Renesas R5F52316CGFL#30
- Part No.:
- R5F52316CGFL#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
R5F52316CGFL#30.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 48LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F52316CGFL#30 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 54 MHz (88.56 DMIPS), featuring 256 KB on-chip flash, 32 KB SRAM, 8 KB data flash, integrated FPU (IEEE 754 single-precision), and hardware encryption (TSIP-Lite AES-128/256). It supports USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 24-channel 12-bit ADC (0.83 µs conversion), dual 12-bit DAC, RTC with battery backup, and capacitive touch sensing (24 keys) - deployed in industrial HMI and smart sensor edge nodes.
For engineers reviewing the R5F52316CGFL#30 datasheet, R5F52316CGFL#30 pinout, R5F52316CGFL#30 application, or R5F52316CGFL#30 equivalent, key selection considerations include its 48-pin LFQFP package (7 × 7 mm, 0.5 mm pitch), −40 to +105°C G-grade temperature rating, absence of SDHI and CAN modules (per Table 1.4), and support for ELC-triggered peripheral coordination without CPU wake-up.
Technical Context
The R5F52316CGFL#30 belongs to the RX231 Group G-version (−40 to +105°C), implementing the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU. It executes at 54 MHz using a PLL-driven system clock (ICLK), while peripheral clocks (PCLKA/B/D) are independently configurable up to 54 MHz, 32 MHz, and 54 MHz respectively - enabling precise timing isolation for ADC, timers, and USB.
Its low-power design includes three modes (sleep, deep sleep, software standby), a sub-clock-driven LPT timer active during standby, and voltage detection circuits (LVD0–LVD2) with programmable thresholds. The ELC enables direct event routing between 61 signal sources and peripherals (e.g., TPU→ADC trigger), eliminating interrupt latency and CPU involvement in time-critical sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 54 MHz max, 88.56 DMIPS, IEEE 754 FPU, MPU, 167-interrupt vector table |
| Memory | 256 KB flash (no-wait ≤32 MHz), 32 KB SRAM (no-wait @54 MHz), 8 KB data flash (1M erase cycles) |
| Analog Peripherals | 24-channel 12-bit S12ADE ADC (0.83 µs min conversion), 2-channel 12-bit R12DAA DAC, 2× CMPB comparators |
| Communication | USB 2.0 FS host/function/OTG (12 Mbps), 6× SCI (async/sync/smart card), 1× RIIC (400 kbps), 1× RSPI (16 Mbps), 1× SSI |
| Timers & Control | 6× TPU (input capture/PWM), 6× MTU2 (complementary PWM/phase counting), 4× CMT, IWDT, RTC, LPT, ELC |
| Security & Sensing | TSIP-Lite AES-128/256 (GCM/ECB/CBC), true RNG, TEMPSA temperature sensor, CTSU (24-key self-capacitance) |
| Package & Environment | 48-pin LFQFP (PLQP0048KB-B), 7 × 7 mm, 0.5 mm pitch, −40 to +105°C (G-grade), 1.8–5.5 V supply |
Pinout & Package
Package: 48-pin LFQFP (PLQP0048KB-B), 7 × 7 mm body, 0.5 mm pitch, exposed pad (thermal pad not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual VCC pins (pins 1, 48) and four VSS pins (pins 2, 3, 47, 46) ensure stable core/peripheral rail decoupling |
| XTAL, EXTAL | Main clock oscillator interface | Accepts 1–20 MHz crystal; enables high-accuracy system clock generation via on-chip PLL |
| RTC_VCC, RTC_VSS | Battery-backed RTC power domain | Enables calendar/timekeeping during main power loss using external coin cell (VBATT path) |
| USB_DP, USB_DM | USB 2.0 differential data lines | Full-speed (12 Mbps) transceiver with internal termination; supports host/function/OTG without external PHY |
| TXD0, RXD0 | SCI0 asynchronous serial interface | Hardware UART for debug console or host communication; supports bit-rate modulation and MSB/LSB-first transfer |
| AD00–AD23 | Analog input channels | 24 dedicated pins for S12ADE ADC; each supports programmable sampling time and disconnection detection |
| DA0, DA1 | Digital-to-analog outputs | Two buffered 12-bit DAC outputs (R12DAA), voltage range 0.4 V to AVCC0 − 0.5 V |
| CTSU00–CTSU23 | Capacitive touch sensing inputs | 24 pins configurable for self-capacitance mode; supports up to 24 independent touch keys with noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | IEEE 754-compliant 32-bit single-precision arithmetic accelerates motor control and sensor fusion algorithms |
| Event Link Controller (ELC) | Direct hardware routing of 61 event signals (e.g., TPU overflow → ADC start) eliminates CPU polling and ISR overhead |
| TSIP-Lite security engine | AES-128/256 encryption with GCM mode and true RNG enables secure firmware updates and key storage in resource-constrained edge devices |
| Low-power timer (LPT) | 16-bit counter running on sub-clock (32.768 kHz) during software standby enables periodic wake-up without full CPU activation |
| Capacitive touch sensing unit (CTSU) | Self-capacitance mode with automatic noise cancellation supports robust touch UI on metal-front panels or noisy industrial enclosures |
| Independent watchdog timer (IWDT) | Dedicated 15-kHz on-chip oscillator ensures reliable timeout operation even if main clock fails - critical for IEC 60730 Class B compliance |
Applications
| Industrial HMI Panel | Smart Sensor Node |
|---|---|
|
Use Scenario: Touch-enabled local operator interface for PLC-controlled machinery with real-time status display and alarm logging. IC Role / Device Role / Timing Role: Main controller executing GUI rendering, touch response, USB-based configuration upload, and CAN-free serial fieldbus bridging via SCI. Use Value: Integrated CTSU eliminates external touch controller; 54 MHz RXv2 core handles multitasking without external RAM; G-grade temp rating ensures reliability in factory-floor cabinets. |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data, then transmitting via USB or SCI to gateway. IC Role / Device Role / Timing Role: System-on-chip sensor aggregator with ADC sampling, temperature compensation (via TEMPSA), low-power scheduling (LPT), and encrypted data packaging (TSIP-Lite). Use Value: 8 KB data flash enables long-term logging; software standby + LPT extends battery life; 12-bit ADC resolution captures subtle analog trends without external signal conditioning. |
| USB-Capable Test Fixture | Secure Firmware Update Module |
|
Use Scenario: Production-line functional tester that configures DUTs via USB, reads analog test points, and validates timing margins. IC Role / Device Role / Timing Role: USB device emulating CDC ACM for PC host communication, driving precision ADC sampling synchronized to USB SOF events via ELC. Use Value: USB 2.0 full-speed OTG allows both host (for flash programming) and device (for PC comms) roles; 0.83 µs ADC conversion enables high-throughput parametric testing. |
Use Scenario: Embedded bootloader module validating and installing signed firmware images over SCI or USB before application launch. IC Role / Device Role / Timing Role: Secure root-of-trust executor verifying AES-GCM authenticated firmware using TSIP-Lite, then writing to protected flash sectors. Use Value: Hardware-accelerated crypto prevents side-channel attacks; MPU enforces memory isolation between bootloader and application; no external secure element required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F52316ADFL#30 | D-grade (−40 to +85°C); identical flash/RAM/feature set but lower temperature rating | Suitable for commercial indoor equipment where extended thermal range is unnecessary | Select R5F52316ADFL#30 when ambient operating temperature remains below +85°C and cost optimization is prioritized |
| R5F52317CDLA#20 | TFLGA package (5.5 × 5.5 mm); 384 KB flash, same G-grade, no SDHI/CAN, 100-pin | Enables higher code density and smaller PCB footprint but requires re-layout for 100-pin TFLGA | Choose R5F52317CDLA#20 when board space is constrained and additional flash is needed for OTA update staging |
Compared with R5F52316CGFL#30, the D-grade R5F52316ADFL#30 reduces thermal margin at no feature cost, while R5F52317CDLA#20 trades pin count and package size for increased flash - neither offers pin compatibility, requiring layout revision for migration.
Availability
R5F52316CGFL#30 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, USB test fixtures, and secure bootloader modules requiring stable component supply across extended temperature ranges.
Supply support for R5F52316CGFL#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX231 Group - including R5F52316CGFL#30 - was designed for cost-sensitive, thermally demanding industrial and consumer edge devices requiring USB connectivity, analog integration, and hardware security without external components.
FAQ
What is the maximum operating frequency and CPU performance of the R5F52316CGFL#30?
The R5F52316CGFL#30 operates at a maximum frequency of 54 MHz using its RXv2 core, delivering 88.56 DMIPS. Its performance includes single-cycle instruction execution, 32-bit multiply-accumulate, and IEEE 754-compliant floating-point operations - enabling real-time control and signal processing in compact industrial systems. This performance level is sustained across its full −40 to +105°C operating range.
Does the R5F52316CGFL#30 include CAN or SD host interface functionality?
No, the R5F52316CGFL#30 does not include CAN or SD host interface (SDHI) modules. As confirmed in Table 1.4 of the datasheet, this G-grade 48-pin variant omits both RSCAN and SDHI peripherals. Engineers requiring CAN must select an RX230 Group part (e.g., R5F52306ADFP#30) or higher-pin-count RX231 variants like R5F52318AGFP#30.
What package type and pin count does the R5F52316CGFL#30 use?
The R5F52316CGFL#30 uses a 48-pin LFQFP package designated PLQP0048KB-B, measuring 7 × 7 mm with 0.5 mm pitch. It features an exposed thermal pad (non-electrical), four ground pins, dual VCC pins, and dedicated RTC power rails - optimized for thermal dissipation and noise isolation in dense industrial PCB layouts.
How does the Event Link Controller (ELC) enhance real-time responsiveness in the R5F52316CGFL#30?
The ELC in the R5F52316CGFL#30 enables direct hardware-level triggering between 61 event sources and peripherals - for example, a TPU timer overflow can initiate an ADC conversion without CPU intervention or interrupt latency. This reduces jitter, lowers power consumption by avoiding wake-ups, and simplifies deterministic timing in motor control or sensor sampling loops.
Is hardware encryption supported on the R5F52316CGFL#30, and what algorithms are available?
Yes, the R5F52316CGFL#30 integrates TSIP-Lite, providing hardware-accelerated AES-128 and AES-256 encryption in ECB, CBC, GCM, CMAC, XTS, CTR, and GCTR modes. It also includes a true random number generator and secure key management - enabling secure boot, firmware authentication, and encrypted data storage without software-only crypto overhead.
R5F52316CGFL#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-LQFP
- Series:
- RX231
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 54MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, SSI, USB OTG
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 30
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F52316CGFL#30 FAQ
1.How can I place an order for R5F52316CGFL#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F52316CGFL#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F52316CGFL#30 reliable?
The price and inventory of R5F52316CGFL#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52316CGFL#30 is usually 5 days.
3.What payment methods are accepted for R5F52316CGFL#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52316CGFL#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F52316CGFL#30?
R5F52316CGFL#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F52316CGFL#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F52316CGFL#30?
For technical support, including R5F52316CGFL#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52316CGFL#30 requirements.
6.How does Aetrix verify that R5F52316CGFL#30 is sourced from the original manufacturer or authorized distributors?
All R5F52316CGFL#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52316CGFL#30 meets industry standards.
7.What is the process for return or replacement of R5F52316CGFL#30?
All R5F52316CGFL#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52316CGFL#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F52316CGFL#30 part is unused and in its original packaging.
Return procedure for R5F52316CGFL#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F52316CGFL#30 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

