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Renesas R5F52317AGND#20

Part No.:
R5F52317AGND#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-WFQFN Exposed Pad
Datasheet:
AetrixR5F52317AGND#20.pdf
Description:
IC MCU 32BIT 384KB FLASH 64HWQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:520

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Product details

Overview

R5F52317AGND#20 from Renesas is a 32-bit RXv2 microcontroller with 54 MHz max operating frequency, 384 KB on-chip flash memory, 32 KB SRAM, and integrated 12-bit A/D converter (24 channels), 12-bit D/A converter (2 channels), USB 2.0 full-speed host/function/OTG, CAN interface, capacitive touch sensing unit (24 keys), and TSIP-Lite encryption engine. It operates across −40 to +105°C and targets industrial HMI, smart sensor nodes, and secure embedded control systems requiring real-time performance and functional safety support.

For engineers reviewing the R5F52317AGND#20 datasheet, R5F52317AGND#20 pinout, R5F52317AGND#20 application, or R5F52317AGND#20 equivalent, this page delivers verified technical context, package-specific peripheral availability, validated alternative options, and supply-ready procurement details - all grounded in Renesas' official RX231 Group documentation (R01DS0261EJ0120 Rev.1.20).

Technical Context

The R5F52317AGND#20 belongs to the RX231 Group and uses the RXv2 CPU core with IEEE 754-compliant 32-bit FPU, 88.56 DMIPS at 54 MHz, and memory protection unit (MPU). It supports dual-clock domains: ICLK up to 54 MHz for CPU/system, PCLKA up to 54 MHz for MTU2a, and PCLKD up to 54 MHz for S12AD A/D conversion.

This device implements event-driven architecture via the Event Link Controller (ELC), enabling timer-triggered A/D conversions and inter-module coordination without CPU intervention. Its low-power design includes software standby mode with active low-power timer (LPT) and RTC operation on sub-clock (32.768 kHz) or dedicated IWDT oscillator.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv2 32-bit CISC Harvard architecture with 5-stage pipeline, 88.56 DMIPS @ 54 MHz
Max Operating Frequency 54 MHz system clock (ICLK); enables real-time deterministic execution for industrial control loops
Memory 384 KB flash (code/data), 32 KB SRAM (no wait states), 8 KB data flash (1M erase/write cycles)
Analog Peripherals 24-channel 12-bit A/D converter (0.83 µs min conversion time), 2-channel 12-bit D/A, 2-unit analog comparator
Communication Interfaces USB 2.0 full-speed host/function/OTG, CAN 2.0B (1 Mbps), 6× SCI, 1× I²C, 1× RSPI, 1× SSI, 1× SDHI (4-bit SD bus)
Security & Safety TSIP-Lite AES-128/256 (GCM/CBC/ECB), true random number generator, IEC60730 self-diagnostic assistance functions
Operating Temperature −40 to +105°C (G version), qualified for extended industrial environments

Pinout & Package

Packaged in 64-pin HWQFN (PWQN0064KC-A), 9 × 9 mm, 0.5 mm pitch, with exposed thermal pad. Pinout conforms to RX231 Group 64-pin variant specification per Table 1.2 of R01DS0261EJ0120.

Pin/Terminal Circuit Role Design Meaning
VCC, VSS Power supply / Ground Core and I/O supply pins; supports 1.8–5.5 V operation with internal voltage regulation
XTAL, EXTAL Main clock oscillator input/output Accepts 1–20 MHz crystal; enables precise timing for USB, CAN, and real-time applications
RTCCLK, RTCOUT Real-time clock input/output Connects 32.768 kHz sub-clock crystal; provides calendar/timekeeping during software standby
USB_VBUS, USB_DP, USB_DM USB transceiver interface Full-speed USB 2.0 physical layer; VBUS detection enables OTG role switching and BC1.2 charging negotiation
TXD0, RXD0 SCI0 asynchronous serial interface Dedicated UART pins for debug console or host communication; supports bit-rate modulation for noise immunity
CTX0–CTX23 Capacitive touch sensing inputs Supports self-capacitance configuration for up to 24 independent touch keys without external components

Key Features

Feature Design Value
Floating-point unit (FPU) IEEE 754 single-precision compliant - accelerates motor control algorithms and sensor fusion math without software emulation
Event Link Controller (ELC) 61-event routing without CPU involvement - enables ultra-low-latency A/D trigger from timer or GPIO, reducing ISR overhead
Capacitive Touch Sensing Unit (CTSU) Self-capacitance mode with 24-channel support - eliminates external RC networks and simplifies front-panel HMI design
TSIP-Lite Encryption Engine AES-128/256 with GCM mode and key protection - secures firmware updates and wireless command authentication in edge devices
Low-power timer (LPT) 16-bit counter driven by sub-clock or IWDT oscillator - maintains timekeeping and wake-up scheduling during software standby mode

Applications

Industrial HMI Panel Smart Sensor Node

Use Scenario: Touch-enabled local control panel for PLC-connected machinery with real-time status display and parameter adjustment.

IC Role / Device Role / Timing Role: Main controller executing UI logic, managing capacitive touch input, driving SPI LCD, and communicating via CAN/USB to host.

Use Value: Integrated CTSU eliminates external touch controller IC; USB OTG enables field firmware updates via thumb drive; 54 MHz CPU ensures smooth graphics rendering.

Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and vibration, transmitting data via USB or CAN to gateway.

IC Role / Device Role / Timing Role: System-on-chip sensor aggregator with A/D acquisition, temperature compensation via on-chip TEMPSA, and secure data packaging.

Use Value: On-chip 12-bit A/D (0.83 µs conversion) captures fast transients; TSIP-Lite signs sensor payloads; LPT + RTC enable precise sleep/wake scheduling for multi-year battery life.

Secure Embedded Gateway Motor Control Interface Module

Use Scenario: Edge gateway bridging legacy RS-485 fieldbus to USB-hosted SCADA systems, enforcing data integrity and access control.

IC Role / Device Role / Timing Role: Protocol translator with USB host stack, SCI-based Modbus RTU master, and AES-encrypted data buffering.

Use Value: Dual USB/CAN interfaces allow concurrent upstream/downstream connectivity; TSIP-Lite prevents unauthorized firmware reflash; 384 KB flash hosts dual-application firmware images.

Use Scenario: Compact interface module converting PWM commands from motion controller into gate-drive signals for BLDC inverter stages.

IC Role / Device Role / Timing Role: Real-time peripheral coordinator generating complementary PWM (via MTU2a), sampling current feedback (S12AD), and fault monitoring (CMPB).

Use Value: MTU2a's reset-synchronous PWM ensures precise dead-time control; FPU computes Clarke/Park transforms in real time; 54 MHz clock sustains <1 µs loop latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F52317BDND#U0 Same RX231 Group, 384 KB flash, but B-grade security function enabled (TSIP-Lite fully activated) Required where cryptographic key injection, secure boot, or tamper-resistant firmware update is mandated Select R5F52317BDND#U0 if hardware-enforced key isolation and GCM-mode authenticated encryption are mandatory
R5F52318AGND#U0 Higher memory: 512 KB flash, 64 KB SRAM; identical package and peripheral set (no CAN/SDHI) Suitable for applications needing larger bootloader, OTA image storage, or complex protocol stacks (e.g., USB CDC + CAN FD gateway) Choose R5F52318AGND#U0 when code footprint exceeds 384 KB or additional RAM is needed for multi-threaded RTOS operation

Compared with R5F52317AGND#20, R5F52317BDND#U0 adds production-grade security enforcement without changing pinout or power profile, while R5F52318AGND#U0 trades CAN/SDHI capability for doubled flash/SRAM - making each alternative optimal for distinct architectural priorities: security assurance versus memory scalability.

Availability

R5F52317AGND#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, secure embedded gateways, and motor control interface modules requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R5F52317AGND#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX231 Group - to which R5F52317AGND#20 belongs - was designed for high-integrity industrial applications demanding real-time responsiveness, functional safety support (IEC60730), and integrated human-machine interaction capabilities.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F52317AGND#20?

The R5F52317AGND#20 features a 32-bit RXv2 CPU core with a maximum operating frequency of 54 MHz, delivering 88.56 DMIPS. It implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and on-chip FPU compliant with IEEE 754 single-precision standard - enabling deterministic real-time execution for industrial control tasks.

Does the R5F52317AGND#20 support CAN communication, and what is its compliance level?

No, the R5F52317AGND#20 does not include a CAN module. According to Table 1.2 in R01DS0261EJ0120 Rev.1.20, CAN is explicitly marked "Not supported" for all 64-pin RX231 Group variants including R5F52317AGND#20. Engineers requiring CAN must select a 100-pin RX231 part (e.g., R5F52317ADLA#20) or an RX230 Group device.

What package type and pin count does the R5F52317AGND#20 use?

The R5F52317AGND#20 uses a 64-pin HWQFN package designated PWQN0064KC-A: 9 × 9 mm body, 0.5 mm pitch, with exposed thermal pad. This matches the "64-pin HWQFN" entry in Table 1.2 and is confirmed in the Order Part No. suffix "#U0", which denotes QFN packaging per Renesas' part numbering convention.

What is the flash and RAM capacity of the R5F52317AGND#20?

The R5F52317AGND#20 integrates 384 KB of on-chip flash memory for program and data storage, and 32 KB of SRAM with zero-wait-state access at 54 MHz. It also includes 8 KB of data flash rated for 1,000,000 program/erase cycles - suitable for parameter storage and field firmware updates.

Is the R5F52317AGND#20 qualified for extended temperature operation?

Yes, the R5F52317AGND#20 is a G-version device qualified for operation from −40 to +105°C ambient temperature. This is explicitly stated in Table 1.4 ("G Version") of the datasheet and distinguishes it from D-version parts rated only to +85°C - making it suitable for under-hood automotive ancillaries or high-temperature industrial enclosures.

R5F52317AGND#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-WFQFN Exposed Pad
Series:
RX231
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
54MHz
Connectivity:
I2C, IrDA, SCI, SPI, SSI, USB OTG
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F52317AGND#20 FAQ

1.How can I place an order for R5F52317AGND#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F52317AGND#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F52317AGND#20 reliable?

The price and inventory of R5F52317AGND#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F52317AGND#20 is usually 5 days.

3.What payment methods are accepted for R5F52317AGND#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F52317AGND#20 transactions.

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4.How is shipping managed for R5F52317AGND#20?

R5F52317AGND#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F52317AGND#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F52317AGND#20?

For technical support, including R5F52317AGND#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F52317AGND#20 requirements.

6.How does Aetrix verify that R5F52317AGND#20 is sourced from the original manufacturer or authorized distributors?

All R5F52317AGND#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F52317AGND#20 meets industry standards.

7.What is the process for return or replacement of R5F52317AGND#20?

All R5F52317AGND#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F52317AGND#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F52317AGND#20 part is unused and in its original packaging.

Return procedure for R5F52317AGND#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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