Renesas R5F52317AGFM#50

Overview

R5F52317AGFM#50 from Renesas is a 32-bit RXv2 microcontroller with 384 KB on-chip flash, 32 KB SRAM, and 8 KB data flash, operating at up to 54 MHz (88.56 DMIPS) with integrated FPU, 24-channel 12-bit ADC, dual 12-bit DAC, USB 2.0 full-speed host/function/OTG, CAN, capacitive touch sensing unit, and TSIP-Lite encryption engine - deployed in industrial HMI, smart sensor nodes, and battery-powered control systems.

For engineers reviewing the R5F52317AGFM#50 datasheet, R5F52317AGFM#50 pinout, R5F52317AGFM#50 application, or R5F52317AGFM#50 equivalent, this page delivers verified technical context, package mapping to PLQP0064KB-C (10 × 10 mm, 0.5 mm pitch), confirmed peripheral set for 64-pin RX231 Group, and two validated alternative parts with documented functional and packaging differences.

Technical Context

The R5F52317AGFM#50 implements the RXv2 CPU core with IEEE 754-compliant 32-bit single-precision FPU, 32-bit × 32-bit multiplier, and 32-bit divider (2-cycle min), supporting little-endian or big-endian data arrangement and variable-length instructions. It integrates ELC for interrupt-free inter-module event linking and MPC for flexible I/O function assignment across multiple pins.

Its clock system includes main (1–20 MHz), sub (32.768 kHz), and on-chip oscillators, plus PLL and USB-dedicated PLL enabling simultaneous 54 MHz system clock and 48 MHz USB clock. Power management supports three low-power modes, RTC with battery backup, and LPT operation during software standby.

Key Specifications

Pinout & Package

Package: PLQP0064KB-C - 64-pin Low-Profile Quad Flat Package, 10 × 10 mm body, 0.5 mm pitch, exposed thermal pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit microcontroller applications.

Compared with R5F52317AGFM#50, R5F52317ADFM#30 offers identical package and peripherals but reduced temperature rating and no CAN, while R5F52318AGFM#30 provides more memory and SDHI at same footprint - enabling scalable design across product tiers without PCB revision.

Availability

R5F52317AGFM#50 is available at Aetrix Electronics and suitable for industrial HMI, smart sensor nodes, and motor control gateways requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.

Supply support for R5F52317AGFM#50 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX231 Group - including R5F52317AGFM#50 - is engineered for high-integrity embedded control in extended-temperature industrial environments, integrating security, analog precision, and real-time responsiveness in compact packages.

FAQ

What is the maximum operating frequency and CPU performance of the R5F52317AGFM#50?

The R5F52317AGFM#50 operates at a maximum frequency of 54 MHz and delivers 88.56 DMIPS performance using the RXv2 CPU core. Its 32-bit multiplier, 32-bit divider (2-cycle minimum), and IEEE 754-compliant FPU enable deterministic real-time computation for motor control, sensor fusion, and digital signal processing tasks without software emulation overhead. This performance level is sustained across its full −40 to +105°C operating range.

Does the R5F52317AGFM#50 include hardware encryption capabilities?

Yes, the R5F52317AGFM#50 integrates TSIP-Lite - a trusted secure IP module supporting AES-128/256 in ECB, CBC, GCM, and CMAC modes, along with a true random number generator and secure key management. It is designed to meet IEC 60730 Class B self-test requirements and provides hardware-accelerated cryptographic operations for secure boot, firmware authentication, and encrypted data storage without burdening the CPU.

What package type and pin count does the R5F52317AGFM#50 use?

The R5F52317AGFM#50 uses the PLQP0064KB-C package: a 64-pin Low-Profile Quad Flat Package with 10 × 10 mm body size, 0.5 mm pitch, and exposed thermal pad. This RoHS-compliant package is shared across the RX231 Group's 64-pin variants and supports standard reflow soldering processes. Pin compatibility is maintained with other RX231 parts in the same package family, such as R5F52317ADFM#30 and R5F52318AGFM#30.

Which communication interfaces are supported by the R5F52317AGFM#50?

The R5F52317AGFM#50 supports USB 2.0 full-speed host/function/OTG (with BC1.2), one CAN 2.0B channel (ISO 11898-1, up to 1 Mbps), seven SCI channels (including IrDA via SCI5), one I2C bus interface (up to 400 kbps), one RSPI (up to 16 Mbps), one serial sound interface, and one SD host interface. Notably, it omits the SDHI module found in higher-memory RX231 variants like R5F52318AGFM#30.

How does the R5F52317AGFM#50 handle analog signal acquisition and generation?

The R5F52317AGFM#50 integrates a 12-bit S12ADE analog-to-digital converter with 24 input channels and 0.83 μs minimum conversion time at 54 MHz ADCLK, plus two independent 12-bit R12DAA digital-to-analog converters. Sampling time is programmable per channel, and the ADC supports self-diagnostic and analog disconnection detection. The DACs deliver 0.4 V to AVCC0−0.5 V output range, enabling precise analog actuator control and reference voltage generation in closed-loop systems.