, ICLK, sub-clock) for external timing validation or synchronizing auxiliary ICs |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Direct hardware routing of 61 event signals (e.g., timer overflow, GPIO edge) to 21 peripheral modules-eliminates CPU polling and ISR latency for time-critical triggers |
| TSIP-Lite Encryption Engine | Hardware-accelerated AES-128/256 (GCM/ECB/CBC), CMAC, XTS, true RNG, and key protection-meets IEC 60730 Class B security requirements for firmware integrity |
| Low-Power Timer (LPT) | 16-bit counter driven by sub-clock or IWDT oscillator; operates during software standby mode to maintain wake-up scheduling without waking CPU |
| Capacitive Touch Sensing Unit (CTSU) | Self- and mutual-capacitance modes with built-in noise cancellation; supports up to 24 keys in self-cap mode with no external components required |
| USB 2.0 Full-Speed Host/Function/OTG | Integrated USB PHY and controller supporting BC1.2 battery charging detection, isochronous transfers, and internal VCC_USB power regulation-reduces BOM count and layout complexity |
Applications
| Industrial HMI Panel | Smart Sensor Gateway |
|---|---|
Use Scenario: Touch-enabled local operator interface for PLC-controlled machinery with real-time status display and parameter adjustment. IC Role / Device Role / Timing Role: Main application processor executing GUI logic, managing capacitive touch input, driving display interface via SPI/SSI, and handling USB/SDHI for firmware updates. Use Value: Integrated CTSU eliminates external touch controller; TSIP-Lite secures firmware updates over USB; 54 MHz RXv2 core ensures responsive UI rendering with minimal latency. | Use Scenario: Edge node aggregating temperature, pressure, and vibration data from multiple field sensors, then transmitting via CAN bus to central SCADA system. IC Role / Device Role / Timing Role: Central data acquisition and protocol translation unit-sampling analog sensors via 24-channel ADC, buffering data in SRAM, and formatting CAN messages with timestamp from RTC. Use Value: Simultaneous 24-channel ADC scanning at 0.83 µs/channel enables high-fidelity multi-sensor capture; CAN module with 16 message boxes supports prioritized alarm messaging; LPT maintains accurate time stamping during low-power sleep intervals. |
| Secure IoT Endpoint | USB-C Powered Industrial Tool |
Use Scenario: Battery-powered handheld diagnostic tool that connects to legacy equipment via CAN and uploads logs to cloud via USB-C host mode. IC Role / Device Role / Timing Role: Secure boot loader and runtime authentication engine using TSIP-Lite; manages CAN communication, USB host enumeration, and encrypted log storage in data flash. Use Value: AES-GCM encryption protects firmware and logs; 8 KB data flash with 1M program/erase cycles enables reliable long-term logging; USB OTG allows dual-role connectivity without external switch ICs. | Use Scenario: Portable test instrument powered directly from USB-C port, performing analog signal generation (DAC), measurement (ADC), and real-time analysis. IC Role / Device Role / Timing Role: Mixed-signal controller generating calibrated waveforms via dual 12-bit DACs, acquiring signals via 24-channel ADC, and synchronizing all operations using ELC-triggered DMA transfers. Use Value: Dual DACs provide precise analog stimulus; ELC-linked ADC-to-DMA path ensures zero-CPU overhead data capture; internal USB power regulation allows direct VBUS powering without discrete LDO. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F52316ADFP#30 | Same RX231 Group, identical peripherals and pinout, but rated for −40 to +85°C (D version) and lacks TSIP-Lite security features | Not suitable for applications requiring cryptographic acceleration or extended temperature operation | Select R5F52316ADFP#30 only if security and 105°C operation are unnecessary and cost optimization is critical |
| R5F52318AGFP#30 | Higher memory variant: 512 KB flash, 64 KB RAM, same package and temperature grade; adds SDHI interface not present in R5F52316AGFP#30 | Required when local SD card logging, firmware storage, or multimedia buffer space exceeds 256 KB flash capacity | Choose R5F52318AGFP#30 when SD host interface or larger code/data footprint is needed-pin-compatible upgrade path |
Compared with R5F52316ADFP#30, the R5F52316AGFP#30 adds TSIP-Lite and extended temperature support; compared with R5F52318AGFP#30, it trades SDHI and memory headroom for lower cost and smaller BOM footprint-making it optimal for secure, thermally demanding, but storage-light industrial endpoints.
Availability
R5F52316AGFP#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor gateways, secure IoT endpoints, and USB-C powered test instruments requiring stable component supply across extended temperature ranges.
Supply support for R5F52316AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX231 Group-of which R5F52316AGFP#30 is a member-is designed for high-integrity industrial applications demanding real-time performance, functional safety support (IEC 60730), secure firmware execution, and rich analog/mixed-signal integration in compact packages.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F52316AGFP#30?
The R5F52316AGFP#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 54 MHz, delivering 88.56 DMIPS. Its architecture includes a 5-stage pipeline, variable-length instructions, on-chip FPU compliant to IEEE 754, and memory protection unit (MPU). This enables deterministic real-time execution for industrial control tasks while supporting floating-point math for sensor signal processing within the R5F52316AGFP#30.
Does the R5F52316AGFP#30 include hardware encryption capabilities?
Yes, the R5F52316AGFP#30 integrates TSIP-Lite-a trusted secure IP module supporting AES-128/256 in GCM, ECB, CBC, CMAC, and XTS modes, plus a true random number generator and secure key management. These features meet IEC 60730 Class B requirements and enable secure firmware updates, encrypted data logging, and authenticated communication-all implemented in hardware without CPU overhead in the R5F52316AGFP#30.
What communication interfaces are supported by the R5F52316AGFP#30?
The R5F52316AGFP#30 supports USB 2.0 full-speed host/function/OTG (12 Mbps), CAN (ISO 11898-1, up to 1 Mbps), seven SCI channels, one I²C (RIIC), one RSPI, one Serial Sound Interface (SSI), and one SD Host Interface (SDHI). It also includes IrDA support via SCI5 and optional LIN via SCIh. All interfaces are fully integrated with DMA and ELC support to minimize CPU load during high-throughput communication in the R5F52316AGFP#30.
How many analog-to-digital and digital-to-analog converter channels does the R5F52316AGFP#30 have?
The R5F52316AGFP#30 includes a 12-bit S12ADE analog-to-digital converter with 24 input channels and a minimum conversion time of 0.83 µs at 54 MHz ADCLK. It also features two independent 12-bit R12DAA digital-to-analog converters with output voltage range of 0.4 V to AVCC0 − 0.5 V. These analog resources are accessible via ELC-triggered start and support self-diagnostic functions-critical for certified industrial use of the R5F52316AGFP#30.
What is the operating temperature range and package type of the R5F52316AGFP#30?
The R5F52316AGFP#30 is qualified for operation from −40 to +105°C (G version) and housed in a 100-pin LFQFP package (PLQP0100KB-B), measuring 14 × 14 mm with 0.5 mm pitch. This package includes an exposed thermal pad for enhanced heat dissipation and supports standard reflow soldering processes-making the R5F52316AGFP#30 suitable for thermally demanding industrial environments without derating.
R5F52316AGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX231
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SCI, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F52316AGFP#30 FAQ
1.How can I place an order for R5F52316AGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F52316AGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F52316AGFP#30 reliable?
The price and inventory of R5F52316AGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52316AGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F52316AGFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52316AGFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F52316AGFP#30?
R5F52316AGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F52316AGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F52316AGFP#30?
For technical support, including R5F52316AGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52316AGFP#30 requirements.
6.How does Aetrix verify that R5F52316AGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F52316AGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52316AGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F52316AGFP#30?
All R5F52316AGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52316AGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F52316AGFP#30 part is unused and in its original packaging.
Return procedure for R5F52316AGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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