Renesas R5F52317ADND#00

Overview

R5F52317ADND#00 from Renesas is a 32-bit RXv2 core MCU operating at up to 54 MHz (88.56 DMIPS), featuring 384 KB on-chip flash, 32 KB SRAM, 8 KB data flash, integrated FPU (IEEE 754 single-precision), and hardware encryption (TSIP-Lite AES-128/256). It supports USB 2.0 full-speed host/function/OTG, CAN, SD host interface, 24-channel 12-bit A/D, dual 12-bit D/A, capacitive touch sensing (24 keys), RTC, and operates from 1.8–5.5 V across −40 to +85°C in industrial control and HMI applications.

For engineers reviewing the R5F52317ADND#00 datasheet, R5F52317ADND#00 pinout, R5F52317ADND#00 application, or R5F52317ADND#00 equivalent, this page delivers verified specifications, package mapping (PWQN0064KC-A, 64-pin HWQFN, 9 × 9 mm), validated peripheral integration (USB/CAN/SDHI), real-world use cases, and two confirmed alternative parts with documented functional and packaging differences.

Technical Context

The R5F52317ADND#00 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code and deterministic interrupt latency. It integrates an on-chip FPU compliant with IEEE 754 and a dedicated TSIP-Lite encryption engine supporting AES-GCM, CBC, and true random number generation.

Its clock system includes main (1–20 MHz), sub-clock (32.768 kHz), and multiple PLLs-including a USB-dedicated PLL generating 48 MHz for USB operation while sustaining 54 MHz system clock. Peripheral synchronization is segmented: ICLK (54 MHz), PCLKA (54 MHz for MTU2a), PCLKD (54 MHz for A/D), and PCLKB (32 MHz for most modules).

Key Specifications

Pinout & Package

PWQN0064KC-A is a 64-pin heat-sink exposed pad HWQFN package (9 × 9 mm, 0.5 mm pitch) with VSS/VDD power planes distributed across perimeter pins and thermal pad grounded for thermal management. Pin functions are defined per Renesas R01DS0261EJ0120 Rev.1.20, Table 1.2 and Figure 1.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F52317ADND#00, R5F52318ADND#U0 provides scalable memory headroom without changing layout or drivers, while R5F52317BDND#U0 delivers certified security functionality-making both viable alternatives depending on firmware size or compliance requirements, not drop-in replacements.

Availability

R5F52317ADND#00 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy meters, factory automation gateways, and medical device interfaces requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for R5F52317ADND#00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX231 Group-containing R5F52317ADND#00-is engineered for cost-sensitive industrial and consumer applications demanding real-time performance, mixed-signal integration, and functional safety support without premium pricing.

FAQ

What is the maximum operating frequency and CPU performance of the R5F52317ADND#00?

The R5F52317ADND#00 operates at a maximum system clock frequency of 54 MHz, delivering 88.56 DMIPS. Its RXv2 core supports single-cycle instruction execution, hardware floating-point (IEEE 754), and DSP instructions-including 32-bit MAC and 16-bit multiply-subtract-enabling deterministic real-time control in motor drives and sensor processing applications where R5F52317ADND#00 is deployed.

Does the R5F52317ADND#00 support USB device, host, and OTG functionality?

Yes, the R5F52317ADND#00 integrates a full-featured USB 2.0 module supporting host, function, and On-The-Go (OTG) modes at full-speed (12 Mbps) and low-speed (1.5 Mbps), including isochronous transfers and BC1.2 battery charging detection. The internal USB regulator allows operation without external VCC_USB when VCC is 4.0–5.5 V-confirmed in R01DS0261EJ0120 Rev.1.20 for R5F52317ADND#00.

What are the memory resources available on the R5F52317ADND#00?

The R5F52317ADND#00 includes 384 KB of on-chip flash memory (with no-wait access up to 32 MHz), 32 KB of SRAM (no-wait at 54 MHz), and 8 KB of data flash rated for 1,000,000 program/erase cycles. These resources are fixed for this part number per Table 1.3 in R01DS0261EJ0120 Rev.1.20-no configuration or option affects their capacity in R5F52317ADND#00.

Is the TSIP-Lite encryption engine enabled on the R5F52317ADND#00?

No-the R5F52317ADND#00 variant has TSIP-Lite security features disabled. To use AES-128/256, GCM, or true random number generation, select R5F52317BDND#U0, which enables TSIP-Lite in hardware. This distinction is explicitly defined in Table 1.3 of R01DS0261EJ0120 Rev.1.20 for R5F52317ADND#00 versus its 'B' counterpart.

Which package type does the R5F52317ADND#00 use, and what are its thermal characteristics?

The R5F52317ADND#00 uses the PWQN0064KC-A package: a 64-pin HWQFN with 9 × 9 mm body, 0.5 mm pitch, and exposed thermal pad. Per Renesas documentation, the thermal pad must be soldered to a PCB ground plane for effective heat dissipation-critical for sustained 54 MHz operation in enclosed industrial enclosures where R5F52317ADND#00 is commonly deployed.